A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H.Aoki H.Aoki, S.Yamazaki S.Yamazaki, T.Usami T.Usami, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, T.Onodera T.Onodera, Y.Hayash Y.Hayash, K.Ueno K.Ueno, H.Gomi H.Gomi, Kazuyoshi Ueno

Research output: Contribution to journalArticle

8 Citations (Scopus)
Original languageEnglish
Pages (from-to)777-780
Journal1997 IEDM Technical Digest
Publication statusPublished - 1997 Dec 1

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H.Aoki, H. A., S.Yamazaki, S. Y., T.Usami, T. U., Y.Tsuchiya, Y. T., N.Ito, N. I., T.Onodera, T. O., ... Ueno, K. (1997). A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water. 1997 IEDM Technical Digest, 777-780.