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Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

Electromigration Engineering & Materials Science
Graphene Engineering & Materials Science
Copper Engineering & Materials Science
Multilayers Engineering & Materials Science
graphene Physics & Astronomy
Chemical vapor deposition Engineering & Materials Science
Metals Engineering & Materials Science
electromigration Physics & Astronomy

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Research Output 1985 2019

  • 826 Citations
  • 17 h-Index
  • 91 Article
  • 25 Conference contribution
  • 1 Chapter

A novel graphene barrier against moisture by multiple stacking large-grain graphene

Gomasang, P., Kawahara, K., Yasuraoka, K., Maruyama, M., Ago, H., Okada, S. & Ueno, K., 2019 Dec 1, In : Scientific Reports. 9, 1, 3777.

Research output: Contribution to journalArticle

Open Access
1 Citation (Scopus)

Moisture barrier properties of single-layer graphene deposited on Cu films for Cu metallization

Gomasang, P., Abe, T., Kawahara, K., Wasai, Y., Nabatova-Gabain, N., Cuong, N. T., Ago, H., Okada, S. & Ueno, K., 2018 Apr 1, In : Japanese Journal of Applied Physics. 57, 4, 04FC08.

Research output: Contribution to journalArticle

Metallizing
moisture
Graphene
graphene
Moisture
9 Citations (Scopus)

On-chip intercalated-graphene inductors for next-generation radio frequency electronics

Kang, J., Matsumoto, Y., Li, X., Jiang, J., Xie, X., Kawamoto, K., Kenmoku, M., Chu, J. H., Liu, W., Mao, J., Ueno, K. & Banerjee, K., 2018 Jan 1, In : Nature Electronics. 1, 1, p. 46-51 6 p.

Research output: Contribution to journalArticle

Graphite
inductors
Inductance
Graphene
radio frequencies

Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Gomasang, P., Ogiue, S., Ueno, K. & Yokogawa, S., 2018 Aug 8, 2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc., p. 112-114 3 p. 8430461

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Copper
Atmospheric humidity
Oxidation
Sheet resistance
Film thickness

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M. & Ueno, K., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-June. p. 270-272 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flat cables
Electromigration
Plating
Soldering alloys
Copper