Original language | English |
---|---|
Pages (from-to) | 49-60 |
Journal | Stress-Induced Phenomena in Metallization, AIP Conf. Proceedings |
Volume | 612 |
Publication status | Published - 2001 Jul 1 |
A high reliability Cu dual-damascene interconnection direct- contact via structure(Invited)
K.Ueno K.Ueno, M.Suzuki M.Suzuki, A.Mtsumoto A.Mtsumoto, K.Motoyama K.Motoyama, N.Oda N.Oda, H.Miyamoto H.Miyamoto, S.Ssaito S.Ssaito, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review