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Fingerprint Dive into the research topics where Yoshiharu Kariya is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Fatigue of materials Engineering & Materials Science
Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
fatigue life Physics & Astronomy
Thermal fatigue Engineering & Materials Science
Fatigue crack propagation Engineering & Materials Science
thermal fatigue Physics & Astronomy
crack propagation Physics & Astronomy

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Research Output 1993 2019

  • 1435 Citations
  • 20 h-Index
  • 96 Article
  • 23 Conference contribution
  • 2 Editorial
  • 1 Chapter

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesives
Camera lenses
Finite element method
Coatings

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Creep
Nanoparticles
Power semiconductor devices

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper
1 Citation (Scopus)

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
fatigue life
crack propagation
Fatigue crack propagation

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

crack propagation
Strain energy
Fatigue crack propagation
flux density
evaluation