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Research Output 1993 2019

  • 1423 Citations
  • 20 h-Index
  • 96 Article
  • 23 Conference contribution
  • 2 Editorial
  • 1 Chapter
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Chapter
1999
1 Citation (Scopus)

Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint

Kariya, Y., Hirata, Y., Warashina, K. & Otsuka, M., 1999, American Society of Mechanical Engineers, EEP. Vol. 26 3. p. 173-180 8 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

Thermal fatigue
Soldering alloys
Bismuth
Fatigue damage
Fatigue of materials