“3-D Interconnect Technology For Ultra-Compact MMICs” (Invited Paper)

Makoto Hirano

    Research output: Contribution to journalArticle

    Original languageEnglish
    Pages (from-to)18-19
    JournalTropical Workshop on Heterostructure Microelectronics
    Publication statusPublished - 1996 Aug 1

    Cite this

    “3-D Interconnect Technology For Ultra-Compact MMICs” (Invited Paper). / Hirano, Makoto.

    In: Tropical Workshop on Heterostructure Microelectronics, 01.08.1996, p. 18-19.

    Research output: Contribution to journalArticle

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    title = "“3-D Interconnect Technology For Ultra-Compact MMICs” (Invited Paper)",
    author = "Makoto Hirano",
    year = "1996",
    month = "8",
    day = "1",
    language = "English",
    pages = "18--19",
    journal = "Tropical Workshop on Heterostructure Microelectronics",

    }

    TY - JOUR

    T1 - “3-D Interconnect Technology For Ultra-Compact MMICs” (Invited Paper)

    AU - Hirano, Makoto

    PY - 1996/8/1

    Y1 - 1996/8/1

    M3 - Article

    SP - 18

    EP - 19

    JO - Tropical Workshop on Heterostructure Microelectronics

    JF - Tropical Workshop on Heterostructure Microelectronics

    ER -