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Research Output 1993 2019

  • 1423 Citations
  • 20 h-Index
  • 96 Article
  • 23 Conference contribution
  • 2 Editorial
  • 1 Chapter
2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesives
Camera lenses
Finite element method
Coatings

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Creep
Nanoparticles
Power semiconductor devices

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper
1 Citation (Scopus)

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
fatigue life
crack propagation
Fatigue crack propagation

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

crack propagation
Strain energy
Fatigue crack propagation
flux density
evaluation

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Coarsening
Soldering alloys
Creep
Fatigue of materials
Semiconductor materials

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallic compounds
Cracks
Direction compound
Power semiconductor devices

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 902-908 7 p.

Research output: Contribution to journalArticle

crack propagation
Fatigue crack propagation
fillers
Silicon Dioxide
resins

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 868-875 8 p.

Research output: Contribution to journalArticle

strain distribution
Finite element method
Crystals
crystals
critical loading
2018
1 Citation (Scopus)

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

crack propagation
Fatigue crack propagation
sintering
Sintering
Nanoparticles
3 Citations (Scopus)

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 Mar 1, In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
Fatigue testing
fatigue life
fatigue tests
2017
1 Citation (Scopus)

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

Bismuth
bismuth
plastic deformation
Plastic deformation
Single crystals

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue testing
Thermal fatigue
Copper
Fatigue of materials
Thin films

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue crack propagation
Nanoparticles
Thermal effects
Temperature
2016
2 Citations (Scopus)

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

eutectic alloys
crack propagation
Fatigue crack propagation
Eutectics
strain rate
1 Citation (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Power converters
Thermal cycling
Semiconductor materials
Binary alloys
Fatigue of materials
9 Citations (Scopus)

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 Nov 7, (Accepted/In press) In : Journal of Electronic Materials. p. 1-8 8 p.

Research output: Contribution to journalArticle

fatigue life
crack propagation
Fatigue crack propagation
crack initiation
Fatigue of materials
6 Citations (Scopus)

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In : Materials Transactions. 57, 6, p. 819-823 5 p.

Research output: Contribution to journalArticle

Bismuth
bismuth
plastic deformation
Plastic deformation
Single crystals

Preface

Kariya, Y. & Shohji, I., 2016, In : Materials Transactions. 57, 6, p. 796 1 p.

Research output: Contribution to journalEditorial

1 Citation (Scopus)

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 805-809 5 p.

Research output: Contribution to journalArticle

Epoxy Resins
thermal fatigue
mineral oils
Mineral Oil
Thermal fatigue
2013

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013, ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 6756126

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Finite element method

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Eutectics
Strain rate
Fatigue of materials
Temperature
Ductility
3 Citations (Scopus)

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In : Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

Research output: Contribution to journalArticle

Eutectics
Strain rate
Fatigue of materials
Temperature
Grain boundary sliding

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation
2012

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 Dec 1, In : Materials Transactions. 53, p. 2072-2077

Research output: Contribution to journalArticle

4 Citations (Scopus)

Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In : Materials Transactions. 53, 12, p. 2072-2077 6 p.

Research output: Contribution to journalArticle

strain hardening
Coarsening
Strain hardening
Intermetallics
intermetallics
18 Citations (Scopus)

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Kanda, Y. & Kariya, Y., 2012 Jul, In : Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

Research output: Contribution to journalArticle

creep properties
stress relaxation
Stress relaxation
solders
Soldering alloys

Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 Aug 29, In : Materials Transactions. 53

Research output: Contribution to journalArticle

9 Citations (Scopus)

Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

Kariya, Y., Tajima, S. & Yamada, S., 2012, In : Materials Transactions. 53, 12, p. 2067-2071 5 p.

Research output: Contribution to journalArticle

Fatigue of materials
Strain energy
Single crystals
Thermal fatigue
fatigue life
20 Citations (Scopus)

Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

Kanda, Y., Kariya, Y. & Oto, Y., 2012 Mar, In : Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

Research output: Contribution to journalArticle

strain hardening
solders
ductility
Strain hardening
Soldering alloys

Mechanical reliability of isotropic conductive adhesive

Kariya, Y., 2012 Aug, In : Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.

Research output: Contribution to journalArticle

Adhesives

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2. p. 713-718 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Strain hardening
Ductility
Fatigue of materials
Solid solutions
Soldering alloys
1 Citation (Scopus)

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2. p. 707-712 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Crack initiation
Grain boundaries
Strain hardening
2010

Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y., 2010 Mar 19, In : Default journal.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crack initiation
Soldering alloys
Fatigue of materials
Crack propagation
15 Citations (Scopus)

Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

Kanda, Y. & Kariya, Y., 2010 Feb, In : Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

Research output: Contribution to journalArticle

fatigue life
solders
Soldering alloys
waveforms
Fatigue of materials

Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

K, Y., a, A., Zama, K. & Kariya, Y., 2010 May 1, In : Proc. of ICEP2010. p. 1-6

Research output: Contribution to journalArticle

12 Citations (Scopus)

Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 Oct, In : Materials Transactions. 51, 10, p. 1779-1784 6 p.

Research output: Contribution to journalArticle

Adhesive joints
dwell
adhesives
fatigue life
Fatigue of materials
1 Citation (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Fatigue testing
Mechanical testing
Fatigue of materials
Coarsening
1 Citation (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1. p. 755-759 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Reliability analysis
Fatigue of materials
Finite element method
Viscoelasticity
Thermal cycling
2009

Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y. HK. UY., 2009 Dec 1, In : EcoDesign2009. 6, p. 1233-1236

Research output: Contribution to journalArticle

Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 Jul 1, In : ASME-InterPACK. p. 755-759

Research output: Contribution to journalArticle

1 Citation (Scopus)

Trends of conductive adhesives in electronics

Suganuma, K., Shindo, D., Ohtsuka, K. & Kariya, Y., 2009 Jan, In : Journal of Japan Institute of Electronics Packaging. 12, 1, p. 79-85 7 p.

Research output: Contribution to journalArticle

Adhesives
Electronic equipment
2008

Anisotropic Mechanical Properties of Sn-rich Lead-free Solder

Kariya, Y., 2008 May 1, In : Default journal.

Research output: Contribution to journalArticle