Shibaura Institute of Technology

Research Output 1970 2020

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Conference contribution
1983

DEVELOPMENT OF POLARIZED ELECTROMAGNET DRIVEN BLOOD PUMP.

Kabei, N., Miyamoto, H., Tsuchiya, K. & Sakurai, Y., 1983, Unknown Host Publication Title. Research Triangle Park, NC, USA: ISA, p. 675-682 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromagnets
Blood
Pumps
1984
1 Citation (Scopus)

CROSS-TALK PREDICTIONS AND REDUCING TECHNIQUES FOR HIGH SPEED GAAS DIGITAL ICS.

Yoshihara, K., Sudo, T., Iida, A., Miyagi, T., Ooe, S. & Saito, T., 1984, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). New York, NY, USA: IEEE, p. 23-26 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Noise abatement
Integrated circuits
Electric lines
Permittivity
Substrates
2 Citations (Scopus)

EFFECTS OF IMPURITY COMPENSATION ON I-V CHARACTERISTICS OF N-I-N STRUCTURES AND BACKGATING IN GAAS INTEGRATED CIRCUITS.

Horio, K., Ikoma, T. & Yanai, H., 1984, Unknown Host Publication Title. Look, D. C. & Blakemore, J. S. (eds.). Shiva Publ Ltd, Nantwich, Engl Also, p. 354-363 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Integrated circuits
Impurities
Electric potential
Analytical models
Compensation and Redress

PACKAGING TECHNOLOGY FOR HIGH SPEED LOGIC DEVICES.

Sudo, T., Iida, A., Yoshihara, K., Miyagi, T. & Saito, T., 1984, Unknown Host Publication Title. New York, NY, USA: IEEE, p. 160-164 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Logic devices
Packaging
Electric wiring
Substrates
Crosstalk
1987
4 Citations (Scopus)

Numerical modeling of energy transport effects in AlGaAs/GaAs heterojunction bipolar transistors.

Horio, K. & Yanai, H., 1987, NASECODE V Proc Fifth Int Conf Numer Anal Semicond Devices Integr Circuit. Miller, J. J. H. (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 231-236 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heterojunction bipolar transistors
Electrons
Boltzmann equation
Cutoff frequency
Numerical models
1 Citation (Scopus)

Numerical simulation of GaAs MESFET's with heavily compensated substrates.

Horio, K., Yanai, H. & Ikoma, T., 1987, NASECODE V Proc Fifth Int Conf Numer Anal Semicond Devices Integr Circuit. Miller, J. J. H. (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 237-242 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Computer simulation
MESFET devices
Substrates
Impurities
Drain current
1989
5 Citations (Scopus)

Considerations on package design for high speed and high pin count CMOS devices

Sudo, T., Mori, T. & Yoshimori, T., 1989, Proceedings - Electronic Components and Technology Conference. Anon (ed.). Publ by IEEE, p. 531-538 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric lines
Packaging
Capacitance
9 Citations (Scopus)

Electrical properties of a multilayer thin film substrate for multichip packages

Shimada, O., Ito, K., Miyagi, T., Kimijima, S. & Sudo, T., 1989, Sixth IEEE CHMT Int Electron Manuf Technol Symp. Anon (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 121-127 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multilayer films
Electric properties
Crosstalk
Thin films
Substrates
1990

GaAs high-speed data transfer network for a parallel processing system

Kitaura, Y., Kameyama, A., Terada, T., Uchitomi, N., Miyagi, T., Sudo, T. & Maeda, A., 1990 Oct, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). Piscataway, NJ, United States: Publ by IEEE, p. 195-198 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Data transfer
Parallel processing systems
Multichip modules
2 Citations (Scopus)

GaAs multichip module for a parallel processing system

Miyagi, T., Itoh, K., Kimijima, S. & Sudo, T., 1990, Proceedings - Electronic Components and Technology Conference. Publ by IEEE, Vol. 1. p. 580-585 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Data transfer
Parallel processing systems
Data transfer rates
Thin films
3 Citations (Scopus)

Study on collector design of AlGaAs/GaAs heterojunction bipolar transistors by two-dimensional simulation

Horio, K., Iwatsu, Y., Oguchi, A. & Yanai, H., 1990, Proc 90 Bipolar Circ Technol Meet. Piscataway, NJ, United States: Publ by IEEE, p. 195-198 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heterojunction bipolar transistors
Cutoff frequency
Doping (additives)
1991

Lossy transmission line effects in a thin-film multichip module

Sudo, T., 1991, Proceedings - IEEE International Symposium on Circuits and Systems. Publ by IEEE, Vol. 4. p. 2304-2307 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Electric lines
Thin films
SPICE
Energy dissipation
1992
4 Citations (Scopus)

1/4 miniaturized passive elements for GaAs MMICs

Hirano, M., Imai, Y. & Asai, K., 1992 Jan, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). Piscataway, NJ, United States: Publ by IEEE, p. 37-40 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Monolithic microwave integrated circuits
Capacitors
Monolayers
Wire
Electrodes
1 Citation (Scopus)

Design optimization of wiring substrate in a CMOS-based multichip module

Sudo, T., Hirano, N., Kato, K., Hiruta, Y. & Fuchida, Y., 1992 Jan, Proceedings - Electronic Components Conference. Piscataway, NJ, United States: Publ by IEEE, p. 710-716 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Electric wiring
Damping
Thin films
Substrates
2 Citations (Scopus)

Multichip module technology using AlN substrate for 2-Gbit/s high-speed switching module

Iseki, Y., Shimizu, F. & Sudo, T., 1992 Jan, Proceedings - Electronic Components Conference. Piscataway, NJ, United States: Publ by IEEE, p. 973-978 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Aluminum nitride
Substrates
Strip telecommunication lines
Thin films

Simulations of trapping effects in GaAs MESFETs and requirements for substrates in MESFET-ICs

Horio, K. & Fuseya, Y., 1992 Jan 1, GaAs IC Symposium Technical Digest 1992. Institute of Electrical and Electronics Engineers Inc., p. 241-244 4 p. 247266. (GaAs IC Symposium Technical Digest 1992).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Drain current
Buffer layers
field effect transistors
trapping
requirements
1993
1 Citation (Scopus)

820 pin PGA for ultra large-scale BiCMOS devices

Hiruta, Y., Hirano, N., Itoh, K., Kato, K., Yamaji, Y., Motoyama, Y., Ohno, J., Homma, R., Kojima, S. & Sudo, T., 1993, Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States: Publ by IEEE, p. 396-404 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heat resistance
Heat sinks
Air
Transistor transistor logic circuits
Spreaders
22 Citations (Scopus)

Obstacle detection by vision system for an autonomous vehicle

Zhao, G. W. & Yuta, S., 1993 Jan 1, Proceedings of the Intelligent Vehicles 1993 Symposium, IV 1993. Institute of Electrical and Electronics Engineers Inc., p. 31-36 6 p. 697293. (IEEE Intelligent Vehicles Symposium, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cameras
Automobiles
Calibration
17 Citations (Scopus)

Package deformation and cracking mechanism due to reflow soldering

Sawada, K., Nakazawa, T., Kawamura, N. & Sudo, T., 1993, IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Piscataway, NJ, United States: Publ by IEEE, p. 295-298 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering
Plastics
Semiconductor devices
Materials properties
Atmospheric humidity
1 Citation (Scopus)

RISC-based multichip modules for workstation performance comparison among types of MCMs

Okada, T., Hayashida, H., Yamaji, J., Watanabe, S., Sudo, T. & Hitosugi, M., 1993, Proceedings of SPIE - The International Society for Optical Engineering. Anon (ed.). Bellingham, WA, United States: Publ by Society of Photo-Optical Instrumentation Engineers, Vol. 1986. p. 230-237 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Reduced instruction set computing
Computer workstations
workstations
Multicarrier modulation
1994

1.6 μm band coherent optical time-domain reflectometry

Sato, T., Horiguchi, T. & Koyamada, Y., 1994 Jan 1, Conference Proceedings - 10th Anniv., IMTC 1994: Advanced Technologies in I and M. 1994 IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 102-105 4 p. 352116. (Conference Proceedings - 10th Anniv., IMTC 1994: Advanced Technologies in I and M. 1994 IEEE Instrumentation and Measurement Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fiber amplifiers
light amplifiers
dynamic range
spatial resolution
fibers
15 Citations (Scopus)

Characterization and reduction of simultaneous switching noise for a multilayer package

Hirano, N., Miura, M., Hiruta, Y. & Sudo, T., 1994, Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States: Publ by IEEE, p. 949-956 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multilayers
Inductance
Circuit simulation
Electric currents
Electromagnetic fields
1 Citation (Scopus)

Characterization of net configurations for multichip modules

Okada, T. & Sudo, T., 1994, Proceedings of the 1994 IEEE Multi-Chip Module Conference. Anon (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 32-37 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Multicarrier modulation
Time domain analysis
SPICE
Electric lines
2 Citations (Scopus)

Present and future directions for multichip module technologies

Sudo, T., 1994, IEEE Symposium on VLSI Circuits, Digest of Technical Papers. Piscataway, NJ, United States: IEEE, p. 51-54 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Multicarrier modulation
5 Citations (Scopus)

Robotic task and system design for task directed robotics case study: deburring task

Mizukawa, M., Mitsuya, E., Ohara, S., Iwaki, S., Matsuo, S., Shakunaga, T. & Okada, T., 1994, IEEE/RSJ/GI International Conference on Intelligent Robots and Systems. Piscataway, NJ, United States: IEEE, Vol. 2. p. 949-956 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deburring
Robotics
Systems analysis
Computer simulation
16 Citations (Scopus)

Simplified and practical estimation of package cracking during reflow soldering process

Sawada, K., Nakazawa, T., Kawamura, N., Matsumoto, K., Hiruta, Y. & Sudo, T., 1994, Annual Proceedings - Reliability Physics (Symposium). Piscataway, NJ, United States: Publ by IEEE, p. 114-119 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering
Fick's laws
Time measurement
Delamination
Stress intensity factors
1995

Development of crack-free plastic package - evaluation of high reliability of CSS (Chip Side Support) structure

Inoue, Y., Nakazawa, T., Sawada, K. & Sudo, T., 1995, Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States: IEEE, p. 407-410 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bond strength (materials)
Soldering
Atmospheric humidity
Plastics
Cracks
10 Citations (Scopus)

Electrical characterization and modeling of simultaneous switching noise for leadframe packages

Miura, M., Hirano, N., Hiruta, Y. & Sudo, T., 1995, Proceedings - Electronic Components and Technology Conference. IEEE, p. 857-864 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Inductance
Copper alloys
Copper
Experiments
2 Citations (Scopus)

Experimental characterization of simultaneous switching noise for multichip module

Ito, K., Kato, K., Hirano, N. & Sudo, T., 1995, Proceedings of the IEEE Multi-Chip Module Conference. Los Alamitos, CA, United States: IEEE, p. 217-220 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Multicarrier modulation

Loading type dependence of fracture mode of a mixed-mode crack

Utsunomiya, T. & Watanabe, K., 1995, American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. ASME, Vol. 304. p. 227-233 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cracks
Plastic deformation
Shearing
Stress intensity factors
Crack tips
1 Citation (Scopus)

New bonding mechanism of 50 μm pitch TAB-ILB with 0.25 μm Sn plated Cu lead

Hosomi, E., Takubo, C., Tazawa, H., Shibasaki, K., Hiruta, Y. & Sudo, T., 1995, Proceedings - Electronic Components and Technology Conference. IEEE, p. 851-856 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tapes
Lead
Metallurgy
Plating
Metal foil

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Nakazawa, T., Inoue, Y., Sawada, K. & Sudo, T., 1995, Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium. Piscataway, NJ, United States: IEEE, p. 310-317 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering
Shear stress
Plastics
Cracks
Bond strength (materials)
2 Citations (Scopus)

Physical mechanism of performance instabilities such as kink phenomena and related backgating effect in GaAs MESFETs

Horio, K., Usami, K. & Satoh, K., 1995, Annual Proceedings - Reliability Physics (Symposium). IEEE, p. 212-216 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impact ionization
Substrates
3 Citations (Scopus)

Study of A disk MHD generator for nonequilibrium plasma generator (NPG) system

Harada, N. & Tsunoda, K., 1995, 26th Plasmadynamics and Lasers Conference. American Institute of Aeronautics and Astronautics Inc, AIAA, AIAA 95-1936

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Magnetohydrodynamic converters
Plasmas
Enthalpy
Demonstrations
Plasma stability
1 Citation (Scopus)

System structure and description for tool manipulation

Matsuo, S., Shimokura, K. I., Kubota, Y., Mitsuya, E. & Mizukawa, M., 1995, IEEE International Conference on Intelligent Robots and Systems. Anon (ed.). Piscataway, NJ, United States: IEEE, Vol. 1. p. 305-309 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deburring
Robotics
Robots
Controllers
Experiments
6 Citations (Scopus)

Turbulent near wake behind square cylinder of finite length on ground plane

Okamoto, S., Tsunoda, K., Takagi, T., Okada, E. & Kitani, K., 1995, American Society of Mechanical Engineers, Fluids Engineering Division (Publication) FED. Huang, T. T., Turner, J., Kawahashi, M. & Otugen, M. V. (eds.). New York, NY, United States: ASME, Vol. 229. p. 195-216 22 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vortex flow
Arches
Aspect ratio
Laser Doppler velocimeters
Vortex shedding

Two-dimensional simulation of kink-related backgating effect in GaAs MESFET's

Horio, K. & Usami, K., 1995, IEEE Region 10 Annual International Conference, Proceedings/TENCON. Piscataway, NJ, United States: IEEE, p. 115-118 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impact ionization
Substrates
Experiments
1996

Airflow Design in a Staircase to Modify it for a Clean Zone

Suwa, Y., Takita, H. & Ozaki, A., 1996 Jul, The 7th.Int.Conf. on Indoor Air Quality and Climate, INDOOR AIR. Vol. 4. p. 133-137

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Analysis of surface-related deep-trap effects on gate-lag phenomena in GaAs MESFETs

Horio, K. & Yamada, T., 1996, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). Anon (ed.). Piscataway, NJ, United States: IEEE, p. 175-178 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Surface states
Electron traps
2 Citations (Scopus)

EFfects of semi-insulating substrate on kink phenomena in GaAs MESFETs

Horio, K. & Satoh, K., 1996, IEEE Semiconducting and Semi-Insulating Materials Conference, SIMC. Anon (ed.). Piscataway, NJ, United States: IEEE, p. 353-356 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Substrates
Impact ionization
2 Citations (Scopus)

Measuring method of three-dimensional position and orientation of a moving object for medical robots

Uchida, T., Koyama, H., Komeda, T., Miyagi, M. & Funakubo, H., 1996, Proceedings of the IEEE International Conference on Systems, Man and Cybernetics. Anon (ed.). IEEE, Vol. 2. p. 887-892 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Robots
Optical systems
Cameras
7 Citations (Scopus)

Mobile robot system to aid the daily life for bedridden persons

Komeda, T., Matsuoka, H., Ogawa, Y., Fujii, M., Uchida, T., Miyagi, M., Koyama, H. & Funakubo, H., 1996, Proceedings of the IEEE International Conference on Systems, Man and Cybernetics. Anon (ed.). IEEE, Vol. 4. p. 2789-2792 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mobile robots
Manipulators
Information systems
Cameras
Sensors
2 Citations (Scopus)

Multimedia communication pendant for robotic task teaching by sharing information

Mizukawa, M., Nakamura, Y. & Kanayama, K., 1996, Proceedings of the Japan/USA Symposium on Flexible Automation. Stelson, K. & Oba, F. (eds.). Vol. 1. p. 483-490 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Teaching
Robotics
Robots
Communication
Sensors
5 Citations (Scopus)

Multimedia communication pendant for sensor-based robotic task teaching by sharing information: concepts and evaluations

Nakamura, Y., Mizukawa, M. & Kanayama, K., 1996, IEEE International Conference on Intelligent Robots and Systems. Anon (ed.). Piscataway, NJ, United States: IEEE, Vol. 3. p. 1417-1424 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Teaching
Robotics
Robots
Communication
Sensors
6 Citations (Scopus)

Qualification of skin aging by three-dimensional measurement of skin surface contour

Uchida, T., Komeda, T., Miyagi, M., Koyama, H. & Funakubo, H., 1996, Proceedings of the IEEE International Conference on Systems, Man and Cybernetics. IEEE, Vol. 1. p. 450-455 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Skin
Aging of materials
Fourier transforms
1997
1 Citation (Scopus)

Analysis of surface and substrate deep-trap effects on gate-lag phenomena in GaAs MESFETs

Horio, K., Yamada, T. & Wakabayashi, A., 1997, GaAs Reliability Workshop, Proceedings. Piscataway, NJ, United States: IEEE, p. 101-103 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

time lag
field effect transistors
traps
Hole traps
Surface states
8 Citations (Scopus)

Development of a selectable teleoperated robot system using RSNP

Ishida, S., Ogiya, H. & Matsuhira, N., 1997 Mar 9, 2014 11th International Conference on Ubiquitous Robots and Ambient Intelligence, URAI 2014. Institute of Electrical and Electronics Engineers Inc., p. 500-503 4 p. 7057469

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Robots
Network protocols
Graphical user interfaces
Computer systems
Experiments

Multi-channel chemical sensor using surface acoustic wave device

Nomura, T., Saitoh, A. & Furukawa, S., 1997, Proceedings of the IEEE Ultrasonics Symposium. Schneider, S. C., Levy, M. & McAvoy, B. R. (eds.). IEEE, Vol. 1. p. 423-426 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Acoustic surface wave devices
Chemical sensors
Sensors
Electric delay lines
Substrates

Path planning by analogy

Ogata, H. & Mizukawa, M., 1997, Proceedings - IEEE International Conference on Robotics and Automation. IEEE, Vol. 2. p. 1436-1441 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Motion planning
Trajectories
Teaching
Robots
Costs
3 Citations (Scopus)

Robot task design and management system for industrial applications

Kanayama, K., Mizukawa, M., Iwaki, S., Matsuo, S., Okada, T. & Nakamura, Y., 1997, International Conference on Advanced Robotics, Proceedings, ICAR. Piscataway, NJ, United States: IEEE, p. 687-692 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Industrial applications
Robots
Sensors
Graphical user interfaces
Teaching