A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead

E.Hosomi E.Hosomi, C.Takubo C.Takubo, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)851-856
JournalECTC
Publication statusPublished - 1995 May 25

Cite this

E.Hosomi, E. H., C.Takubo, C. T., H.Tazawa, H. T., K.Shibazaki, K. S., Y.Hiruta, Y. H., T.Sudo, T. S., & Sudo, T. (1995). A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. ECTC, 851-856.

A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. / E.Hosomi, E.Hosomi; C.Takubo, C.Takubo; H.Tazawa, H.Tazawa; K.Shibazaki, K.Shibazaki; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; Sudo, Toshio.

In: ECTC, 25.05.1995, p. 851-856.

Research output: Contribution to journalArticle

E.Hosomi, EH, C.Takubo, CT, H.Tazawa, HT, K.Shibazaki, KS, Y.Hiruta, YH, T.Sudo, TS & Sudo, T 1995, 'A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead', ECTC, pp. 851-856.
E.Hosomi EH, C.Takubo CT, H.Tazawa HT, K.Shibazaki KS, Y.Hiruta YH, T.Sudo TS et al. A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. ECTC. 1995 May 25;851-856.
E.Hosomi, E.Hosomi ; C.Takubo, C.Takubo ; H.Tazawa, H.Tazawa ; K.Shibazaki, K.Shibazaki ; Y.Hiruta, Y.Hiruta ; T.Sudo, T.Sudo ; Sudo, Toshio. / A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. In: ECTC. 1995 ; pp. 851-856.
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AU - K.Shibazaki, K.Shibazaki

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