Department of Materials Science and Engineering

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  • Conference contribution

    Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA

    Kanai, H., Kariya, Y., Abe, Y., Yokoyama, Y., Ochi, K., Hanada, R. & Izuo, S., 2021 Oct 5, 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., p. 43 1 p. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Shape memory characteristics of Fe-30Mn-5Si-1Al and Fe28Mn-5Si-1 AI-5Cr alloys

    Koyama, M., Murakami, M., Ogawa, K., Kikuchi, T. & Sawaguchi, S., 2008 Dec 1, SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies. p. 653-658 6 p. (SMST-2007 - Proceedings of the International Conference on Shape Memory and Superelastic Technologies).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Study of measuring method for corrosion behavior analysis in low concentration solution

    Yagi, Y., Suzuki, R. & Noda, K., 2016, Corrosion General Poster Session. Buchheit, R. & Virtanen, S. (eds.). 26 ed. Electrochemical Society Inc., p. 7-15 9 p. (ECS Transactions; vol. 75, no. 26).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

    Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 85 1 p. 7947481. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

    Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., p. 86 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • The force relaxation in levitating high Tc superconductor

    Ito, E., Komano, Y., Sawa, K., Murakami, M., Sakai, N. & Hirabayashi, I., 2006 Mar 31, ADVANCES IN CRYOGENIC ENGINEERING: Transactions of the International Cryogenic Materials Conference, ICMC, Volume 52B. p. 820-827 8 p. (AIP Conference Proceedings; vol. 824 II).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • The improvement of shape recovery property through training treatment in an Fe-30Mn-5Si-1Al

    Koyama, M., Sawaguchi, T., Ogawa, K., Kikuchi, T. & Murakami, M., 2009 Dec 1, Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08. p. 583-586 4 p. (Proceedings of the International Conference on Martensitic Transformations, ICOMAT-08).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)
  • Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

    Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999, Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Suga, T., Yoshikawa, H., Umeda, Y., Kimura, F. & Yamamoto, R. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 626-631 6 p. 747688. (Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)
  • Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

    Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)
  • Visco-elastic effect of underfill material in reliability analysis of flip-chip package

    Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010 Jun 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 755-759 5 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)
  • Wet chemical synthesis of Ni-Al nanoparticles at ambient condition

    Fadil, N. A., Govindachetty, S., Yoshikawa, H., Yamashita, Y., Ueda, S., Kobayashi, K., Tanabe, T., Hara, T., Gubbala, V. R., Murakami, H., Noda, K. & Abe, H., 2012 Oct 15, Advanced Materials and Processes II. p. 442-447 6 p. (Advanced Materials Research; vol. 557-559).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution