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Research Output 1993 2019

  • 1418 Citations
  • 20 h-Index
  • 96 Article
  • 23 Conference contribution
  • 2 Editorial
  • 1 Chapter
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Article
2019
1 Citation (Scopus)

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
fatigue life
crack propagation
Fatigue crack propagation

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

crack propagation
Strain energy
Fatigue crack propagation
flux density
evaluation

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 902-908 7 p.

Research output: Contribution to journalArticle

crack propagation
Fatigue crack propagation
fillers
Silicon Dioxide
resins

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 868-875 8 p.

Research output: Contribution to journalArticle

strain distribution
Finite element method
Crystals
crystals
critical loading
2018
1 Citation (Scopus)

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

crack propagation
Fatigue crack propagation
sintering
Sintering
Nanoparticles
3 Citations (Scopus)

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 Mar 1, In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

thermal fatigue
Thermal fatigue
Fatigue testing
fatigue life
fatigue tests
2017
1 Citation (Scopus)

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

Bismuth
bismuth
plastic deformation
Plastic deformation
Single crystals
2016
2 Citations (Scopus)

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

eutectic alloys
crack propagation
Fatigue crack propagation
Eutectics
strain rate
9 Citations (Scopus)

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 Nov 7, (Accepted/In press) In : Journal of Electronic Materials. p. 1-8 8 p.

Research output: Contribution to journalArticle

fatigue life
crack propagation
Fatigue crack propagation
crack initiation
Fatigue of materials
6 Citations (Scopus)

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In : Materials Transactions. 57, 6, p. 819-823 5 p.

Research output: Contribution to journalArticle

Bismuth
bismuth
plastic deformation
Plastic deformation
Single crystals
1 Citation (Scopus)

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 805-809 5 p.

Research output: Contribution to journalArticle

Epoxy Resins
thermal fatigue
mineral oils
Mineral Oil
Thermal fatigue
2013
3 Citations (Scopus)

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Sato, T., Kariya, Y., Fukui, K., Matsuoka, H. & Yano, M., 2013, In : Journal of Japan Institute of Electronics Packaging. 16, 4, p. 293-299 7 p.

Research output: Contribution to journalArticle

Eutectics
Strain rate
Fatigue of materials
Temperature
Grain boundary sliding
2012

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of SnAgCu Joint

K, Y., a, A., Tasaka, Y. KT. & Kariya, Y., 2012 Dec 1, In : Materials Transactions. 53, p. 2072-2077

Research output: Contribution to journalArticle

4 Citations (Scopus)

Effect of strain-enhanced microstructural coarsening on the cyclic strain-hardening exponent of Sn-Ag-Cu joints

Kanda, Y., Kariya, Y. & Tasaka, T., 2012, In : Materials Transactions. 53, 12, p. 2072-2077 6 p.

Research output: Contribution to journalArticle

strain hardening
Coarsening
Strain hardening
Intermetallics
intermetallics
18 Citations (Scopus)

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Kanda, Y. & Kariya, Y., 2012 Jul, In : Microelectronics Reliability. 52, 7, p. 1435-1440 6 p.

Research output: Contribution to journalArticle

creep properties
stress relaxation
Stress relaxation
solders
Soldering alloys

Influence of Crystallographic Orientation on Fatigue Reliability of beta-Sn and beta-Sn Micro-joint

Kariya, Y., TAJIMA, Y. KS. & YAMADA, S., 2012 Aug 29, In : Materials Transactions. 53

Research output: Contribution to journalArticle

9 Citations (Scopus)

Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint

Kariya, Y., Tajima, S. & Yamada, S., 2012, In : Materials Transactions. 53, 12, p. 2067-2071 5 p.

Research output: Contribution to journalArticle

Fatigue of materials
Strain energy
Single crystals
Thermal fatigue
fatigue life
20 Citations (Scopus)

Influence of cyclic strain-hardening exponent on fatigue ductility exponent for a Sn-Ag-Cu micro-solder joint

Kanda, Y., Kariya, Y. & Oto, Y., 2012 Mar, In : Journal of Electronic Materials. 41, 3, p. 580-587 8 p.

Research output: Contribution to journalArticle

strain hardening
solders
ductility
Strain hardening
Soldering alloys

Mechanical reliability of isotropic conductive adhesive

Kariya, Y., 2012 Aug, In : Journal of Japan Institute of Electronics Packaging. 15, 5, p. 340-343 4 p.

Research output: Contribution to journalArticle

Adhesives
2010

Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y., 2010 Mar 19, In : Default journal.

Research output: Contribution to journalArticle

15 Citations (Scopus)

Influence of asymmetrical waveform on low-cycle fatigue life of micro solder joint

Kanda, Y. & Kariya, Y., 2010 Feb, In : Journal of Electronic Materials. 39, 2, p. 238-245 8 p.

Research output: Contribution to journalArticle

fatigue life
solders
Soldering alloys
waveforms
Fatigue of materials

Influence of Inelastic Constitutive Equation on Fatigue Life Prediction of Sn-Ag-Cu Micro Solder Joint

K, Y., a, A., Zama, K. & Kariya, Y., 2010 May 1, In : Proc. of ICEP2010. p. 1-6

Research output: Contribution to journalArticle

12 Citations (Scopus)

Influence of temperature and dwelling time on low-cycle fatigue characteristic of isotropic conductive adhesive joint

Kariya, Y., Kanda, Y., Iguchi, K. & Furusawa, H., 2010 Oct, In : Materials Transactions. 51, 10, p. 1779-1784 6 p.

Research output: Contribution to journalArticle

Adhesive joints
dwell
adhesives
fatigue life
Fatigue of materials
2009

Basic Study on Disassembly Technique of Solder Joint Using Allotropic Transformation of Tin

Hirano, Y. & Kariya, Y. HK. UY., 2009 Dec 1, In : EcoDesign2009. 6, p. 1233-1236

Research output: Contribution to journalArticle

Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

K, Y., a, A., Zama, K., Kariya, Y., Mikami, T., Kobayashi, T., Enomoto, T. & Hirata, K., 2009 Jul 1, In : ASME-InterPACK. p. 755-759

Research output: Contribution to journalArticle

1 Citation (Scopus)

Trends of conductive adhesives in electronics

Suganuma, K., Shindo, D., Ohtsuka, K. & Kariya, Y., 2009 Jan, In : Journal of Japan Institute of Electronics Packaging. 12, 1, p. 79-85 7 p.

Research output: Contribution to journalArticle

Adhesives
Electronic equipment
2008

Anisotropic Mechanical Properties of Sn-rich Lead-free Solder

Kariya, Y., 2008 May 1, In : Default journal.

Research output: Contribution to journalArticle

Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

Shohji, I., Osawa, T., Matsuki, T., Yasuda, K., Takemoto, T. & Kariya, Y., 2008 Mar 1, In : Smart Processing Technology, High Temperature Society of Japan. p. 99-102

Research output: Contribution to journalArticle

16 Citations (Scopus)

Effect of hold time on low cycle fatigue life of micro solder joint

Kanda, Y., Kariya, Y. & Mochizuki, Y., 2008 Jul, In : Materials Transactions. 49, 7, p. 1524-1530 7 p.

Research output: Contribution to journalArticle

fatigue life
solders
Soldering alloys
Fatigue of materials
cycles
19 Citations (Scopus)

Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

Shohji, I., Osawa, T., Matsuki, T., Kariya, Y., Yasuda, K. & Takemoto, T., 2008 May, In : Materials Transactions. 49, 5, p. 1175-1179 5 p.

Research output: Contribution to journalArticle

tensile properties
solders
Tensile properties
Eutectics
Aging of materials

IEC 62137-1-4 (Cyclic bending test)

Kariya, Y., 2008 Mar 1, In : Default journal.

Research output: Contribution to journalArticle

Mechanical characteristics of lead-free solder alloys in small volume

Kariya, Y., 2008 Aug, In : Journal of Japan Institute of Electronics Packaging. 11, 5, p. 368-374 7 p.

Research output: Contribution to journalArticle

Lead-free solders
2007
19 Citations (Scopus)

Low-cycle fatigue properties of eutectic solders at high temperatures

Kariya, Y. & Suga, T., 2007 May, In : Fatigue and Fracture of Engineering Materials and Structures. 30, 5, p. 413-419 7 p.

Research output: Contribution to journalArticle

Soldering alloys
Eutectics
Grain boundary sliding
Fatigue of materials
Temperature

Mechanical Properties

Kariya, Y., 2007 Jan 1, In : Yosetsu Gakkai Shi/Journal of the Japan Welding Society. 76, 2, p. 109-113 5 p.

Research output: Contribution to journalArticle

Mechanical properties

Mechanical Properties of Lead-free Solder in Small Volume

Kariya, Y., 2007 May 1, In : Default journal.

Research output: Contribution to journalArticle

2006
2 Citations (Scopus)

Mechanical Reliability of Solders in Small Volume

Kariya, Y., 2006, In : Journal of Japan Institute of Electronics Packaging. 9, 3, p. 138-142 5 p.

Research output: Contribution to journalArticle

Soldering alloys
2005

Isothermal Fatigue Properties of Lead-Free Solder Alloy Evaliated Miniature Size Specimen

Kariya, Y., Niimi, T. & Suga, T., 2005 Jul 1, In : Default journal.

Research output: Contribution to journalArticle

42 Citations (Scopus)

Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen

Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 Nov, In : Materials Transactions. 46, 11, p. 2309-2315 7 p.

Research output: Contribution to journalArticle

Fatigue of materials
fatigue life
solders
Soldering alloys
cracks

Isothermal Fatigue Properties of Sn-Ag-Cu Alloy Evalulated by Micro Size Specimen

Kariya, Y., Niimi, T., Suga, T. & Otsuka, M., 2005 Nov 15, In : Materials Transactions. 46, p. 2309-2315

Research output: Contribution to journalArticle

Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

Kariya, Y., Niimi, T. & Suga, T., 2005 Jul 1, In : Default journal.

Research output: Contribution to journalArticle

1 Citation (Scopus)
Thermal fatigue
Soldering alloys
Mechanical properties
2004
71 Citations (Scopus)

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 Apr 1, In : Journal of Electronic Materials. 33, p. 321-328

Research output: Contribution to journalArticle

71 Citations (Scopus)

Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

Kariya, Y., Hosoi, T., Terashima, S., Tanaka, M. & Otsuka, M., 2004 Apr, In : Journal of Electronic Materials. 33, 4, p. 321-328 8 p.

Research output: Contribution to journalArticle

solders
Silver
Soldering alloys
shear stress
chips