Find Research Outputs

Search in all content

Filters for Research Output

Search concepts
Selected filters

Publication Year

  • 2020
  • 2018
  • 2017
  • 2016

Author

  • Yoshiharu Kariya
2016

Preface

Kariya, Y. & Shohji, I., 2016, In : Materials Transactions. 57, 6, p. 796 1 p.

Research output: Contribution to journalEditorial

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 Nov 7, (Accepted/In press) In : Journal of Electronic Materials. p. 1-8 8 p.

Research output: Contribution to journalArticle

15 Citations (Scopus)

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 805-809 5 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In : Materials Transactions. 57, 6, p. 819-823 5 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)
2018

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 Mar, In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

4 Citations (Scopus)
2020

Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 Oct 1, In : Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.

Research output: Contribution to journalArticle

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016 Jan 1, In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
2017

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)
2016

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2020

Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging

Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In : Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.

Research output: Contribution to journalArticle

Open Access
2017

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution