A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita; Nobuhiro Anzai; Kazutoshi Sakamaki; Yoshiharu Kariya

doi:10.1109/ICSJ.2013.6756126

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

Research output: Contribution to conference › Paper › peer-review

Abstract

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

Original language	English
DOIs	https://doi.org/10.1109/ICSJ.2013.6756126
Publication status	Published - 2013 Jan 1
Event	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan Duration: 2013 Nov 11 → 2013 Nov 13

Conference

Conference	2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
Country/Territory	Japan
City	Kyoto
Period	13/11/11 → 13/11/13

Keywords

Drop Test
Finite Element Analysis
Polyimide

ASJC Scopus subject areas

Electrical and Electronic Engineering

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10.1109/ICSJ.2013.6756126

Cite this

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title = "A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide",

abstract = "Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.",

keywords = "Drop Test, Finite Element Analysis, Polyimide",

author = "Mitsuru Fujita and Nobuhiro Anzai and Kazutoshi Sakamaki and Yoshiharu Kariya",

year = "2013",

month = jan,

day = "1",

doi = "10.1109/ICSJ.2013.6756126",

language = "English",

note = "2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 ; Conference date: 11-11-2013 Through 13-11-2013",

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T1 - A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

AU - Fujita, Mitsuru

AU - Anzai, Nobuhiro

AU - Sakamaki, Kazutoshi

AU - Kariya, Yoshiharu

PY - 2013/1/1

Y1 - 2013/1/1

N2 - Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

AB - Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

KW - Drop Test

KW - Finite Element Analysis

KW - Polyimide

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UR - http://www.scopus.com/inward/citedby.url?scp=84897504197&partnerID=8YFLogxK

U2 - 10.1109/ICSJ.2013.6756126

DO - 10.1109/ICSJ.2013.6756126

M3 - Paper

AN - SCOPUS:84897504197

T2 - 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013

Y2 - 11 November 2013 through 13 November 2013

ER -

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Abstract

Conference

Keywords

ASJC Scopus subject areas

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