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Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

Electromigration Engineering & Materials Science
Graphene Engineering & Materials Science
Copper Engineering & Materials Science
Multilayers Engineering & Materials Science
Chemical vapor deposition Engineering & Materials Science
graphene Physics & Astronomy
electromigration Physics & Astronomy
Metals Engineering & Materials Science

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Research Output 1985 2018

  • 780 Citations
  • 16 h-Index
  • 89 Article
  • 25 Conference contribution
  • 1 Chapter

Moisture barrier properties of single-layer graphene deposited on Cu films for Cu metallization

Gomasang, P., Abe, T., Kawahara, K., Wasai, Y., Nabatova-Gabain, N., Cuong, N. T., Ago, H., Okada, S. & Ueno, K., 2018 Apr 1, In : Japanese Journal of Applied Physics. 57, 4, 04FC08

Research output: Contribution to journalArticle

Metallizing
moisture
Graphene
graphene
Moisture

Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Gomasang, P., Ogiue, S., Ueno, K. & Yokogawa, S., 2018 Aug 8, 2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc., p. 112-114 3 p. 8430461

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Atmospheric humidity
Copper
Oxidation
Sheet resistance
Film thickness

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M. & Ueno, K., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-June, p. 270-272 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flat cables
Electron devices
Electromigration
Soldering
Plating

Current enhanced solid phase precipitation (CE-SPP) for direct deposition of multilayer graphene on SiO2 from a Cu capped Co-C layer

Ichikawa, H. & Ueno, K., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 244-246 3 p. 7947583

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphene
Multilayers
1 Citations
Schottky diodes
Graphene
solid phases
graphene
Multilayers