A high reliability Cu dual-damascene interconnection direct- contact via structure(Invited)

K.Ueno K.Ueno, M.Suzuki M.Suzuki, A.Mtsumoto A.Mtsumoto, K.Motoyama K.Motoyama, N.Oda N.Oda, H.Miyamoto H.Miyamoto, S.Ssaito S.Ssaito, Kazuyoshi Ueno

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)49-60
JournalStress-Induced Phenomena in Metallization, AIP Conf. Proceedings
Volume612
Publication statusPublished - 2001 Jul 1

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