Original language | English |
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Pages (from-to) | 851-856 |
Journal | ECTC |
Publication status | Published - 1995 May 25 |
A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead
E.Hosomi E.Hosomi, C.Takubo C.Takubo, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo
Research output: Contribution to journal › Article › peer-review