A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron

Tomohito Suzuki, Yuhei Imai, Hiroyuki Manabe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Several electric circuit prototyping techniques have been proposed. While most focus on creating the conductive traces, we focus on the bonding technique needed for this kind of circuit. Our technique is an extension of existing work in that we use the traces themselves as the bonding material for the components. The bonding process is not soldering but yields joints of adequate connectivity. A hot soldering iron is used to activate the traces and bond the component to the circuit. Simple circuits are created on MDF, paper, and acrylic board to show the feasibility of the technique. It is also confirmed that the resistance of the contact points is sufficiently low.

Original languageEnglish
Title of host publicationUIST 2022 Adjunct - Adjunct Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology
PublisherAssociation for Computing Machinery, Inc
ISBN (Electronic)9781450393218
DOIs
Publication statusPublished - 2022 Oct 29
Event35th Annual ACM Symposium on User Interface Software and Technology, UIST 2022 - Bend, United States
Duration: 2022 Oct 292022 Nov 2

Publication series

NameUIST 2022 Adjunct - Adjunct Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology

Conference

Conference35th Annual ACM Symposium on User Interface Software and Technology, UIST 2022
Country/TerritoryUnited States
CityBend
Period22/10/2922/11/2

Keywords

  • 3D printer
  • bonding
  • circuit prototyping
  • transfer foil

ASJC Scopus subject areas

  • Software
  • Computer Graphics and Computer-Aided Design
  • Human-Computer Interaction

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