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Fingerprint Dive into the research topics where Yoshiharu Kariya is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Engineering & Materials Science

Fatigue of materials
Soldering alloys
Thermal fatigue
Fatigue crack propagation
Eutectics
Temperature
Silver
Fatigue testing
Creep
Bismuth
Nanoparticles
Strain hardening
Ductility
Finite element method
Fatigue damage
Grain boundaries
Coarsening
Adhesives
Crack propagation
Crack initiation
Intermetallics
Strain rate
Strain energy
Cracks
Sintering
Plastic deformation
Tin
Semiconductor materials
Copper
Microstructure
Polyimides
Single crystals
Lead
Thermal cycling
Electronic equipment
Mechanical properties
Durability
Thin films
Soldering
Adhesive joints

Chemical Compounds

Fatigue of materials
Soldering alloys
Thermal fatigue
Fatigue crack propagation
Eutectics
Silver
Temperature
Creep
Bismuth
Nanoparticles
Coarsening
Grain boundaries
Tin
Fatigue testing
Copper
Ductility
Strain energy
Finite element method
Strain hardening
Cracks
Sintering
Plastic deformation
Semiconductor materials
Fatigue damage
Single crystals
Crack propagation
Strain rate
Intermetallics
Adhesives
Epoxy Resins
Thin films
Mineral Oil
Adhesive joints
Microstructure
Thermal cycling

Physics & Astronomy

General

solders
thermal fatigue
chips
strain hardening
exponents
evaluation
fatigue tests
cracks
eutectic alloys
eutectics
plastic deformation
sintering
damage
grain boundaries
crack initiation
single crystals
microstructure

Chemistry and Materials

fatigue life
bismuth
ductility
silver
intermetallics
creep properties
epoxy resins
mineral oils
tin

Physics

crack propagation
cycles
temperature
nanoparticles
flux density
waveforms

Social and Information Sciences

Coffin-Manson law

Engineering

shear stress