A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications

Shinichi Uchida, Shunichi Kaeriyama, Hirokazu Nagase, Koichi Takeda, Yasutaka Nakashiba, Tadashi Maeda, Kaoru Ishihara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.

Original languageEnglish
Title of host publicationProceedings of the International Symposium on Power Semiconductor Devices and ICs
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages442-445
Number of pages4
ISBN (Print)9781479929177
DOIs
Publication statusPublished - 2014
Externally publishedYes
Event26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014 - Waikoloa, HI, United States
Duration: 2014 Jun 152014 Jun 19

Other

Other26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014
CountryUnited States
CityWaikoloa, HI
Period14/6/1514/6/19

Fingerprint

Electric breakdown
Insulation
Electric potential
Magnetic couplings
Extrapolation
Transmitters

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Uchida, S., Kaeriyama, S., Nagase, H., Takeda, K., Nakashiba, Y., Maeda, T., & Ishihara, K. (2014). A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. In Proceedings of the International Symposium on Power Semiconductor Devices and ICs (pp. 442-445). [6856071] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISPSD.2014.6856071

A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. / Uchida, Shinichi; Kaeriyama, Shunichi; Nagase, Hirokazu; Takeda, Koichi; Nakashiba, Yasutaka; Maeda, Tadashi; Ishihara, Kaoru.

Proceedings of the International Symposium on Power Semiconductor Devices and ICs. Institute of Electrical and Electronics Engineers Inc., 2014. p. 442-445 6856071.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Uchida, S, Kaeriyama, S, Nagase, H, Takeda, K, Nakashiba, Y, Maeda, T & Ishihara, K 2014, A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. in Proceedings of the International Symposium on Power Semiconductor Devices and ICs., 6856071, Institute of Electrical and Electronics Engineers Inc., pp. 442-445, 26th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2014, Waikoloa, HI, United States, 14/6/15. https://doi.org/10.1109/ISPSD.2014.6856071
Uchida S, Kaeriyama S, Nagase H, Takeda K, Nakashiba Y, Maeda T et al. A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. In Proceedings of the International Symposium on Power Semiconductor Devices and ICs. Institute of Electrical and Electronics Engineers Inc. 2014. p. 442-445. 6856071 https://doi.org/10.1109/ISPSD.2014.6856071
Uchida, Shinichi ; Kaeriyama, Shunichi ; Nagase, Hirokazu ; Takeda, Koichi ; Nakashiba, Yasutaka ; Maeda, Tadashi ; Ishihara, Kaoru. / A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications. Proceedings of the International Symposium on Power Semiconductor Devices and ICs. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 442-445
@inproceedings{6ae77546b7544ab28ba4341d997b4251,
title = "A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications",
abstract = "A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.",
author = "Shinichi Uchida and Shunichi Kaeriyama and Hirokazu Nagase and Koichi Takeda and Yasutaka Nakashiba and Tadashi Maeda and Kaoru Ishihara",
year = "2014",
doi = "10.1109/ISPSD.2014.6856071",
language = "English",
isbn = "9781479929177",
pages = "442--445",
booktitle = "Proceedings of the International Symposium on Power Semiconductor Devices and ICs",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - A face-to-face chip stacking 7kV RMS digital isolator for automotive and industrial motor drive applications

AU - Uchida, Shinichi

AU - Kaeriyama, Shunichi

AU - Nagase, Hirokazu

AU - Takeda, Koichi

AU - Nakashiba, Yasutaka

AU - Maeda, Tadashi

AU - Ishihara, Kaoru

PY - 2014

Y1 - 2014

N2 - A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.

AB - A face-to-face chip stacking isolator structure, which makes it easy to enhance the insulation voltage, is proposed. Transmitter (Tx) and receiver (Rx) chips, each of which has a coil, are stacked and communicate through a magnetic coupling of the coils. The die attach film sandwiched by the two chips not only bonds the chips but also enhances the insulation voltage by taking advantage of its thickness. With test chips, the breakdown voltage of 7kV RMS is demonstrated and >20-year lifetime with a working voltage of 1.5kV is estimated by extrapolation of time-dependent dielectric breakdown results.

UR - http://www.scopus.com/inward/record.url?scp=84905465553&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84905465553&partnerID=8YFLogxK

U2 - 10.1109/ISPSD.2014.6856071

DO - 10.1109/ISPSD.2014.6856071

M3 - Conference contribution

AN - SCOPUS:84905465553

SN - 9781479929177

SP - 442

EP - 445

BT - Proceedings of the International Symposium on Power Semiconductor Devices and ICs

PB - Institute of Electrical and Electronics Engineers Inc.

ER -