A high reliability Cu dual-damascene interconnection direct- contact via structure(Invited)

K.Ueno K.Ueno, M.Suzuki M.Suzuki, A.Mtsumoto A.Mtsumoto, K.Motoyama K.Motoyama, N.Oda N.Oda, H.Miyamoto H.Miyamoto, S.Ssaito S.Ssaito, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)49-60
JournalStress-Induced Phenomena in Metallization, AIP Conf. Proceedings
Volume612
Publication statusPublished - 2001 Jul 1

Cite this

K.Ueno, K. U., M.Suzuki, M. S., A.Mtsumoto, A. M., K.Motoyama, K. M., N.Oda, N. O., H.Miyamoto, H. M., ... Ueno, K. (2001). A high reliability Cu dual-damascene interconnection direct- contact via structure(Invited). Stress-Induced Phenomena in Metallization, AIP Conf. Proceedings, 612, 49-60.