If you made any changes in Pure these will be visible here soon.

Research Output

2020

Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging

Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In : Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.

Research output: Contribution to journalArticle

Open Access
2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 902-908 7 p.

Research output: Contribution to journalArticle

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 868-875 8 p.

Research output: Contribution to journalArticle

2018

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 Mar 1, In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
2017

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2016

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016 Jan 1, In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 Nov 7, (Accepted/In press) In : Journal of Electronic Materials. p. 1-8 8 p.

Research output: Contribution to journalArticle

14 Citations (Scopus)

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In : Materials Transactions. 57, 6, p. 819-823 5 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Preface

Kariya, Y. & Shohji, I., 2016, In : Materials Transactions. 57, 6, p. 796 1 p.

Research output: Contribution to journalEditorial

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 805-809 5 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2013

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013 Jan 1.

Research output: Contribution to conferencePaper

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013 Oct 21, In : Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013 Dec 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013 Dec 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 Dec 1, In : Materials Transactions. 53, p. 2072-2077

Research output: Contribution to journalArticle

Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In : Materials Transactions. 53, 12, p. 2072-2077 6 p.

Research output: Contribution to journalArticle

6 Citations (Scopus)

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Kanda, Y. & Kariya, Y., 2012 Jul 1, In : Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

Research output: Contribution to journalArticle

19 Citations (Scopus)

Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 Aug 29, In : Materials Transactions. 53

Research output: Contribution to journalArticle

Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

Kariya, Y., Tajima, S. & Yamada, S., 2012 Dec 12, In : Materials Transactions. 53, 12, p. 2067-2071 5 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)

Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

Kanda, Y., Kariya, Y. & Oto, Y., 2012 Mar 1, In : Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

Research output: Contribution to journalArticle

21 Citations (Scopus)

Mechanical reliability of isotropic conductive adhesive

Kariya, Y., 2012 Aug 1, In : Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.

Research output: Contribution to journalArticle

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011 Dec 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 713-718 6 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011 Dec 1, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. p. 707-712 6 p. (ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2010

Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y., 2010 Mar 19, In : Default journal.

Research output: Contribution to journalArticle

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010 Aug 9, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

Kanda, Y. & Kariya, Y., 2010 Feb 1, In : Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

Research output: Contribution to journalArticle

15 Citations (Scopus)

Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

K, Y., a, A., Zama, K. & Kariya, Y., 2010 May 1, In : Proc. of ICEP2010. p. 1-6

Research output: Contribution to journalArticle

Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 Oct 1, In : Materials Transactions. 51, 10, p. 1779-1784 6 p.

Research output: Contribution to journalArticle

12 Citations (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010 Aug 9, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010 Jun 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 755-759 5 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2009

Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y. HK. UY., 2009 Dec 1, In : EcoDesign2009. 6, p. 1233-1236

Research output: Contribution to journalArticle

Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 Jul 1, In : ASME-InterPACK. p. 755-759

Research output: Contribution to journalArticle