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• The results and future prospects of the LHCf experiment

  Menjo, H., Adriani, O., Berti, E., Bonechi, L., Bongi, M., Castellini, G., D'Alessandro, R., Hagenauer, M., Itow, Y., Kasahara, K., Matsubara, Y., Muraki, Y., Ohashi, K., Papini, P., Ricciarini, S., Sako, T., Sakurai, N., Sato, K., Shimizu, Y., Silveri, L. & 7 others, Tamura, T., Tiberio, A., Torii, S., Tricomi, A., Turner, W. C., Ueno, M. & Yoshida, K., 2019, In: Proceedings of Science. 358

  Research output: Contribution to journal › Conference article › peer-review

• The rhythm and amplitude of the EMG activities of paralyzed muscle groups using a new style of walking orthosis for paraplegia.

  Yano, H., Yano., H., Kaneko, S., Nakazawa, K., Yamamoto, S. & Kojima, N., 1997 Oct 1, In: Default journal.

  Research output: Contribution to journal › Article › peer-review

• The RIKEN-RAL muon facility and the application of muons for studies of magnetic properties of nano-materials

  Watanabe, I., Yoon, S., Suprayoga, E., Adam, N., Mohd-Tajudin, S. S., Sari, D. P., Asih, R., Astuti, F., Angel, J., Umar, M. D., Sulaiman, S. & Mohamed-Ibrahim, M. I., 2017, Symposium on Nanosciences and Chemistry - ICST 2016. Kartini, I., Roto, R., Siswanta, D., Triyana, K. & Triyana, K. (eds.). Trans Tech Publications Ltd, p. 37-43 7 p. (Materials Science Forum; vol. 901 MSF).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• The Risk-Based Floodplain Regulation of Shiga Prefecture in Japan

  Ichidate, S., Tsuji, M., Taki, K. & Nakamura, H., 2016 Oct 20, In: E3S Web of Conferences. 7, 13008.

  Research output: Contribution to journal › Conference article › peer-review

  Open Access
  3 Citations (Scopus)

• Thermal amplification of photoinduced optical anisotropy of p-cyanoazobenzene polymer films monitored by temperature scanning ellipsometry

  Kidowaki, M., Fujiwara, T., Morino, S., Ichimura, K. & Stumpe, J., 2000 Mar 13, In: Applied Physics Letters. 76, 11, p. 1377-1379 3 p.

  Research output: Contribution to journal › Article › peer-review
  50 Citations (Scopus)

• Thermal Analysis of the Double-Crucible Method in Continuous Silicon Czochralski Processing

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 Jul, In: Journal of the Electrochemical Society. 140, 7, p. 2106-2111 6 p.

  Research output: Contribution to journal › Article › peer-review
  6 Citations (Scopus)

• Thermal Analysis of the Double-Crucible Method in Continuous Silicon Czochralski Processing: I. Experimental Analysis

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 Jul, In: Journal of the Electrochemical Society. 140, 7, p. 2101-2105 5 p.

  Research output: Contribution to journal › Article › peer-review
  7 Citations (Scopus)

• Thermal Analysis on Double-Crucible Method in Continuous Silicon CZ Technology I

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 Jul 1, In: Journal of the Electrochemical Society. 140, p. 2101-2105

  Research output: Contribution to journal › Article › peer-review

  7 Citations (Scopus)

• Thermal Analysis on Double-Crucible Method in Continuous Silicon CZ Technology II

  Ono, N., Kida, M., Arai, Y. & Sahira, K., 1993 Jul 1, In: Journal of the Electrochemical Society. 140, p. 2106-2111

  Research output: Contribution to journal › Article › peer-review

  6 Citations (Scopus)

• Thermal and magnetic behaviors of a melt-textured superconducting bulk magnet in the zero-field-cooling magnetizing process

  Oka, T., Yokoyama, K., Fujishiro, H. & Noto, K., 2009, In: Superconductor Science and Technology. 22, 6, 065014.

  Research output: Contribution to journal › Article › peer-review
  10 Citations (Scopus)

• Thermal and mechanical coupling in granular modeling for metal injection molding

  Iwai, T., Aizawa, T. & Kihara, J., 1994 Apr, In: Journal of Materials Processing Tech.. 42, 2, p. 175-185 11 p.

  Research output: Contribution to journal › Article › peer-review
  8 Citations (Scopus)

• Thermal and mechanical coupling in granular modeling for metal injection molding.

  Iwai, T., Aizawa, T. & Kihara, J., 1800, In: J. Materials Processing Technology.. 42 (1994), p. 175-185

  Research output: Contribution to journal › Article › peer-review

• Thermal and mechanical properties of high T_c bulk superconductors and their applications

  Noto, K., Oka, T., Yokoyama, K., Katagiri, K., Fujishiro, H., Okada, H., Nakazawa, H., Muralidhar, M. & Murakami, M., 2003 Oct, In: Physica C: Superconductivity and its applications. 392-396, PART 1, p. 677-683 7 p.

  Research output: Contribution to journal › Conference article › peer-review
  16 Citations (Scopus)

• Thermal and microstructural analysis of the Y-Ba-Cu-O/Ag equilibrium around the critical composition YBa₂Cu₃O_x/Ag 35 mass%

  Costa, G. A. & Mele, P., 2001, In: Journal of Thermal Analysis and Calorimetry. 66, 1, p. 17-25 9 p.

  Research output: Contribution to journal › Conference article › peer-review
  2 Citations (Scopus)

• Thermal and x-ray analyses of high temperature superconductor YBa2Cu3O6.74

  Kikuchi, M., Syono, Y., Tokiwa, A., Oh-Ishi, K., Arai, H., Hiraga, K., Kobayashi, N. & Sasaoka, T., 1987 Jun, In: Japanese Journal of Applied Physics. 26, 6A, p. 1066-1099 34 p.

  Research output: Contribution to journal › Article › peer-review
  56 Citations (Scopus)

• Thermal annealing behavior of defects induced by ion implantation in thermally grown SiO₂ films

  Seol, K. S., Karasawa, T., Ohki, Y., Nishikawa, H. & Takiyama, M., 1997 Jun, In: Microelectronic Engineering. 36, 1-4, p. 193-195 3 p.

  Research output: Contribution to journal › Article › peer-review
  6 Citations (Scopus)

• Thermal annealing behavior of defects induced by ion implantation in thermally grown SiO2 films

  Seol, K. S., Karasawa, T., Ohki, Y., Nishikawa, H. & Takiyama, M., 1997 Jan 1, In: Microelectrons Engineering. 36, p. 193-195

  Research output: Contribution to journal › Article › peer-review

  6 Citations (Scopus)

• Thermal annealing effects on Ni/Au based Schottky contacts on n-GaN and AlGaN/GaN with insertion of high work function metal

  Miura, N., Nanjo, T., Suita, M., Oishi, T., Abe, Y., Ozeki, T., Ishikawa, H., Egawa, T. & Jimbo, T., 2004 May 1, In: Solid-State Electronics. 48, 5, p. 689-695 7 p.

  Research output: Contribution to journal › Article › peer-review
  151 Citations (Scopus)

• Thermal-assisted back-extraction of inert platinum group metals from [Hbet][Tf₂N] ionic liquid phase to oxalic acid aqueous solution

  Kono, S., Arai, T. & Takao, K., 2021, In: Journal of Nuclear Science and Technology. 58, 8, p. 941-946 6 p.

  Research output: Contribution to journal › Article › peer-review
  1 Citation (Scopus)

• Thermal behavior and field-trapping property of melt-textured superconducting bulk magnets activated by quasi-static magnetic fields

  Oka, T., Yokoyama, K., Fujishiro, H. & Noto, K., 2009, In: Journal of Physics: Conference Series. 150, 5, 052195.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  2 Citations (Scopus)

• Thermal Characterization of Resin Die-bond Defects for VLSI Packages

  Y.Yamaji, Y. Y., Y.Tsuboi, Y. T., O.Yamagata, O. Y., H.Nakayoshi, H. N., M.Nii, M. N., T.Sudo, T. S. & Sudo, T., 1994 Dec 5, In: The 2nd VLSI Packaging Workshop of Japan,. p. 123-126

  Research output: Contribution to journal › Article › peer-review

• Thermal Comfort and Productivity - Evaluation of Workplace Environment

  Akimoto, T., 2008 Jul 1, In: International Symposium on the Interaction between Human and Building Environment (Seoul, Korea).

  Research output: Contribution to journal › Article › peer-review

• Thermal comfort and productivity - Evaluation of workplace environment in a task conditioned office

  Akimoto, T., Tanabe, S. I., Yanai, T. & Sasaki, M., 2010 Jan, In: Building and Environment. 45, 1, p. 45-50 6 p.

  Research output: Contribution to journal › Article › peer-review
  113 Citations (Scopus)

• Thermal comfort and productivity in offices under mandatory electricity savings after great east Japan earthquake

  Tanabe, S. I., Iwahashi, YUK. & Tsushima, S., 2012.

  Research output: Contribution to conference › Paper › peer-review
  4 Citations (Scopus)

• Thermal comfort and productivity in offices under mandatory electricity savings after the Great East Japan earthquake

  Tanabe, S. I., Iwahashi, Y., Tsushima, S. & Nishihara, N., 2013 Feb 1, In: Architectural Science Review. 56, 1, p. 4-13 10 p.

  Research output: Contribution to journal › Article › peer-review
  54 Citations (Scopus)

• Thermal Comfort and Productivity with Three Different Task Conditioning Systems

  T.Akimoto, T. A., Tanabe, S., Amai, H., Genma, T. & Akimoto, T., 2005 Oct 1, In: Default journal.

  Research output: Contribution to journal › Article › peer-review

• Thermal Comfort for Pedestrians in the Street in Japanese Cities in Summer

  MIURA.Masao, MIURA. M. & Miura, M., 1994 Sep 17, In: Proceedings of 14th EAROPH World Planning Congress 1994 in BEIJING. p. 398-402

  Research output: Contribution to journal › Article › peer-review

• Thermal Comfort in Japanese Cities in Summer

  MIURA, M., 1993 Sep 28, In: Congress Report of IFHP International Congress 1993 in Helsinki.

  Research output: Contribution to journal › Article › peer-review

• Thermal comfort in transitional metabolism based on subjective experiments with ceiling supply task conditioning system

  Akimoto, T., Ohta, H., Hashimoto, S., Nishino, A., Chikamoto, T. & Nakamura, S., 2011 Dec 1, 12th International Conference on Indoor Air Quality and Climate 2011. p. 2652-2653 2 p. (12th International Conference on Indoor Air Quality and Climate 2011; vol. 4).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• Thermal conductivity across the metal-insulator transition in the single-crystalline hyperkagome antiferromagnet Na3+xIr3 O8

  Fauqué, B., Xu, X., Bangura, A. F., Hunter, E. C., Yamamoto, A., Behnia, K., Carrington, A., Takagi, H., Hussey, N. E. & Perry, R. S., 2015 Feb 25, In: Physical Review B - Condensed Matter and Materials Physics. 91, 7, 075129.

  Research output: Contribution to journal › Article › peer-review
  11 Citations (Scopus)

• Thermal conductivity and structural instability in La- and Cu-site-substituted La2CuO4

  Sera, M., Maki, M., Hiroi, M., Kobayashi, N., Suzuki, T. & Fukase, T., 1995, In: Physical Review B. 52, 2, p. R735-R738

  Research output: Contribution to journal › Article › peer-review
  13 Citations (Scopus)

• Thermal conductivity and themoelectric power of DyBaCuO bulk superconductor

  Fujishiro, H., Nariki, S., Murakami, M. & Saito, M., 2007 Oct 21, In: 5th International Workshop on Processing and Applications of Superconducting (RE)BCO Large Grain Materials. p. 21PP03

  Research output: Contribution to journal › Article › peer-review

• Thermal conductivity and thermoelectric power of DyBaCuO bulk superconductors

  Fujishiro, H., Nariki, S. & Murakami, M., 2006 Jul, In: Superconductor Science and Technology. 19, 7, p. S447-S450

  Research output: Contribution to journal › Article › peer-review
  12 Citations (Scopus)

• Thermal conductivity and thermoelectric power of DyBaCuO superconductors

  Fujishiro, H., Nariki, S., Murakami, M. & Saito, M., 2006 Jul 1, In: Superconductor Science and Technology. 19, p. S447-S450

  Research output: Contribution to journal › Article › peer-review

• Thermal conductivity of Er-Ba-Cu-O and Ho-Ba-Cu-O superconducting bulks

  Naito, T., Fujishiro, H., Iida, K., Nariki, S. & Murakami, M., 2008 Aug 1, In: Superconductor Science and Technology. 21, 8, 085001.

  Research output: Contribution to journal › Article › peer-review
  1 Citation (Scopus)

• Thermal conductivity of superconducting joint of Y-Ba-Cu-O bulk materials

  Satoh, T., Iida, K., Yoshioka, J., Sakai, N., Murakami, M. & Noto, K., 2003 Oct, In: Physica C: Superconductivity and its applications. 392-396, PART 1, p. 669-672 4 p.

  Research output: Contribution to journal › Conference article › peer-review

• Thermal cyclic properties of ti-pd-pt-zr high-temperature shape memory alloys

  Tasaki, W., Shimojo, M. & Yamabe-Mitarai, Y., 2019 Nov, In: Crystals. 9, 11, 595.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  3 Citations (Scopus)

• Thermal decomposition of ammonia borane at high pressures

  Nyĺn, J., Sato, T., Soignard, E., Yarger, J. L., Stoyanov, E. & Häussermann, U., 2009, In: Journal of Chemical Physics. 131, 10, 104506.

  Research output: Contribution to journal › Article › peer-review
  49 Citations (Scopus)

• Thermal design for wick recirculation of AMTEC cells

  Tanaka, K., 1997, In: KAGAKU KOGAKU RONBUNSHU. 23, 2, 1 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  2 Citations (Scopus)

• Thermal designing on a small-sized AMTEC cell

  Tanaka, K., Fuji, T. & Honda, T., 2002, In: Proceedings of the Intersociety Energy Conversion Engineering Conference. p. 394-399 6 p.

  Research output: Contribution to journal › Conference article › peer-review
  3 Citations (Scopus)

• Thermal Designing on Wick Return AMTEC Cells

  Tanaka, K., Williams, R. M., Underwood, M. L., Ryan, M. A. & Nakamura, A., 1993 Jun 1, In: Default journal. p. 731-735

  Research output: Contribution to journal › Article › peer-review

• Thermal Effects of Brillouin Gain Spectra in Singlemode Fibers

  Kurashima, T., Horiguchi, T. & Tateda, M., 1990 Oct, In: IEEE Photonics Technology Letters. 2, 10, p. 718-720 3 p.

  Research output: Contribution to journal › Article › peer-review
  70 Citations (Scopus)

• Thermal effects on the Brillouin frequency shift in jacketed optical silica fibers

  Kurashima, T., Horiguchi, T. & Tateda, M., 1990 May 1, In: Appl. Opt.. 29, p. 2219-2222

  Research output: Contribution to journal › Article › peer-review

  184 Citations (Scopus)

• Thermal efficiency evaluation of HI synthesis/concentration procedures in the thermochemical water splitting IS process

  Kasahara, S., Kubo, S., Onuki, K. & Nomura, M., 2004 May, In: International Journal of Hydrogen Energy. 29, 6, p. 579-587 9 p.

  Research output: Contribution to journal › Article › peer-review
  85 Citations (Scopus)

• Thermal Efficiency of the IS Process for Thermochemical Hydrogen Production Using the HTGR

  Kasahara, S., Hwang, G-J., Choi, H-S., Onuki, K. & Nomura, M., 2003 Sep 15, In: International Conference on Global Environment and Advanced Nuclear Plants. p. 1038-1038

  Research output: Contribution to journal › Article › peer-review

• Thermal-expansion-type Microactuator for Endoscopic Surgery.

  N, K., R., T., K., T. & Kabei, N., 1997 Jan 1, In: Default journal.

  Research output: Contribution to journal › Article › peer-review

• Thermal-expansion-type microactuator using paraffin as expansive material (Basic performance of a prototype linear actuator)

  Kabei, N., Kosuda, M., Kagamibuchi, H., Tashiro, R., Mizuno, H., Ueda, Y. & Tsuchiya, K., 1996, In: Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C. 62, 604, p. 4624-4629 6 p.

  Research output: Contribution to journal › Article › peer-review

  Open Access
  2 Citations (Scopus)

• Thermal Fatigue Damage of Quad Flat Pack Leads and Sn-3.5Ag-X(x=Bi and Cu) Solder Joints

  Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999 Feb 1, In: Default journal.

  Research output: Contribution to journal › Article › peer-review

• Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

  Warashina, K., Kariya, Y., Hirata, Y. & Otsuka, M., 1999, Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999. Suga, T., Yoshikawa, H., Umeda, Y., Kimura, F. & Yamamoto, R. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 626-631 6 p. 747688. (Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  3 Citations (Scopus)

• Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

  Kanda, Y., Zama, K., Kariya, Y., Oota, H., Kikuchi, S., Yamabe, H. & Nakamura, K., 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. 5501291. (2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010).

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
  3 Citations (Scopus)