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Research Output 1985 2019

  • 867 Citations
  • 17 h-Index
  • 94 Article
  • 29 Conference contribution
  • 1 Chapter
  • 1 Editorial
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Article
2019

A novel graphene barrier against moisture by multiple stacking large-grain graphene

Gomasang, P., Kawahara, K., Yasuraoka, K., Maruyama, M., Ago, H., Okada, S. & Ueno, K., 2019 Dec 1, In : Scientific Reports. 9, 1, 3777.

Research output: Contribution to journalArticle

Open Access
Graphene
solid phases
Cobalt
graphene
Multilayers

Lifetime prediction model of Cu-based metallization against moisture under temperature and humidity accelerations

Gomasang, P., Ogiue, S., Yokogawa, S. & Ueno, K., 2019 Jan 1, In : Japanese Journal of Applied Physics. 58, SBBC01.

Research output: Contribution to journalArticle

Open Access
Metallizing
moisture
humidity
Atmospheric humidity
Moisture
2018
2 Citations (Scopus)

Moisture barrier properties of single-layer graphene deposited on Cu films for Cu metallization

Gomasang, P., Abe, T., Kawahara, K., Wasai, Y., Nabatova-Gabain, N., Cuong, N. T., Ago, H., Okada, S. & Ueno, K., 2018 Apr 1, In : Japanese Journal of Applied Physics. 57, 4, 04FC08.

Research output: Contribution to journalArticle

Metallizing
moisture
Graphene
graphene
Moisture
16 Citations (Scopus)

On-chip intercalated-graphene inductors for next-generation radio frequency electronics

Kang, J., Matsumoto, Y., Li, X., Jiang, J., Xie, X., Kawamoto, K., Kenmoku, M., Chu, J. H., Liu, W., Mao, J., Ueno, K. & Banerjee, K., 2018 Jan 1, In : Nature Electronics. 1, 1, p. 46-51 6 p.

Research output: Contribution to journalArticle

Graphite
inductors
Inductance
Graphene
radio frequencies
2017
1 Citation (Scopus)
Schottky diodes
Graphene
solid phases
graphene
Multilayers
5 Citations (Scopus)

MoCl5 intercalation doping and oxygen passivation of submicrometer-sized multilayer graphene

Miyazaki, H., Matsumoto, R., Katagiri, M., Yoshida, T., Ueno, K., Sakai, T. & Kajita, A., 2017 Apr 1, In : Japanese Journal of Applied Physics. 56, 4, 04CP02.

Research output: Contribution to journalArticle

Intercalation
Passivation
intercalation
Graphene
passivity
Schottky diodes
Graphene
solid phases
graphene
Multilayers
2016
8 Citations (Scopus)

Effect of current stress during thermal CVD of multilayer graphene on cobalt catalytic layer

Ueno, K., Ichikawa, H. & Uchida, T., 2016 Apr 1, In : Japanese Journal of Applied Physics. 55, 4, 04EC13.

Research output: Contribution to journalArticle

thermal stresses
Thermal stress
Graphene
Chemical vapor deposition
Cobalt
2 Citations (Scopus)

Improvement of multilayer graphene crystallinity by solid-phase precipitation with current stress application during annealing

Uddin, M. S., Ichikawa, H., Sano, S. & Ueno, K., 2016 Jan 1, In : Japanese Journal of Applied Physics. 55, 6S3, 06JH02.

Research output: Contribution to journalArticle

Graphene
solid phases
crystallinity
graphene
Multilayers
3 Citations (Scopus)

Reliability tests of electroless barriers against copper diffusion under bias-temperature stress with n- and p-type substrates

Ueno, K., Fujishima, S., Yamashita, M. & Mitsumori, A., 2016 May 1, In : Japanese Journal of Applied Physics. 55, 5, 56501.

Research output: Contribution to journalArticle

Electric breakdown
breakdown
Copper
copper
Substrates
2014
10 Citations (Scopus)

Bromine doping of multilayer graphene for low-resistance interconnects

Ueno, K., Kosugi, R., Imazeki, K., Aozasa, A., Matsumoto, Y., Miyazaki, H., Sakuma, N., Kajita, A. & Sakai, T., 2014, In : Japanese Journal of Applied Physics. 53, 5 SPEC. ISSUE 2, 05GC02.

Research output: Contribution to journalArticle

Bromine
low resistance
bromine
Graphene
graphene
9 Citations (Scopus)

Improvement of multilayer graphene quality by current stress during thermal CVD

Razak, L. A., Tobino, D. & Ueno, K., 2014 May 25, In : Microelectronic Engineering. 120, p. 200-204 5 p.

Research output: Contribution to journalArticle

Graphite
thermal stresses
Thermal stress
Graphene
graphene
2 Citations (Scopus)

Properties of electrodeposited germanium thin films

Uchida, Y., Funayama, T., Kogure, Y. & Ueno, K., 2014 Nov 1, In : Physica Status Solidi (C) Current Topics in Solid State Physics. 11, 11-12, p. 1661-1664 4 p.

Research output: Contribution to journalArticle

electroplating
germanium
thin films
electrodes
spacers
2013
4 Citations (Scopus)

Heat-Resistant co-w catalytic metals for multilayer graphene chemical vapor deposition

Ueno, K., Karasawa, Y., Kuwahara, S., Baba, S., Hanai, H., Yamazaki, Y., Sakuma, N., Kajita, A. & Sakai, T., 2013 Apr, In : Japanese Journal of Applied Physics. 52, 4 PART 2, 04CB04.

Research output: Contribution to journalArticle

Graphene
Chemical vapor deposition
graphene
Multilayers
vapor deposition
3 Citations (Scopus)

Low-resistance metal contacts for nanocarbon/cobalt interconnects

Ueno, K., Takagi, M., Yano, H., Wakui, T., Yamazaki, Y., Sakuma, N., Kajita, A. & Sakai, T., 2013 May, In : Japanese Journal of Applied Physics. 52, 5 PART 4, 05FD01.

Research output: Contribution to journalArticle

low resistance
electric contacts
Cobalt
cobalt
electrical resistivity
2012
2 Citations (Scopus)

Barrier integrity of electroless diffusion barriers and organosilane monolayer against copper diffusion under bias temperature stress

Mitsumori, A., Fujishima, S. & Ueno, K., 2012 May, In : Japanese Journal of Applied Physics. 51, 5 PART 2, 05EB03.

Research output: Contribution to journalArticle

Diffusion barriers
barrier layers
integrity
Monolayers
Copper
4 Citations (Scopus)

Current induced grain growth of electroplated copper film

Razak, L., Yamaguchi, T., Akahori, S., Hashimoto, H. & Ueno, K., 2012 May, In : Japanese Journal of Applied Physics. 51, 5 PART 2, 05EA04.

Research output: Contribution to journalArticle

Induced currents
Grain growth
Copper
copper
Polyethylene glycols

Foreword: Advanced metallization for ULSI applications

Ueno, K., 2012 May, In : Japanese Journal of Applied Physics. 51, 5 PART 2

Research output: Contribution to journalArticle

Metallizing

Low-resistance metal contacts to nanocarbon/cobalt interconnects

Takagi, M., Yano, H., Wakui, T., Yamazaki, Y., Sakuma, N., Kajita, A., Sakai;K.Ueno, T. & Ueno, K., 2012 Oct 23, In : Extended Abstracts of Advanced Metallization Conference 2012::22nd Asian Session. p. 124-125

Research output: Contribution to journalArticle

2011
3 Citations (Scopus)

Chemical vapor deposition of nanocarbon on electroless NiB catalyst using ethanol precursor

Tanaka, T., Sato, T., Karasawa, Y. & Ueno, K., 2011 May, In : Japanese Journal of Applied Physics. 50, 5 PART 2, 05EF02.

Research output: Contribution to journalArticle

Chemical vapor deposition
Ethanol
ethyl alcohol
vapor deposition
catalysts

Fabrication and Electrical Properties of Nanocarbon/Metal Hybrid Interconnects

M.Takagi, M. T., Wakui, T., Karasawa, Y., Kuwahara, S., Sakuma, N., Kajita, A., Sakai, T. & Ueno, K., 2011 Sep 14, In : Entended Abstracts of Advanced Metallization Conference 2011: 21st Asian Session. p. 134-135

Research output: Contribution to journalArticle

2010

Chemical Vapor Deposition of Nanocarbon on Electroless Ni-B Allo Catalyst

Tanaka, T., Karasawa;K.Ueno, T. TT. SY. & Ueno, K., 2010 Oct 20, In : Advanced Metallization Conference 2010 20th Asian Session. p. 118-119

Research output: Contribution to journalArticle

5 Citations (Scopus)

Comparison of lifetime improvements in electromigration between Ti barrier metal and chemical vapor deposition Co capping

Kakuhara, Y., Yokogawa, S. & Ueno, K., 2010 Apr, In : Japanese Journal of Applied Physics. 49, 4 PART 2, 04DB08.

Research output: Contribution to journalArticle

metal vapors
Electromigration
electromigration
Chemical vapor deposition
Grain boundaries
2 Citations (Scopus)

Grain growth enhancement of electroplated copper film by supercritical annealing

Ueno, K., Shimada, Y., Yomogida, S., Akahori, S., Yamamoto, T., Yamaguchi, T., Aoki, Y., Matsuyama, A., Yata, T. & Hashimoto, H., 2010 May, In : Japanese Journal of Applied Physics. 49, 5 PART 3

Research output: Contribution to journalArticle

Grain growth
Annealing
Copper
copper
annealing
2009

Advanced Metallization Conference: Preface

Naik, M., Shaviv, R., Yoda, T. & Ueno, K., 2009, In : Unknown Journal.

Research output: Contribution to journalArticle

Metallizing

Advanced Metallization Conference 2008

Naik, M., Shariv, R., Yoda, T., Ueno(Editor), K. & Ueno, K., 2009 Apr 1, In : Default journal.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Degradation of electromigration lifetime of Cu/Low-k interconnects by postannealing

Kakuhara, Y. & Ueno, K., 2009 Apr, In : Japanese Journal of Applied Physics. 48, 4, 046507.

Research output: Contribution to journalArticle

Electromigration
electromigration
degradation
Degradation
budgets

Enhanced Grain Growth of Electroplated Copper Film by Annealing in Supercritical CO2 with H2

Shimada, Y., Yomogida, S., Akahori, S., Yamamoto, T., Yamaguchi, T., Aoki, Y., Matsuyama, A., Yata, T., Hashimoto, H. & Ueno, K., 2009 Oct 20, In : Extended Abstracts of Advanced Metallization Conference (ADMETA) 2009.

Research output: Contribution to journalArticle

Fabrication of Electroless CoWP/NiB Barrier Layer on SiO2 for ULSI Devices

Osaka, T., Aramak, H., Yoshino, M., Ueno, K., Matsuda, I. & Shacham-Diam, Y., 2009 Sep 1, In : Journal of the Electrochemical Society. 156, p. H707-H710

Research output: Contribution to journalArticle

21 Citations (Scopus)

Fabrication of electroless CoWP/NiB diffusion barrier layer on SiO 2 for ULSI Devices

Osaka, T., Aramaki, H., Yoshino, M., Ueno, K., Matsuda, I. & Shacham-Diamand, Y., 2009, In : Journal of the Electrochemical Society. 156, 9

Research output: Contribution to journalArticle

Diffusion barriers
barrier layers
Fabrication
fabrication
plating

Suppression of Electromigration Early Failure of Cu/Porous Low-k Interconnects Using Dammy Metal

Kakuhara, Y., Yokogawa, S., Hiroi, M., Takewaki, T. & Ueno, K., 2009 Sep 24, In : Japanese Journal of Applied Physics. 48, p. 096504-1-096504-5

Research output: Contribution to journalArticle

1 Citation (Scopus)

Suppression of electromigration early failure of Cu/Porous low-k interconnects using dummy metal

Kakuhara, Y., Yokogawa, S., Hiroi, M., Takewaki, T. & Ueno, K., 2009, In : Japanese Journal of Applied Physics. 48, 9 Part 1, p. 965041-965045 5 p.

Research output: Contribution to journalArticle

dummies
Electromigration
electromigration
retarding
Metals
2008

Electroless Deposition on the Insulators by Using Pd im-Mobilized Layer of Organic Molecules

Yoshino, M., Aramaki, H., Matsuda, I., Osaka, T., Ueno, K. & Shacham-Diam, Y., 2008 Oct 12, In : Meeting Abstracts Electrochmical Society. 802

Research output: Contribution to journalArticle

Electroless NiB Liner on Organosilane Layers

Aramaki, H., Yoshino, M., Matsuda, I., Ueno, K., Shacham-Diam, Y. & Osaka, T., 2008 Oct 8, In : Advanced Metallization Conference 2008, Asian Session Abstracts. p. 108-109

Research output: Contribution to journalArticle

9 Citations (Scopus)

Electromigration lifetime enhancement of CoWP capped Cu interconnects by thermal treatment

Kakuhara, Y., Kawahara, N., Ueno, K. & Oda, N., 2008 Jun 13, In : Japanese Journal of Applied Physics. 47, 6 PART 1, p. 4475-4479 5 p.

Research output: Contribution to journalArticle

Electromigration
electromigration
Heat treatment
life (durability)
augmentation
2007
9 Citations (Scopus)

A robust embedded ladder-oxide/Cu multilevel interconnect technology for 0.13um complementary metal oxide semiconductor generation

Oda, N., Ito, S., Takewaki, T., Shiba, K., Kunishima, H., Hironaga, N., Honma, I., Nanba, H., Yokogawa, S., Kameyama, A., Goto, T., Usami, T., Ohto, K., Kubo, A., Suzuki, M., Yamamoto, Y., Watanabe, S., Yamada, K., Ikeda, M., Horiuchi, K. UT. & 1 others, Ueno, K., 2007 Mar 5, In : Japanese Journal of Applied Physics. 46, p. 954-961

Research output: Contribution to journalArticle

9 Citations (Scopus)

A robust embedded ladder-oxide/Cu multilevel interconnect technology for 0.13 μm complementary metal oxide semiconductor generation

Oda, N., Ito, S., Takewaki, T., Shiba, K., Kunishima, H., Hironaga, N., Honma, I., Nanba, H., Yokogawa, S., Kameyama, A., Goto, T., Usami, T., Ohto, K., Kubo, A., Suzuki, M., Yamamoto, Y., Watanabe, S., Yamada, K., Ikeda, M., Ueno, K. & 1 others, Horiuchi, T., 2007 Mar 8, In : Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 46, 3 A, p. 954-961 8 p.

Research output: Contribution to journalArticle

wiring
Ladders
plugs
ladders
CMOS
5 Citations (Scopus)

Chip-level performance maximization using ASIS (application-specific interconnect structure) wiring design concept for 45 nm CMOS generation

Oda, N., Imura, H., Kawahara, N., Tagami, M., Kunishima, H., Sone, S., Ohnishi, S., Yamada, K., Kakuhara, Y., Sekine, M., Hayashi, Y. & Ueno, K., 2007 Apr, In : IEICE Transactions on Electronics. E90-C, 4, p. 848-855 8 p.

Research output: Contribution to journalArticle

Electric wiring
Metals
Wire
5 Citations (Scopus)

Chip-level performance maximization using ASIS woring design concept for 45 nm CMOS generation

Oda, N., Imura, H., Kawahara, N., Tagami, M., Kunishima, H., Sone, S., Ohnishi, S., Yamada, K., Kakuhara, Y., Sekine, M., Hayashi, Y. & Ueno, K., 2007 Apr 15, In : IEICE Transaction on Electronics. E90-C, p. 848-855

Research output: Contribution to journalArticle

8 Citations (Scopus)

Time-dependent dielectric breakdown characterization of 90- and 65-nm-Node Cu/SiOC interconnects with via plugs

Ueno, K., Kameyama, A., Matsumoto, A., Iguchi, M., Takewaki, T., Oshida, D., Toyoshima, H., Kawahara, N., Asada, S., Suzuki, M. & Oda, N., 2007 Apr 5, In : Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 46, 4 A, p. 1444-1451 8 p.

Research output: Contribution to journalArticle

Electric connectors
plugs
Electric breakdown
breakdown
life (durability)
2006
5 Citations (Scopus)

A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

Kawahara, N., Tagami, M., Withers, B., Kakuhara, Y., Imura, H., Ohto, K., Taiji, T., Arita, K., Kurokawa, T., Nagase, M., Maruyama, T., Oda, N., Hayashi, Y., Jacobs, J., M.Sakurai, M. S., Sekine, M. & Ueno, K., 2006 Jun 6, In : Proc. 2006 Int. Interconnect Tech. Conf.. p. 152-154

Research output: Contribution to journalArticle

20 Citations (Scopus)

Highly Reliable Interface of Self-Aligned CuSiN Process with Low-k SiC Barrier Dielectric (k=3.5) for 65nm Node and Beyond

Usami, T., Ide, T., Kakuhara, Y., Ajima, Y., Ueno, K., Maruyama, T., Yu, Y., Apen, E., Chattopadhyay, K., Schravendijk, B. V., Oda, N. & Sekine, M., 2006 Jun 6, In : Proc. 2006 Int. Interconnect Tech. Conf.. p. 125-127

Research output: Contribution to journalArticle

Key mechanism for improved EM lifetime of CoWP capped Cu interconnects

Kakuhara, Y., Kawahara;K.Ueno, Y. KN., N.Oda, N. O. & Ueno, K., 2006 Sep 13, In : Entended Abstracts of the 2006 Int. Conf, on Solid State Dev. and Mat.. p. 144-145

Research output: Contribution to journalArticle

2005
1 Citation (Scopus)

Reliability of damascene copper interconnects (Invited)

K.Ueno, K. U., T.Ishigamil, T. I., Y.Kakuhara, Y. K., M.Kawano, M. K. & Ueno, K., 2005 May 1, In : Proceedings of ULSI Process Integration IV. 2005, p. 408-418

Research output: Contribution to journalArticle

2003
Integrated circuits
Plastics
Finite element method
Linewidth
Geometry
51 Citations (Scopus)

Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Osaka, T., Takano, N., Kurokawa, T., Kaneko, T. & Ueno, K., 2003 Jun 2, In : Surface and Coatings Technology. 169-170, p. 124-127 4 p.

Research output: Contribution to journalArticle

Sheet resistance
electroless deposition
Thin films
Thermodynamic stability
thermal stability