Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 1 Similar Profiles
Fatigue of materials Engineering & Materials Science
Soldering alloys Engineering & Materials Science
Temperature Engineering & Materials Science
solders Physics & Astronomy
fatigue life Physics & Astronomy
Thermal fatigue Engineering & Materials Science
cycles Physics & Astronomy
temperature Physics & Astronomy

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Research Output 1993 2017

  • 1292 Citations
  • 19 h-Index
  • 90 Article
  • 17 Conference contribution
  • 1 Chapter
  • 1 Editorial

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H. 2017 Oct 3 (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Research - peer-reviewArticle

Bismuth
Plastic deformation
Single crystals
Temperature
Direction compound

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H. 2017 Jun 13 Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: ResearchConference contribution

Fatigue testing
Copper
Fatigue of materials
Thin films
Thermal fatigue

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K. 2017 Jun 13 Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482

Research output: ResearchConference contribution

Fatigue crack propagation
Nanoparticles
Temperature
Thermal effects
1 Citations

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y. 2016 In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Research - peer-reviewArticle

eutectic alloys
crack propagation
strain rate
temperature
Fatigue crack propagation
1 Citations

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y. 2016 Jun 7 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

Research output: ResearchConference contribution

Power converters
Thermal cycling
Semiconductor materials
Temperature
Binary alloys