Engineering & Materials Science
Amorphous carbon
14%
Annealing
22%
Atmospheric humidity
18%
Bromine
8%
Catalysts
38%
Chemical vapor deposition
52%
Cleaning
16%
Cobalt
25%
Copper
56%
Crystallinity
25%
Degradation
9%
Diffusion barriers
22%
Diodes
8%
Doping (additives)
38%
Electric breakdown
17%
Electric wiring
15%
Electroless plating
12%
Electromigration
52%
Etching
14%
Fabrication
24%
Field effect transistors
9%
Grain growth
22%
Graphene
100%
Graphite
11%
Inductance
8%
Intercalation
26%
Joule heating
8%
Masks
8%
Metallizing
27%
Metals
35%
Moisture
11%
Monolayers
7%
Multilayers
64%
Nanocarbon
27%
Nitrogen
13%
Oxidation
12%
Oxygen
8%
Passivation
10%
Plasma enhanced chemical vapor deposition
12%
Plasmas
21%
Raman scattering
8%
Seed
11%
Self assembled monolayers
11%
Sheet resistance
26%
Sputtering
10%
Substrates
8%
Temperature
26%
Thermal stress
8%
Thermodynamic stability
12%
X ray photoelectron spectroscopy
10%
Physics & Astronomy
agglomeration
5%
aluminum
6%
annealing
11%
augmentation
8%
barrier layers
15%
breakdown
9%
bromine
6%
carbon
12%
catalysts
27%
chips
6%
cleaning
13%
CMOS
7%
cobalt
18%
copper
38%
crystallinity
14%
degradation
8%
dummies
5%
electric contacts
10%
electroless deposition
7%
electromigration
26%
etching
10%
fabrication
10%
field effect transistors
6%
graphene
61%
humidity
16%
hydrogen plasma
5%
integrity
5%
intercalation
17%
large scale integration
5%
life (durability)
23%
low resistance
26%
masks
7%
metals
18%
moisture
13%
nitrogen
10%
oxygen plasma
6%
plugs
17%
pyrolytic graphite
8%
Schottky diodes
9%
seeds
8%
solid phases
24%
sputtering
6%
synthesis
6%
temperature
11%
textures
6%
thermal stability
6%
thermal stresses
9%
thin films
5%
vapor deposition
27%
wiring
13%
Chemical Compounds
Application
6%
Catalyst
10%
Contact Resistance
9%
Crystallinity
5%
Dielectric Material
5%
Diffusion Barrier
13%
Etching
8%
Grain Growth
6%
Graphene
18%
Graphite
6%
Inductance
12%
Inductor
9%
Intercalation Compound
7%
Ion Implantation
5%
Liquid Film
17%
Metal
5%
Multilayer
17%
Plasma
5%
Polishing
5%
Refractory Metal
7%
Resistance
11%
Self Assembled Monolayer
7%
Sheet Resistance
17%
Surface
6%