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Research Output

Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020, (Accepted/In press) In : Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.

Research output: Contribution to journalArticle

  • Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging

    Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In : Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.

    Research output: Contribution to journalArticle

    Open Access
  • Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

    Sato, Y. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

    Nagata, K., Kariya, Y. & Horie, S., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

    Ono, K. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution