A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications

Shinichi Uchida, Shunichi Kaeriyama, Hirokazu Nagase, Koichi Takeda, Yasutaka Nakashiba, Tadashi Maeda, Kaoru Ishihara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.

Original languageEnglish
Title of host publicationProceedings of the 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages442-445
Number of pages4
ISBN (Print)9781479929177
DOIs
Publication statusPublished - 2014 Jan 1
Event26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 - Waikoloa, HI, United States
Duration: 2014 Jun 152014 Jun 19

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN (Print)1063-6854

Other

Other26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
CountryUnited States
CityWaikoloa, HI
Period14/6/1514/6/19

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Uchida, S., Kaeriyama, S., Nagase, H., Takeda, K., Nakashiba, Y., Maeda, T., & Ishihara, K. (2014). A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. In Proceedings of the 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 (pp. 442-445). [6856071] (Proceedings of the International Symposium on Power Semiconductor Devices and ICs). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISPSD.2014.6856071