Engineering & Materials Science
Graphene
100%
Multilayers
64%
Copper
56%
Chemical vapor deposition
52%
Electromigration
52%
Catalysts
38%
Doping (additives)
38%
Metals
35%
Metallizing
27%
Nanocarbon
27%
Temperature
26%
Sheet resistance
26%
Intercalation
26%
Crystallinity
25%
Cobalt
25%
Fabrication
24%
Diffusion barriers
22%
Annealing
22%
Grain growth
22%
Plasmas
21%
Atmospheric humidity
18%
Electric breakdown
17%
Cleaning
16%
Electric wiring
15%
Etching
14%
Amorphous carbon
14%
Nitrogen
13%
Oxidation
12%
Electroless plating
12%
Plasma enhanced chemical vapor deposition
12%
Thermodynamic stability
12%
Self assembled monolayers
11%
Graphite
11%
Moisture
11%
Seed
11%
Passivation
10%
Sputtering
10%
X ray photoelectron spectroscopy
10%
Degradation
9%
Field effect transistors
9%
Oxygen
8%
Thermal stress
8%
Joule heating
8%
Substrates
8%
Masks
8%
Raman scattering
8%
Inductance
8%
Bromine
8%
Diodes
8%
Monolayers
7%
Physics & Astronomy
graphene
61%
copper
38%
vapor deposition
27%
catalysts
27%
electromigration
26%
low resistance
26%
solid phases
24%
life (durability)
23%
metals
18%
cobalt
18%
intercalation
17%
plugs
17%
humidity
16%
barrier layers
15%
crystallinity
14%
moisture
13%
wiring
13%
cleaning
13%
carbon
12%
temperature
11%
annealing
11%
electric contacts
10%
etching
10%
fabrication
10%
nitrogen
10%
breakdown
9%
thermal stresses
9%
Schottky diodes
9%
augmentation
8%
degradation
8%
pyrolytic graphite
8%
seeds
8%
CMOS
7%
electroless deposition
7%
masks
7%
chips
6%
field effect transistors
6%
thermal stability
6%
aluminum
6%
textures
6%
bromine
6%
synthesis
6%
sputtering
6%
oxygen plasma
6%
large scale integration
5%
dummies
5%
hydrogen plasma
5%
integrity
5%
thin films
5%
agglomeration
5%
Chemical Compounds
Graphene
18%
Liquid Film
17%
Sheet Resistance
17%
Multilayer
17%
Diffusion Barrier
13%
Inductance
12%
Resistance
11%
Catalyst
10%
Inductor
9%
Contact Resistance
9%
Etching
8%
Intercalation Compound
7%
Refractory Metal
7%
Self Assembled Monolayer
7%
Surface
6%
Grain Growth
6%
Application
6%
Graphite
6%
Plasma
5%
Dielectric Material
5%
Crystallinity
5%
Ion Implantation
5%
Metal
5%
Polishing
5%