If you made any changes in Pure these will be visible here soon.

Research Output 1985 2019

  • 865 Citations
  • 17 h-Index
  • 94 Article
  • 29 Conference contribution
  • 1 Chapter
  • 1 Editorial
2019

A novel graphene barrier against moisture by multiple stacking large-grain graphene

Gomasang, P., Kawahara, K., Yasuraoka, K., Maruyama, M., Ago, H., Okada, S. & Ueno, K., 2019 Dec 1, In : Scientific Reports. 9, 1, 3777.

Research output: Contribution to journalArticle

Open Access
Graphene
solid phases
Cobalt
graphene
Multilayers

High crystallinity multilayer graphene deposited by a low-temperature CVD using Ni catalyst with applying current

Akimoto, T. & Ueno, K., 2019 Mar 1, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., p. 351-353 3 p. 8731128. (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphite
Graphene
Chemical vapor deposition
crystallinity
graphene

Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations

Gomasang, P., Ogiue, S., Yokogawa, S. & Ueno, K., 2019 Jan 1, In : Japanese Journal of Applied Physics. 58, SBBC01.

Research output: Contribution to journalArticle

Open Access
Metallizing
moisture
humidity
Atmospheric humidity
Moisture

Simultaneous doping / etching (SDE) process of multilayer graphene on Ni for low resistance metallization

Yokosawa, K., Akimoto, T., Okada, Y. & Ueno, K., 2019 Mar 1, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., p. 47-49 3 p. 8731211. (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphite
low resistance
Metallizing
Graphene
Etching

Synthesis of nitrogen-doped multilayer graphene film by solid-phase deposition using Co-N catalyst

Fujishima, Y. & Ueno, K., 2019 Mar 1, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. Institute of Electrical and Electronics Engineers Inc., p. 354-356 3 p. 8731097. (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphite
Graphene
solid phases
graphene
Multilayers
2018
2 Citations (Scopus)

Moisture barrier properties of single-layer graphene deposited on Cu films for Cu metallization

Gomasang, P., Abe, T., Kawahara, K., Wasai, Y., Nabatova-Gabain, N., Cuong, N. T., Ago, H., Okada, S. & Ueno, K., 2018 Apr 1, In : Japanese Journal of Applied Physics. 57, 4, 04FC08.

Research output: Contribution to journalArticle

Metallizing
moisture
Graphene
graphene
Moisture
16 Citations (Scopus)

On-chip intercalated-graphene inductors for next-generation radio frequency electronics

Kang, J., Matsumoto, Y., Li, X., Jiang, J., Xie, X., Kawamoto, K., Kenmoku, M., Chu, J. H., Liu, W., Mao, J., Ueno, K. & Banerjee, K., 2018 Jan 1, In : Nature Electronics. 1, 1, p. 46-51 6 p.

Research output: Contribution to journalArticle

Graphite
inductors
Inductance
Graphene
radio frequencies
1 Citation (Scopus)

Oxidation Structure Change of Copper Surface Depending on Accelerated Humidity

Gomasang, P., Ogiue, S., Ueno, K. & Yokogawa, S., 2018 Aug 8, 2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc., p. 112-114 3 p. 8430461

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Copper
Atmospheric humidity
Oxidation
Sheet resistance
Film thickness
2017

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M. & Ueno, K., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-June. p. 270-272 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flat cables
Electromigration
Plating
Soldering alloys
Copper

Current enhanced solid phase precipitation (CE-SPP) for direct deposition of multilayer graphene on SiO2 from a Cu capped Co-C layer

Ichikawa, H. & Ueno, K., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 244-246 3 p. 7947583

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphene
Multilayers
1 Citation (Scopus)
Schottky diodes
Graphene
solid phases
graphene
Multilayers
5 Citations (Scopus)

MoCl5 intercalation doping and oxygen passivation of submicrometer-sized multilayer graphene

Miyazaki, H., Matsumoto, R., Katagiri, M., Yoshida, T., Ueno, K., Sakai, T. & Kajita, A., 2017 Apr 1, In : Japanese Journal of Applied Physics. 56, 4, 04CP02.

Research output: Contribution to journalArticle

Intercalation
Passivation
intercalation
Graphene
passivity

Novel in-situ passivation of MoCl5 doped multilayer graphene with MoOx for low-resistance interconnects

Kawamoto, K., Saito, Y., Kenmoku, M. & Ueno, K., 2017 Jun 13, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 252-254 3 p. 7947586

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Passivation
Graphene
Multilayers
Molybdenum oxide
Molybdenum
Schottky diodes
Graphene
solid phases
graphene
Multilayers
2016

Advanced Metallization for ULSI Applications

Nakatsuka, O., Lee, H. J., Park, Y. B., Ueno, K. & Yokogawa, S., 2016 Jan 1, In : Japanese Journal of Applied Physics. 55, 63, 06J001.

Research output: Contribution to journalEditorial

Open Access
Metallizing
8 Citations (Scopus)

Effect of current stress during thermal CVD of multilayer graphene on cobalt catalytic layer

Ueno, K., Ichikawa, H. & Uchida, T., 2016 Apr 1, In : Japanese Journal of Applied Physics. 55, 4, 04EC13.

Research output: Contribution to journalArticle

thermal stresses
Thermal stress
Graphene
Chemical vapor deposition
Cobalt
2 Citations (Scopus)

Improvement of multilayer graphene crystallinity by solid-phase precipitation with current stress application during annealing

Uddin, M. S., Ichikawa, H., Sano, S. & Ueno, K., 2016 Jan 1, In : Japanese Journal of Applied Physics. 55, 6S3, 06JH02.

Research output: Contribution to journalArticle

Graphene
solid phases
crystallinity
graphene
Multilayers
3 Citations (Scopus)

Reliability tests of electroless barriers against copper diffusion under bias-temperature stress with n- and p-type substrates

Ueno, K., Fujishima, S., Yamashita, M. & Mitsumori, A., 2016 May 1, In : Japanese Journal of Applied Physics. 55, 5, 56501.

Research output: Contribution to journalArticle

Electric breakdown
breakdown
Copper
copper
Substrates

Synthesis of doped carbon nanotubes by CVD using NiB catalysts

Tomita, K., Kawakami, N., Aozasa, A., Aida, K. & Ueno, K., 2016 Jul 8, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 198-199 2 p. 7507730

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Carbon Nanotubes
Boron
Nickel
Chemical vapor deposition
Carbon nanotubes
2014
10 Citations (Scopus)

Bromine doping of multilayer graphene for low-resistance interconnects

Ueno, K., Kosugi, R., Imazeki, K., Aozasa, A., Matsumoto, Y., Miyazaki, H., Sakuma, N., Kajita, A. & Sakai, T., 2014, In : Japanese Journal of Applied Physics. 53, 5 SPEC. ISSUE 2, 05GC02.

Research output: Contribution to journalArticle

Bromine
low resistance
bromine
Graphene
graphene
9 Citations (Scopus)

Improvement of multilayer graphene quality by current stress during thermal CVD

Razak, L. A., Tobino, D. & Ueno, K., 2014 May 25, In : Microelectronic Engineering. 120, p. 200-204 5 p.

Research output: Contribution to journalArticle

Graphite
thermal stresses
Thermal stress
Graphene
graphene
2 Citations (Scopus)

Properties of electrodeposited germanium thin films

Uchida, Y., Funayama, T., Kogure, Y. & Ueno, K., 2014 Nov 1, In : Physica Status Solidi (C) Current Topics in Solid State Physics. 11, 11-12, p. 1661-1664 4 p.

Research output: Contribution to journalArticle

electroplating
germanium
thin films
electrodes
spacers
2013
4 Citations (Scopus)

Heat-Resistant co-w catalytic metals for multilayer graphene chemical vapor deposition

Ueno, K., Karasawa, Y., Kuwahara, S., Baba, S., Hanai, H., Yamazaki, Y., Sakuma, N., Kajita, A. & Sakai, T., 2013 Apr, In : Japanese Journal of Applied Physics. 52, 4 PART 2, 04CB04.

Research output: Contribution to journalArticle

Graphene
Chemical vapor deposition
graphene
Multilayers
vapor deposition
3 Citations (Scopus)

Low-resistance metal contacts for nanocarbon/cobalt interconnects

Ueno, K., Takagi, M., Yano, H., Wakui, T., Yamazaki, Y., Sakuma, N., Kajita, A. & Sakai, T., 2013 May, In : Japanese Journal of Applied Physics. 52, 5 PART 4, 05FD01.

Research output: Contribution to journalArticle

low resistance
electric contacts
Cobalt
cobalt
electrical resistivity
2012
2 Citations (Scopus)

Barrier integrity of electroless diffusion barriers and organosilane monolayer against copper diffusion under bias temperature stress

Mitsumori, A., Fujishima, S. & Ueno, K., 2012 May, In : Japanese Journal of Applied Physics. 51, 5 PART 2, 05EB03.

Research output: Contribution to journalArticle

Diffusion barriers
barrier layers
integrity
Monolayers
Copper
4 Citations (Scopus)

Current induced grain growth of electroplated copper film

Razak, L., Yamaguchi, T., Akahori, S., Hashimoto, H. & Ueno, K., 2012 May, In : Japanese Journal of Applied Physics. 51, 5 PART 2, 05EA04.

Research output: Contribution to journalArticle

Induced currents
Grain growth
Copper
copper
Polyethylene glycols

Foreword: Advanced metallization for ULSI applications

Ueno, K., 2012 May, In : Japanese Journal of Applied Physics. 51, 5 PART 2

Research output: Contribution to journalArticle

Metallizing

Low-resistance metal contacts to nanocarbon/cobalt interconnects

Takagi, M., Yano, H., Wakui, T., Yamazaki, Y., Sakuma, N., Kajita, A., Sakai;K.Ueno, T. & Ueno, K., 2012 Oct 23, In : Extended Abstracts of Advanced Metallization Conference 2012::22nd Asian Session. p. 124-125

Research output: Contribution to journalArticle

2011
3 Citations (Scopus)

Chemical vapor deposition of nanocarbon on electroless NiB catalyst using ethanol precursor

Tanaka, T., Sato, T., Karasawa, Y. & Ueno, K., 2011 May, In : Japanese Journal of Applied Physics. 50, 5 PART 2, 05EF02.

Research output: Contribution to journalArticle

Chemical vapor deposition
Ethanol
ethyl alcohol
vapor deposition
catalysts

Fabrication and Electrical Properties of Nanocarbon/Metal Hybrid Interconnects

M.Takagi, M. T., Wakui, T., Karasawa, Y., Kuwahara, S., Sakuma, N., Kajita, A., Sakai, T. & Ueno, K., 2011 Sep 14, In : Entended Abstracts of Advanced Metallization Conference 2011: 21st Asian Session. p. 134-135

Research output: Contribution to journalArticle

Review of ADMETA Plus 2011 conference topics

Ueno, K. & Kawasaki, H., 2011, Advanced Metallization Conference (AMC). p. 133-142 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2010

Chemical Vapor Deposition of Nanocarbon on Electroless Ni-B Allo Catalyst

Tanaka, T., Karasawa;K.Ueno, T. TT. SY. & Ueno, K., 2010 Oct 20, In : Advanced Metallization Conference 2010 20th Asian Session. p. 118-119

Research output: Contribution to journalArticle

Chemical vapor deposition of nanocarbon on electroless Ni-B alloy catalyst

Tanaka, T., Sato, T., Karasawa, Y. & Ueno, K., 2010, Advanced Metallization Conference (AMC). p. 258-259 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Graphite
Chemical vapor deposition
Catalysts
Deposits
Temperature
5 Citations (Scopus)

Comparison of lifetime improvements in electromigration between Ti barrier metal and chemical vapor deposition Co capping

Kakuhara, Y., Yokogawa, S. & Ueno, K., 2010 Apr, In : Japanese Journal of Applied Physics. 49, 4 PART 2, 04DB08.

Research output: Contribution to journalArticle

metal vapors
Electromigration
electromigration
Chemical vapor deposition
Grain boundaries
2 Citations (Scopus)

Grain growth enhancement of electroplated copper film by supercritical annealing

Ueno, K., Shimada, Y., Yomogida, S., Akahori, S., Yamamoto, T., Yamaguchi, T., Aoki, Y., Matsuyama, A., Yata, T. & Hashimoto, H., 2010 May, In : Japanese Journal of Applied Physics. 49, 5 PART 3

Research output: Contribution to journalArticle

Grain growth
Annealing
Copper
copper
annealing
4 Citations (Scopus)

Material and process challenges for interconnects in nanoelectronics era

Ueno, K., 2010, Proceedings of 2010 International Symposium on VLSI Technology, System and Application, VLSI-TSA 2010. p. 64-65 2 p. 5488945

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nanoelectronics
Electromigration
Fabrication
Optical interconnects
Grain growth
2009

Advanced Metallization Conference: Preface

Naik, M., Shaviv, R., Yoda, T. & Ueno, K., 2009, In : Unknown Journal.

Research output: Contribution to journalArticle

Metallizing

Advanced Metallization Conference 2008

Naik, M., Shariv, R., Yoda, T., Ueno(Editor), K. & Ueno, K., 2009 Apr 1, In : Default journal.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Degradation of electromigration lifetime of Cu/Low-k interconnects by postannealing

Kakuhara, Y. & Ueno, K., 2009 Apr, In : Japanese Journal of Applied Physics. 48, 4, 046507.

Research output: Contribution to journalArticle

Electromigration
electromigration
degradation
Degradation
budgets

Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Shimada, Y., Yomogida, S., Akahori, S., Yamamoto, T., Yamaguchi, T., Aoki, Y., Matsuyama, A., Yata, T., Hashimoto, H. & Ueno, K., 2009 Oct 20, In : Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009.

Research output: Contribution to journalArticle

Fabrication of Electroless CoWP/NiB Barrier Layer on SiO2 for ULSI Devices

Osaka, T., Aramak, H., Yoshino, M., Ueno, K., Matsuda, I. & Shacham-Diam, Y., 2009 Sep 1, In : Journal of the Electrochemical Society. 156, p. H707-H710

Research output: Contribution to journalArticle

21 Citations (Scopus)

Fabrication of electroless CoWP/NiB diffusion barrier layer on SiO 2 for ULSI Devices

Osaka, T., Aramaki, H., Yoshino, M., Ueno, K., Matsuda, I. & Shacham-Diamand, Y., 2009, In : Journal of the Electrochemical Society. 156, 9

Research output: Contribution to journalArticle

Diffusion barriers
barrier layers
Fabrication
fabrication
plating
2 Citations (Scopus)

Grain growth of electroplated copper film by alternative annealing methods

Ueno, K., Shimotani, K., Shimada, Y., Yomogida, S., Takeshita, T., Hashimoto, A. & Yata, T., 2009, Advanced Metallization Conference (AMC). p. 283-287 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Supercritical fluids
Grain growth
Copper
Annealing
Joule heating

Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal

Kakuhara, Y., Yokogawa, S., Hiroi, M., Takewaki, T. & Ueno, K., 2009 Sep 24, In : Japanese Journal of Applied Physics. 48, p. 096504-1-096504-5

Research output: Contribution to journalArticle

1 Citation (Scopus)

Suppression of electromigration early failure of Cu/Porous low-k interconnects using dummy metal

Kakuhara, Y., Yokogawa, S., Hiroi, M., Takewaki, T. & Ueno, K., 2009, In : Japanese Journal of Applied Physics. 48, 9 Part 1, p. 965041-965045 5 p.

Research output: Contribution to journalArticle

dummies
Electromigration
electromigration
retarding
Metals
2008

Electroless Deposition on the Insulators by Using Pd im-Mobilized Layer of Organic Molecules

Yoshino, M., Aramaki, H., Matsuda, I., Osaka, T., Ueno, K. & Shacham-Diam, Y., 2008 Oct 12, In : Meeting Abstracts Electrochmical Society. 802

Research output: Contribution to journalArticle