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2019

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 902-908 7 p.

Research output: Contribution to journalArticle

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 868-875 8 p.

Research output: Contribution to journalArticle

2018

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 Mar 1, In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
2017

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2016

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016 Jan 1, In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 Nov 7, (Accepted/In press) In : Journal of Electronic Materials. p. 1-8 8 p.

Research output: Contribution to journalArticle

14 Citations (Scopus)

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016 Jan 1, In : Materials Transactions. 57, 6, p. 819-823 5 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016 Jan 1, In : Materials Transactions. 57, 6, p. 805-809 5 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2013

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013 Oct 21, In : Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

Research output: Contribution to journalArticle

3 Citations (Scopus)
2012

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 Dec 1, In : Materials Transactions. 53, p. 2072-2077

Research output: Contribution to journalArticle

Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

Kanda, Y., Kariya, Y. & Tasaka, T., 2012 Dec 12, In : Materials Transactions. 53, 12, p. 2072-2077 6 p.

Research output: Contribution to journalArticle

6 Citations (Scopus)

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Kanda, Y. & Kariya, Y., 2012 Jul 1, In : Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

Research output: Contribution to journalArticle

19 Citations (Scopus)

Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 Aug 29, In : Materials Transactions. 53

Research output: Contribution to journalArticle

Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

Kariya, Y., Tajima, S. & Yamada, S., 2012 Dec 12, In : Materials Transactions. 53, 12, p. 2067-2071 5 p.

Research output: Contribution to journalArticle

9 Citations (Scopus)

Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

Kanda, Y., Kariya, Y. & Oto, Y., 2012 Mar 1, In : Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

Research output: Contribution to journalArticle

21 Citations (Scopus)

Mechanical reliability of isotropic conductive adhesive

Kariya, Y., 2012 Aug 1, In : Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.

Research output: Contribution to journalArticle

2010

Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y., 2010 Mar 19, In : Default journal.

Research output: Contribution to journalArticle

Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

Kanda, Y. & Kariya, Y., 2010 Feb 1, In : Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

Research output: Contribution to journalArticle

15 Citations (Scopus)

Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

K, Y., a, A., Zama, K. & Kariya, Y., 2010 May 1, In : Proc. of ICEP2010. p. 1-6

Research output: Contribution to journalArticle

Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 Oct 1, In : Materials Transactions. 51, 10, p. 1779-1784 6 p.

Research output: Contribution to journalArticle

12 Citations (Scopus)
2009

Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y. HK. UY., 2009 Dec 1, In : EcoDesign2009. 6, p. 1233-1236

Research output: Contribution to journalArticle

Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 Jul 1, In : ASME-InterPACK. p. 755-759

Research output: Contribution to journalArticle

Trends of conductive adhesives in electronics

Suganuma, K., Shindo, D., Ohtsuka, K. & Kariya, Y., 2009 Jan 1, In : Journal of Japan Institute of Electronics Packaging. 12, 1, p. 79-85 7 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
2008

Anisotropic Mechanical Properties of Sn-rich Lead-free Solder

Kariya, Y., 2008 May 1, In : Default journal.

Research output: Contribution to journalArticle

Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 Mar 1, In : Smart Processing Technology, High Temperature Society of Japan. p. 99-102

Research output: Contribution to journalArticle

Effect of hold time on low cycle fatigue life of micro solder joint

Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 Jul 1, In : Materials Transactions. 49, 7, p. 1524-1530 7 p.

Research output: Contribution to journalArticle

16 Citations (Scopus)

Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 May 1, In : Materials Transactions. 49, 5, p. 1175-1179 5 p.

Research output: Contribution to journalArticle

19 Citations (Scopus)

IEC 62137-1-4 (Cyclic bending test)

Kariya, Y., 2008 Mar 1, In : Default journal.

Research output: Contribution to journalArticle

Mechanical characteristics of lead-free solder alloys in small volume

Kariya, Y., 2008 Aug 1, In : Journal of Japan Institute of Electronics Packaging. 11, 5, p. 368-374 7 p.

Research output: Contribution to journalArticle

2007

Low-cycle fatigue properties of eutectic solders at high temperatures

Kariya, Y. & Suga, T., 2007 May 1, In : Fatigue and Fracture of Engineering Materials and Structures. 30, 5, p. 413-419 7 p.

Research output: Contribution to journalArticle

19 Citations (Scopus)

Mechanical Properties

Kariya, Y., 2007 Jan 1, In : Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 76, 2, p. 109-113 5 p.

Research output: Contribution to journalArticle

Mechanical Properties of Lead-free Solder in Small Volume

Kariya, Y., 2007 May 1, In : Default journal.

Research output: Contribution to journalArticle

2006

Mechanical Reliability of Solders in Small Volume

Kariya, Y., 2006 Jan 1, In : Journal of Japan Institute of Electronics Packaging. 9, 3, p. 138-142 5 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
2005

Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaliated Miniature Size Specimen

Kariya, Y., Niimi, T. & Suga, T., 2005 Jul 1, In : Default journal.

Research output: Contribution to journalArticle

Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen

Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 Nov 1, In : Materials Transactions. 46, 11, p. 2309-2315 7 p.

Research output: Contribution to journalArticle

43 Citations (Scopus)

Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen

Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 Nov 15, In : Materials Transactions. 46, p. 2309-2315

Research output: Contribution to journalArticle

Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

Kariya, Y., Niimi, T. & Suga, T., 2005 Jul 1, In : Default journal.

Research output: Contribution to journalArticle

1 Citation (Scopus)
2004

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 Apr 1, In : Journal of Electronic Materials. 33, p. 321-328

Research output: Contribution to journalArticle

74 Citations (Scopus)

Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 Apr, In : Journal of Electronic Materials. 33, 4, p. 321-328 8 p.

Research output: Contribution to journalArticle

74 Citations (Scopus)