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A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, M., Anzai, N., Sakamaki, K. & Kariya, Y., 2013 Jan 1.

Research output: Contribution to conferencePaper

Fatigue life enhancement of low silver content Sn-Ag-Cu flip-chip interconnects by Ni addition

Kariya, Y., Hosoi, T., Kimura, T., Terashima, S., Tanaka, M. & Suga, T., 2004 Sep 20, p. 103-108. 6 p.

Research output: Contribution to conferencePaper

4 Citations (Scopus)