If you made any changes in Pure these will be visible here soon.

Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 1 Similar Profiles
Fatigue of materials Engineering & Materials Science
Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
fatigue life Physics & Astronomy
Thermal fatigue Engineering & Materials Science
thermal fatigue Physics & Astronomy
crack propagation Physics & Astronomy
Fatigue crack propagation Engineering & Materials Science

Network Recent external collaboration on country level. Dive into details by clicking on the dots.

Research Output 1993 2019

  • 1402 Citations
  • 19 h-Index
  • 96 Article
  • 17 Conference contribution
  • 2 Editorial
  • 1 Chapter

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
Metal nanoparticles
fatigue life
Thermal cycling

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

tin alloys
Tin alloys
Dynamic recrystallization
crack tips
crack propagation

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 902-908 7 p.

Research output: Contribution to journalArticle

stress intensity factors
crack tips
crack propagation
Fatigue crack propagation
fillers

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 868-875 8 p.

Research output: Contribution to journalArticle

soldering
strain distribution
strain hardening
Tensile testing
Soldering