A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

Research output: Contribution to conferencePaper

Abstract

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

Original languageEnglish
DOIs
Publication statusPublished - 2013 Jan 1
Event2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto, Japan
Duration: 2013 Nov 112013 Nov 13

Conference

Conference2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
CountryJapan
CityKyoto
Period13/11/1113/11/13

Keywords

  • Drop Test
  • Finite Element Analysis
  • Polyimide

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Fujita, M., Anzai, N., Sakamaki, K., & Kariya, Y. (2013). A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. Paper presented at 2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013, Kyoto, Japan. https://doi.org/10.1109/ICSJ.2013.6756126