A half-micron pitch Cu interconnection technology

K.Ueno K.Ueno, K.Ohto K.Ohto, K.Tsunenari K.Tsunenari, Kazuyoshi Ueno

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)27-28
Journal1995 Symposium on VLSI Technology Digest of Technical Papers
Publication statusPublished - 1996 Jun 1

Cite this

A half-micron pitch Cu interconnection technology. / K.Ueno, K.Ueno; K.Ohto, K.Ohto; K.Tsunenari, K.Tsunenari; Ueno, Kazuyoshi.

In: 1995 Symposium on VLSI Technology Digest of Technical Papers, 01.06.1996, p. 27-28.

Research output: Contribution to journalArticle

K.Ueno, K.Ueno ; K.Ohto, K.Ohto ; K.Tsunenari, K.Tsunenari ; Ueno, Kazuyoshi. / A half-micron pitch Cu interconnection technology. In: 1995 Symposium on VLSI Technology Digest of Technical Papers. 1996 ; pp. 27-28.
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