A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead

E.Hosomi E.Hosomi, C.Takubo C.Takubo, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)851-856
JournalECTC
Publication statusPublished - 1995 May 25

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E.Hosomi, E. H., C.Takubo, C. T., H.Tazawa, H. T., K.Shibazaki, K. S., Y.Hiruta, Y. H., T.Sudo, T. S., & Sudo, T. (1995). A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. ECTC, 851-856.