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Research Output 1993 2019

  • 1423 Citations
  • 20 h-Index
  • 96 Article
  • 23 Conference contribution
  • 2 Editorial
  • 1 Chapter
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Conference contribution
2019

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adhesives
Camera lenses
Finite element method
Coatings

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Creep
Nanoparticles
Power semiconductor devices

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Dielectric films
Fracture energy
Polyimides
Semiconductor materials
Copper

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Coarsening
Soldering alloys
Creep
Fatigue of materials
Semiconductor materials

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Metallic compounds
Cracks
Direction compound
Power semiconductor devices

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 May 1, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue crack propagation
Silver
Grain boundaries
Sintering
Nanoparticles
2017

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue testing
Thermal fatigue
Copper
Fatigue of materials
Thin films

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue crack propagation
Nanoparticles
Thermal effects
Temperature
2016
1 Citation (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Power converters
Thermal cycling
Semiconductor materials
Binary alloys
Fatigue of materials
2013

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013, ICSJ 2013 - IEEE CPMT Symposium Japan. IEEE Computer Society, 6756126

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polyimides
Finite element method

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y. & Fukui, K., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Eutectics
Strain rate
Fatigue of materials
Temperature
Ductility

Microstructural analysis of low-cycle fatigue damage process of Sn-Ag-Cu solder joint

Kontani, H., Kariya, Y. & Fumikura, T., 2013, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. Vol. 1.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue damage
Soldering alloys
Grain boundaries
Stress concentration
Crack propagation
2011

Effect of cyclic strain-hardening exponent on fatigue ductility exponent for Sn based alloy

Kanda, Y., Oto, Y., Shiigi, Y. & Kariya, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2. p. 713-718 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Strain hardening
Ductility
Fatigue of materials
Solid solutions
Soldering alloys
1 Citation (Scopus)

Fatigue life and fracture behavior of micro size Sn-Ag-Cu solder joint

Naoki, T., Kariya, Y. & Kanda, Y., 2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011. Vol. 2. p. 707-712 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Crack initiation
Grain boundaries
Strain hardening
2010
7 Citations (Scopus)

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Y., Sato, K., Asari, S. & Kanda, Y., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501298

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crack initiation
Soldering alloys
Fatigue of materials
Crack propagation
1 Citation (Scopus)

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Fatigue testing
Mechanical testing
Fatigue of materials
Coarsening
1 Citation (Scopus)

Visco-elastic effect of underfill material in reliability analysis of flip-chip package

Kanda, Y., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Sato, T., Enomoto, T. & Hirata, K., 2010, Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 1. p. 755-759 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Reliability analysis
Fatigue of materials
Finite element method
Viscoelasticity
Thermal cycling
2007
7 Citations (Scopus)

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Kobayashi, T., Kariya, Y., Sasaki, T., Tanaka, M. & Tatsumi, K., 2007, Proceedings - Electronic Components and Technology Conference. p. 684-688 5 p. 4249956

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue of materials
Bending tests
Crack propagation
Temperature
Substrates
2006

Low cycle fatigue properties of solder alloys evaluated by micro bulk specimen

Kariya, Y., Suga, T., Niimi, T. & Otsuka, M., 2006, Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C. p. 1827-1832 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Fatigue testing
Fatigue damage
Extrusion
2005
4 Citations (Scopus)

Mechanical properties of lead-free solder alloys evaluated by miniature size specimen

Kariya, Y., Asai, T. & Suga, T., 2005, Proceedings of SPIE - The International Society for Optical Engineering. Quan, C., Chau, F. S., Asundi, A., Wong, B. S. & Lim, C. T. (eds.). Vol. 5852 PART I. p. 297-301 5 p. 48

Research output: Chapter in Book/Report/Conference proceedingConference contribution

solders
mechanical properties
Mechanical properties
Dendrites (metallography)
Fatigue testing
2004
4 Citations (Scopus)

Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M. & Suga, T., 2004, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Ramakrishna, K., Sammakia, B. G., Culham, J. R., Joshi, Y. K., Hock-Lye Pang, J., Jonnalagadda, K., Tonapi, S., Refai-Ahmed, G., Tom Lee, T. Y., Copeland, D. W. & Ellesworth Jr., M. J. (eds.). Vol. 2. p. 103-108 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver
Fatigue of materials
Durability
Microstructure
Intermetallics
2003

Isothermal shear fatigue life of Sn-xAg-0.5Cu flip chip interconnects

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2003, Advances in Electronic Packaging. Vol. 1. p. 155-160 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soldering alloys
Fatigue of materials
Silver
Plastic deformation
Shear deformation
1999
3 Citations (Scopus)

Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999 Jan 1, Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Institute of Electrical and Electronics Engineers Inc., p. 626-631 6 p. 747688

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Thermal fatigue
Fatigue damage
Soldering alloys
Fatigue of materials
Bismuth