820 pin PGA for ultralarge-scale BiCMOS devices

Yoichi Hiruta, Naohiko Hirano, Yasuhiro Yamaji, Minoru Mukai, Yohichiro Motoyama, Ryoji Homma, Jun ichi Ohno, Toshio Sudo

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

A high pin count and high performance PGA has been developed for next-generation ASIC devices which apply half-micron BiCMOS technology and have a maximum usable gate count of 300k. This new package has been designed with due consideration of all package functions, electrical, thermal, and mechanical. A surface mount type pin joint was adopted to realize a high wiring density of the printed wiring board. The electrical characteristics of the package have realized a complete transmitted signal form above 50 MHz. The high reliability of the package and surface mount type soldering has been confirmed from temperature-cycling tests and fatigue life estimation.

Original languageEnglish
Pages (from-to)893-901
Number of pages9
JournalIEEE transactions on components, hybrids, and manufacturing technology
Volume16
Issue number8
DOIs
Publication statusPublished - 1993 Dec

Fingerprint

Prostaglandins A
BiCMOS technology
Soldering
Electric wiring
Application specific integrated circuits
Printed circuit boards
Fatigue of materials
Temperature
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Hiruta, Y., Hirano, N., Yamaji, Y., Mukai, M., Motoyama, Y., Homma, R., ... Sudo, T. (1993). 820 pin PGA for ultralarge-scale BiCMOS devices. IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 893-901. https://doi.org/10.1109/33.273690

820 pin PGA for ultralarge-scale BiCMOS devices. / Hiruta, Yoichi; Hirano, Naohiko; Yamaji, Yasuhiro; Mukai, Minoru; Motoyama, Yohichiro; Homma, Ryoji; Ohno, Jun ichi; Sudo, Toshio.

In: IEEE transactions on components, hybrids, and manufacturing technology, Vol. 16, No. 8, 12.1993, p. 893-901.

Research output: Contribution to journalArticle

Hiruta, Y, Hirano, N, Yamaji, Y, Mukai, M, Motoyama, Y, Homma, R, Ohno, JI & Sudo, T 1993, '820 pin PGA for ultralarge-scale BiCMOS devices', IEEE transactions on components, hybrids, and manufacturing technology, vol. 16, no. 8, pp. 893-901. https://doi.org/10.1109/33.273690
Hiruta, Yoichi ; Hirano, Naohiko ; Yamaji, Yasuhiro ; Mukai, Minoru ; Motoyama, Yohichiro ; Homma, Ryoji ; Ohno, Jun ichi ; Sudo, Toshio. / 820 pin PGA for ultralarge-scale BiCMOS devices. In: IEEE transactions on components, hybrids, and manufacturing technology. 1993 ; Vol. 16, No. 8. pp. 893-901.
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