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Publication Year

  • 2020
  • 2019
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  • 2017
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Author

  • Yoshiharu Kariya
Article

Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2018 Jan 1, In : Materials Transactions. 59, 4, p. 612-619 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Effect of strain rate and temperature on micro fatigue crack propagation of Bi-Sn eutectic alloy

Taniguchi, M. & Kariya, Y., 2016 Jan 1, In : Materials Transactions. 57, 6, p. 853-859 7 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Evaluation of fatigue crack propagation behavior of pressurized sintered Ag nanoparticles and its application to thermal fatigue life prediction of sintered joint

Sato, T., Kariya, Y., Takahashi, H., Nakamura, T. & Aiko, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 850-857 8 p.

Research output: Contribution to journalArticle

2 Citations (Scopus)

Evaluation of fatigue crack propagation of Sn5.0Sb/Cu joint using inelastic strain energy density

Nakajima, Y., Ono, K. & Kariya, Y., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 876-881 6 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

Hosoya, K., Kariya, Y., Sugimoto, H. & Takahashi, K., 2020 Oct 1, In : Journal of Electronic Materials. 49, 10, p. 6175-6186 12 p.

Research output: Contribution to journalArticle

Influence of silica filler addition on fatigue crack propagation rate of underfill resin

Ishibashi, J., Kariya, Y., Satoh, T., Enomoto, T. & Yamaguchi, H., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 902-908 7 p.

Research output: Contribution to journalArticle

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2017 Oct 3, (Accepted/In press) In : Journal of Electronic Materials. p. 1-10 10 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2016 Nov 7, (Accepted/In press) In : Journal of Electronic Materials. p. 1-8 8 p.

Research output: Contribution to journalArticle

15 Citations (Scopus)

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Kariya, Y., Yajima, N., Obinata, K., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2018 Mar, In : Microelectronics Reliability. 82, p. 20-27 8 p.

Research output: Contribution to journalArticle

4 Citations (Scopus)

Measurements and FEM analyses of strain distribution in small Sn specimens with few crystal grains

Sasaki, T., Yanase, A., Okumura, D., Kariya, Y., Koganemaru, M. & Ikeda, T., 2019 Jan 1, In : Materials Transactions. 60, 6, p. 868-875 8 p.

Research output: Contribution to journalArticle

Plastic deformation behavior and mechanism of bismuth single crystals in principal axes

Yanaka, Y., Kariya, Y., Watanabe, H. & Hokazono, H., 2016, In : Materials Transactions. 57, 6, p. 819-823 5 p.

Research output: Contribution to journalArticle

7 Citations (Scopus)

Reliability simulation with the finite element analysis (Fea) of redistribution layer in fan-out wafer level packaging

Okada, Y., Fujii, A., Ono, K. & Kariya, Y., 2020, In : Journal of Photopolymer Science and Technology. 33, 2, p. 171-176 6 p.

Research output: Contribution to journalArticle

Open Access

Thermal fatigue life evaluation of epoxy resin/Si joint under mineral oil condition

Takahashi, H. & Kariya, Y., 2016, In : Materials Transactions. 57, 6, p. 805-809 5 p.

Research output: Contribution to journalArticle

1 Citation (Scopus)
Conference contribution

Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Y. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735106. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, K., Kariya, Y. & Horie, S., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735247. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package

Ono, K. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735249. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Moroka, K. & Kariya, Y., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735151. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fracture Analysis of Vertical Direction Crack in Die Attach Joint for Power Semiconductor Device

Sugimoto, H., Kariya, Y., Hanada, R., Fukumoto, A., Ito, Y. & Soda, S., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735334. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, A., Hokazono, H., Nishimura, Y., Kariya, Y., Mochizuki, E. & Takahashi, Y., 2016 Jun 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 405-410 6 p. 7486857

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, K., Kariya, Y., Mizumura, N. & Sasaki, K., 2019 May, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 1 p. 8735315. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, K., Yajima, N., Kariya, Y., Hiroshima, Y., Kikuchi, S., Matsui, A. & Shimizu, H., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, R., Kariya, Y., Mizumura, N. & Sasaki, K., 2017 Jun 13, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 1 p. 7947482. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Editorial

Preface

Kariya, Y. & Shohji, I., 2016, In : Materials Transactions. 57, 6, p. 796 1 p.

Research output: Contribution to journalEditorial