Engineering & Materials Science
Fatigue of materials
100%
Soldering alloys
92%
Thermal fatigue
52%
Fatigue crack propagation
40%
Silver nanoparticles
34%
Temperature
30%
Eutectics
28%
Lead-free solders
28%
Creep
24%
Finite element method
22%
Bismuth
22%
Silver
21%
Coarsening
19%
Cracks
18%
Fatigue testing
18%
Grain boundaries
18%
Strain energy
17%
Strain hardening
15%
Semiconductor materials
14%
Ductility
14%
Crack initiation
14%
Fatigue damage
14%
Intermetallics
14%
Power semiconductor devices
12%
Single crystals
12%
Plastic deformation
11%
Crack propagation
11%
Tin
11%
Strain rate
10%
Sintering
10%
Copper
10%
Polyimides
10%
Microstructure
8%
Lead
8%
Thermal cycling
7%
Thin films
7%
Constitutive equations
7%
Adhesives
6%
Crack tips
6%
Crystals
6%
Printed circuit boards
6%
Dielectric films
5%
Hot Temperature
5%
Durability
5%
Ball grid arrays
5%
Epoxy resins
5%
Chemical Compounds
Solder
88%
Crack Propagation
70%
Thermal Fatigue
54%
Alloy
42%
Creep
32%
Eutectics
24%
Strain Energy
23%
Strain
21%
Grain Boundary
20%
Semiconductor
19%
Strain Hardening
16%
Mechanical Fatigue
14%
Ductility
14%
Crack Initiation
13%
Intermetallic Compound
13%
Plastic Deformation
12%
Microstructure
9%
Nanoparticle
9%
Sintering
9%
Single Crystalline Solid
8%
Shear
8%
Time
7%
Resistance
7%
Shear Stress
7%
Delamination
7%
Volume
6%
Thermal Cycling
6%
Nuclear Power
5%
Fracture Mechanics
5%
Strength
5%
Dielectric Film
5%
Polyimide Macromolecule
5%
Fracture Energy
5%
Stress Relaxation
5%
Displacement
5%
Physics & Astronomy
fatigue life
80%
solders
68%
thermal fatigue
39%
crack propagation
33%
cycles
30%
chips
16%
silver
13%
bismuth
13%
cracks
12%
exponents
12%
fatigue tests
11%
strain hardening
11%
temperature
11%
flux density
11%
evaluation
10%
intermetallics
10%
ductility
9%
plastic deformation
8%
eutectics
8%
eutectic alloys
8%
nanoparticles
7%
crack tips
6%
constitutive equations
6%
endurance
6%
predictions
6%
dwell
6%
Coffin-Manson law
6%
microstructure
5%
damage
5%
single crystals
5%
shear stress
5%
sintering
5%
mineral oils
5%
creep properties
5%
grain boundaries
5%
crack initiation
5%
tin
5%
waveforms
5%
epoxy resins
5%