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Research Output

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Paper
2005

Interferometric optical isolator with Si gudiing layer operated in unidirectional magnetic field

Yokoi, H., 2005 Dec 1, p. 450-457. 8 p.

Research output: Contribution to conferencePaper

2003

TE-TM Mode conversion optical isolator fabricated by wafer bonding

Yokoi, H., Mizumoto, T. & Iwasaki, H., 2003 Dec 1, p. 130-136. 7 p.

Research output: Contribution to conferencePaper

2000

Integration of terraced laser diode and optical isolator by wafer direct bonding

Yokoi, H. & Mizumoto, T., 2000 Jan 1. 1 p.

Research output: Contribution to conferencePaper

1998

Low temperature wafer direct bonding between GaInAsP etch stop layer and Gd3Ga5O12

Yokoi, H. & Mizumoto, T., 1998 Jan 1. 1 p.

Research output: Contribution to conferencePaper

Wafer surface treatment for integrating laser diode and optical isolator by direct bonding

Mizumoto, T., Yokoi, H., Shimizu, M., Waniishi, T., Futakuchi, N., Kaida, N. & Nakano, Y., 1998 Jan 1, p. 1662-1664. 3 p.

Research output: Contribution to conferencePaper

1996

Direct bonding between laser wafers and magneto-optic waveguides

Yokoi, H., Mizumoto, T., Maru, K. & Naito, Y., 1996 Jan 1. 1 p.

Research output: Contribution to conferencePaper