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Fingerprint Dive into the research topics where Kimiyoshi Usami is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Electric potential Engineering & Materials Science
Program processors Engineering & Materials Science
Microprocessor chips Engineering & Materials Science
Particle accelerators Engineering & Materials Science
Networks (circuits) Engineering & Materials Science
Electric power utilization Engineering & Materials Science
Transistors Engineering & Materials Science
Energy dissipation Engineering & Materials Science

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Research Output 1987 2019

  • 1585 Citations
  • 19 h-Index
  • 66 Conference contribution
  • 36 Article
  • 1 Chapter

A coarse grained-reconfigurable accelerator with energy efficient MTJ-based non-volatile flip-flops

Ikezoe, T., Amano, H., Akaike, J., Usami, K., Kudo, M., Hiraga, K., Shuto, Y. & Yagami, K., 2019 Feb 13, 2018 International Conference on Reconfigurable Computing and FPGAs, ReConFig 2018. Andrews, D., Feregrino, C., Cumplido, R. & Stroobandt, D. (eds.). Institute of Electrical and Electronics Engineers Inc., 8641712. (2018 International Conference on Reconfigurable Computing and FPGAs, ReConFig 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flip flop circuits
Particle accelerators
Data storage equipment
Managers
Inventory control

Level-Shifter-Less Approach for Multi-VDD SoC Design to Employ Body Bias Control in FD-SOI

Usami, K., Kogure, S., Yoshida, Y., Magasaki, R. & Amano, H., 2019 Jan 1, VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things - 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Revised and Extended Selected Papers. Monteiro, J., Elfadel, I. A. M., Sonza Reorda, M., Ugurdag, H. F., Maniatakos, M. & Reis, R. (eds.). Springer New York LLC, p. 1-21 21 p. (IFIP Advances in Information and Communication Technology; vol. 500).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Costs
Simulation
Temperature

Building block multi-chip systems using inductive coupling through chip interface

Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H. & Namiki, M., 2018 May 29, Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., p. 152-154 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Computer operating systems
Network architecture
Interfaces (computer)
Networks (circuits)
Hot Temperature
1 Citation (Scopus)

Digital embedded memory scheme using voltage scaling and body bias separation for low-power system

Yoshida, Y., Usami, K. & Amano, H., 2018 May 29, Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., p. 148-149 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Data storage equipment
Macros
Computer peripheral equipment
Flip flop circuits
Static random access storage

Energy Efficient Write Verify and Retry Scheme for MTJ Based Flip-Flop and Application

Usami, K., Akaike, J., Akiba, S., Kudo, M., Amano, H., Ikezoe, T., Hiraga, K., Shuto, Y. & Yagami, K., 2018 Nov 15, Proceedings - 7th IEEE Non-Volatile Memory Systems and Applications Symposium, NVMSA 2018. Institute of Electrical and Electronics Engineers Inc., p. 91-98 8 p. 8537701

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Flip flop circuits
Sequential circuits
Energy dissipation
Durability
Image processing