A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita, Nobuhiro Anzai, Kazutoshi Sakamaki, Yoshiharu Kariya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

Original languageEnglish
Title of host publicationICSJ 2013 - IEEE CPMT Symposium Japan
PublisherIEEE Computer Society
DOIs
Publication statusPublished - 2013
Event2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013 - Kyoto
Duration: 2013 Nov 112013 Nov 13

Other

Other2013 3rd IEEE CPMT Symposium Japan, ICSJ 2013
CityKyoto
Period13/11/1113/11/13

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Keywords

  • Drop Test
  • Finite Element Analysis
  • Polyimide

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Fujita, M., Anzai, N., Sakamaki, K., & Kariya, Y. (2013). A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide. In ICSJ 2013 - IEEE CPMT Symposium Japan [6756126] IEEE Computer Society. https://doi.org/10.1109/ICSJ.2013.6756126