Engineering & Materials Science
Fatigue of materials
Soldering alloys
Thermal fatigue
Fatigue crack propagation
Silver nanoparticles
Temperature
Eutectics
Lead-free solders
Creep
Bismuth
Silver
Coarsening
Grain boundaries
Fatigue testing
Finite element method
Strain energy
Strain hardening
Cracks
Ductility
Semiconductor materials
Fatigue damage
Intermetallics
Power semiconductor devices
Single crystals
Plastic deformation
Crack propagation
Tin
Strain rate
Sintering
Crack initiation
Copper
Polyimides
Microstructure
Lead
Thermal cycling
Thin films
Constitutive equations
Adhesives
Crack tips
Crystals
Hot Temperature
Dielectric films
Durability
Epoxy resins
Ball grid arrays
Adhesive joints
Grain boundary sliding
Chemical Compounds
Fatigue of materials
Soldering alloys
Thermal fatigue
Fatigue crack propagation
Silver nanoparticles
Temperature
Eutectics
Creep
Lead-free solders
Silver
Bismuth
Coarsening
Strain energy
Semiconductor materials
Grain boundaries
Cracks
Intermetallics
Tin
Finite element method
Copper
Fatigue testing
Power semiconductor devices
Single crystals
Plastic deformation
Strain hardening
Sintering
Ductility
Microstructure
Fatigue damage
Crack propagation
Thin films
Strain rate
Constitutive equations
Adhesives
Lead
Epoxy Resins
Crack tips
Crystals
Dielectric films
Direction compound
Durability
Thermal cycling
Ball grid arrays
Adhesive joints
Physics & Astronomy
fatigue life
solders
thermal fatigue
crack propagation
cycles
chips
silver
bismuth
cracks
exponents
fatigue tests
strain hardening
temperature
flux density
evaluation
intermetallics
ductility
plastic deformation
eutectics
eutectic alloys
nanoparticles
crack tips
constitutive equations
endurance
predictions
dwell
Coffin-Manson law
microstructure
damage
single crystals
shear stress
sintering
mineral oils
creep properties
grain boundaries
crack initiation
tin
waveforms
epoxy resins