Shibaura Institute of Technology

Research Output 1970 2020

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Conference contribution
1994
5 Citations (Scopus)

Robotic task and system design for task directed robotics case study: deburring task

Mizukawa, M., Mitsuya, E., Ohara, S., Iwaki, S., Matsuo, S., Shakunaga, T. & Okada, T., 1994, IEEE/RSJ/GI International Conference on Intelligent Robots and Systems. Piscataway, NJ, United States: IEEE, Vol. 2. p. 949-956 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deburring
Robotics
Systems analysis
Computer simulation
16 Citations (Scopus)

Simplified and practical estimation of package cracking during reflow soldering process

Sawada, K., Nakazawa, T., Kawamura, N., Matsumoto, K., Hiruta, Y. & Sudo, T., 1994, Annual Proceedings - Reliability Physics (Symposium). Piscataway, NJ, United States: Publ by IEEE, p. 114-119 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering
Fick's laws
Time measurement
Delamination
Stress intensity factors
1993
1 Citation (Scopus)

820 pin PGA for ultra large-scale BiCMOS devices

Hiruta, Y., Hirano, N., Itoh, K., Kato, K., Yamaji, Y., Motoyama, Y., Ohno, J., Homma, R., Kojima, S. & Sudo, T., 1993, Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States: Publ by IEEE, p. 396-404 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heat resistance
Heat sinks
Air
Transistor transistor logic circuits
Spreaders
22 Citations (Scopus)

Obstacle detection by vision system for an autonomous vehicle

Zhao, G. W. & Yuta, S., 1993 Jan 1, Proceedings of the Intelligent Vehicles 1993 Symposium, IV 1993. Institute of Electrical and Electronics Engineers Inc., p. 31-36 6 p. 697293. (IEEE Intelligent Vehicles Symposium, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cameras
Automobiles
Calibration
17 Citations (Scopus)

Package deformation and cracking mechanism due to reflow soldering

Sawada, K., Nakazawa, T., Kawamura, N. & Sudo, T., 1993, IEEE/CHMT European International Electronic Manufacturing Technology Symposium. Piscataway, NJ, United States: Publ by IEEE, p. 295-298 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering
Plastics
Semiconductor devices
Materials properties
Atmospheric humidity
1 Citation (Scopus)

RISC-based multichip modules for workstation performance comparison among types of MCMs

Okada, T., Hayashida, H., Yamaji, J., Watanabe, S., Sudo, T. & Hitosugi, M., 1993, Proceedings of SPIE - The International Society for Optical Engineering. Anon (ed.). Bellingham, WA, United States: Publ by Society of Photo-Optical Instrumentation Engineers, Vol. 1986. p. 230-237 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Reduced instruction set computing
Computer workstations
workstations
Multicarrier modulation
1992
4 Citations (Scopus)

1/4 miniaturized passive elements for GaAs MMICs

Hirano, M., Imai, Y. & Asai, K., 1992 Jan, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). Piscataway, NJ, United States: Publ by IEEE, p. 37-40 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Monolithic microwave integrated circuits
Capacitors
Monolayers
Wire
Electrodes
1 Citation (Scopus)

Design optimization of wiring substrate in a CMOS-based multichip module

Sudo, T., Hirano, N., Kato, K., Hiruta, Y. & Fuchida, Y., 1992 Jan, Proceedings - Electronic Components Conference. Piscataway, NJ, United States: Publ by IEEE, p. 710-716 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Electric wiring
Damping
Thin films
Substrates
2 Citations (Scopus)

Multichip module technology using AlN substrate for 2-Gbit/s high-speed switching module

Iseki, Y., Shimizu, F. & Sudo, T., 1992 Jan, Proceedings - Electronic Components Conference. Piscataway, NJ, United States: Publ by IEEE, p. 973-978 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Aluminum nitride
Substrates
Strip telecommunication lines
Thin films

Simulations of trapping effects in GaAs MESFETs and requirements for substrates in MESFET-ICs

Horio, K. & Fuseya, Y., 1992 Jan 1, GaAs IC Symposium Technical Digest 1992. Institute of Electrical and Electronics Engineers Inc., p. 241-244 4 p. 247266. (GaAs IC Symposium Technical Digest 1992).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Drain current
Buffer layers
field effect transistors
trapping
requirements
1991

Lossy transmission line effects in a thin-film multichip module

Sudo, T., 1991, Proceedings - IEEE International Symposium on Circuits and Systems. Publ by IEEE, Vol. 4. p. 2304-2307 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Electric lines
Thin films
SPICE
Energy dissipation
1990

GaAs high-speed data transfer network for a parallel processing system

Kitaura, Y., Kameyama, A., Terada, T., Uchitomi, N., Miyagi, T., Sudo, T. & Maeda, A., 1990 Oct, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). Piscataway, NJ, United States: Publ by IEEE, p. 195-198 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Data transfer
Parallel processing systems
Multichip modules
2 Citations (Scopus)

GaAs multichip module for a parallel processing system

Miyagi, T., Itoh, K., Kimijima, S. & Sudo, T., 1990, Proceedings - Electronic Components and Technology Conference. Publ by IEEE, Vol. 1. p. 580-585 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multichip modules
Data transfer
Parallel processing systems
Data transfer rates
Thin films
3 Citations (Scopus)

Study on collector design of AlGaAs/GaAs heterojunction bipolar transistors by two-dimensional simulation

Horio, K., Iwatsu, Y., Oguchi, A. & Yanai, H., 1990, Proc 90 Bipolar Circ Technol Meet. Piscataway, NJ, United States: Publ by IEEE, p. 195-198 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heterojunction bipolar transistors
Cutoff frequency
Doping (additives)
1989
5 Citations (Scopus)

Considerations on package design for high speed and high pin count CMOS devices

Sudo, T., Mori, T. & Yoshimori, T., 1989, Proceedings - Electronic Components and Technology Conference. Anon (ed.). Publ by IEEE, p. 531-538 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric lines
Packaging
Capacitance
9 Citations (Scopus)

Electrical properties of a multilayer thin film substrate for multichip packages

Shimada, O., Ito, K., Miyagi, T., Kimijima, S. & Sudo, T., 1989, Sixth IEEE CHMT Int Electron Manuf Technol Symp. Anon (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 121-127 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multilayer films
Electric properties
Crosstalk
Thin films
Substrates
1987
4 Citations (Scopus)

Numerical modeling of energy transport effects in AlGaAs/GaAs heterojunction bipolar transistors.

Horio, K. & Yanai, H., 1987, NASECODE V Proc Fifth Int Conf Numer Anal Semicond Devices Integr Circuit. Miller, J. J. H. (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 231-236 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Heterojunction bipolar transistors
Electrons
Boltzmann equation
Cutoff frequency
Numerical models
1 Citation (Scopus)

Numerical simulation of GaAs MESFET's with heavily compensated substrates.

Horio, K., Yanai, H. & Ikoma, T., 1987, NASECODE V Proc Fifth Int Conf Numer Anal Semicond Devices Integr Circuit. Miller, J. J. H. (ed.). Piscataway, NJ, United States: Publ by IEEE, p. 237-242 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Computer simulation
MESFET devices
Substrates
Impurities
Drain current
1984
1 Citation (Scopus)

CROSS-TALK PREDICTIONS AND REDUCING TECHNIQUES FOR HIGH SPEED GAAS DIGITAL ICS.

Yoshihara, K., Sudo, T., Iida, A., Miyagi, T., Ooe, S. & Saito, T., 1984, Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit). New York, NY, USA: IEEE, p. 23-26 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Noise abatement
Integrated circuits
Electric lines
Permittivity
Substrates
2 Citations (Scopus)

EFFECTS OF IMPURITY COMPENSATION ON I-V CHARACTERISTICS OF N-I-N STRUCTURES AND BACKGATING IN GAAS INTEGRATED CIRCUITS.

Horio, K., Ikoma, T. & Yanai, H., 1984, Unknown Host Publication Title. Look, D. C. & Blakemore, J. S. (eds.). Shiva Publ Ltd, Nantwich, Engl Also, p. 354-363 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Integrated circuits
Impurities
Electric potential
Analytical models
Compensation and Redress

PACKAGING TECHNOLOGY FOR HIGH SPEED LOGIC DEVICES.

Sudo, T., Iida, A., Yoshihara, K., Miyagi, T. & Saito, T., 1984, Unknown Host Publication Title. New York, NY, USA: IEEE, p. 160-164 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Logic devices
Packaging
Electric wiring
Substrates
Crosstalk
1983

DEVELOPMENT OF POLARIZED ELECTROMAGNET DRIVEN BLOOD PUMP.

Kabei, N., Miyamoto, H., Tsuchiya, K. & Sakurai, Y., 1983, Unknown Host Publication Title. Research Triangle Park, NC, USA: ISA, p. 675-682 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electromagnets
Blood
Pumps