A high reliability copper duel-damascene interconnection with direct-contact via structure

K.Ueno K.Ueno; M.Suzuki M.Suzuki; A.Matsumoto A.Matsumoto; K.Motoyama K.Motoyama; N.Ito N.Ito; K.Arita K.Arita; Y.Tsuchiya Y.Tsuchiya; T.Wake T.Wake; A.Kubo A.Kubo; K.Sugai K.Sugai; N.Oda N.Oda; H.Miyamoto H.Miyamoto; S.Saito S.Saito; Kazuyoshi Ueno

A high reliability copper duel-damascene interconnection with direct-contact via structure

K.Ueno K.Ueno, M.Suzuki M.Suzuki, A.Matsumoto A.Matsumoto, K.Motoyama K.Motoyama, N.Ito N.Ito, K.Arita K.Arita, Y.Tsuchiya Y.Tsuchiya, T.Wake T.Wake, A.Kubo A.Kubo, K.Sugai K.Sugai, N.Oda N.Oda, H.Miyamoto H.Miyamoto, S.Saito S.Saito, Kazuyoshi Ueno

Functional Control Systems

Research output: Contribution to journal › Article

17 Citations (Scopus)

Original language	English
Pages (from-to)	265-268
Journal	2000 IEDM Technical Digests
Publication status	Published - 2000 Dec 1

Cite this

K.Ueno, K. U., M.Suzuki, M. S., A.Matsumoto, A. M., K.Motoyama, K. M., N.Ito, N. I., K.Arita, K. A., Y.Tsuchiya, Y. T., T.Wake, T. W., A.Kubo, A. K., K.Sugai, K. S., N.Oda, N. O., H.Miyamoto, H. M., S.Saito, S. S., & Ueno, K. (2000). A high reliability copper duel-damascene interconnection with direct-contact via structure. 2000 IEDM Technical Digests, 265-268.

A high reliability copper duel-damascene interconnection with direct-contact via structure. / K.Ueno, K.Ueno; M.Suzuki, M.Suzuki; A.Matsumoto, A.Matsumoto; K.Motoyama, K.Motoyama; N.Ito, N.Ito; K.Arita, K.Arita; Y.Tsuchiya, Y.Tsuchiya; T.Wake, T.Wake; A.Kubo, A.Kubo; K.Sugai, K.Sugai; N.Oda, N.Oda; H.Miyamoto, H.Miyamoto; S.Saito, S.Saito; Ueno, Kazuyoshi.

In: 2000 IEDM Technical Digests, 01.12.2000, p. 265-268.

Research output: Contribution to journal › Article

K.Ueno, K.Ueno ; M.Suzuki, M.Suzuki ; A.Matsumoto, A.Matsumoto ; K.Motoyama, K.Motoyama ; N.Ito, N.Ito ; K.Arita, K.Arita ; Y.Tsuchiya, Y.Tsuchiya ; T.Wake, T.Wake ; A.Kubo, A.Kubo ; K.Sugai, K.Sugai ; N.Oda, N.Oda ; H.Miyamoto, H.Miyamoto ; S.Saito, S.Saito ; Ueno, Kazuyoshi. / A high reliability copper duel-damascene interconnection with direct-contact via structure. In: 2000 IEDM Technical Digests. 2000 ; pp. 265-268.

@article{b0e7c0482d4d45d6af102caf91dd484f,

title = "A high reliability copper duel-damascene interconnection with direct-contact via structure",

author = "K.Ueno K.Ueno and M.Suzuki M.Suzuki and A.Matsumoto A.Matsumoto and K.Motoyama K.Motoyama and N.Ito N.Ito and K.Arita K.Arita and Y.Tsuchiya Y.Tsuchiya and T.Wake T.Wake and A.Kubo A.Kubo and K.Sugai K.Sugai and N.Oda N.Oda and H.Miyamoto H.Miyamoto and S.Saito S.Saito and Kazuyoshi Ueno",

year = "2000",

month = dec,

day = "1",

language = "English",

pages = "265--268",

journal = "2000 IEDM Technical Digests",

}

TY - JOUR

T1 - A high reliability copper duel-damascene interconnection with direct-contact via structure

AU - K.Ueno, K.Ueno

AU - M.Suzuki, M.Suzuki

AU - A.Matsumoto, A.Matsumoto

AU - K.Motoyama, K.Motoyama

AU - N.Ito, N.Ito

AU - K.Arita, K.Arita

AU - Y.Tsuchiya, Y.Tsuchiya

AU - T.Wake, T.Wake

AU - A.Kubo, A.Kubo

AU - K.Sugai, K.Sugai

AU - N.Oda, N.Oda

AU - H.Miyamoto, H.Miyamoto

AU - S.Saito, S.Saito

AU - Ueno, Kazuyoshi

PY - 2000/12/1

Y1 - 2000/12/1

M3 - Article

SP - 265

EP - 268

JO - 2000 IEDM Technical Digests

JF - 2000 IEDM Technical Digests

ER -