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Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 1 Similar Profiles
Fatigue of materials Engineering & Materials Science
Soldering alloys Engineering & Materials Science
solders Physics & Astronomy
fatigue life Physics & Astronomy
Thermal fatigue Engineering & Materials Science
thermal fatigue Physics & Astronomy
Eutectics Engineering & Materials Science
cycles Physics & Astronomy

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Research Output 1993 2018

  • 1336 Citations
  • 19 h-Index
  • 92 Article
  • 17 Conference contribution
  • 1 Chapter
  • 1 Editorial

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

crack propagation
Fatigue crack propagation
sintering
Sintering
Nanoparticles

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H. 2018 Mar 1 In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
Fatigue testing
fatigue life
fatigue tests

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

Bismuth
bismuth
plastic deformation
Plastic deformation
Single crystals

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H. 2017 Jun 13 Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue testing
Thermal fatigue
Copper
Fatigue of materials
Thin films

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue crack propagation
Nanoparticles
Thermal effects
Temperature