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Fingerprint Dive into the research topics where Yoshiharu Kariya is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

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Research Output

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

    Nagata, K., Kariya, Y. & Horie, S., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

    Ono, K. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

    Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

    Research output: Contribution to journalArticle

  • 1 Citation (Scopus)

    Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

    Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

    Research output: Contribution to journalArticle