Original language | English |
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Pages (from-to) | 851-856 |
Journal | ECTC |
Publication status | Published - 1995 May 25 |
Cite this
A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. / E.Hosomi, E.Hosomi; C.Takubo, C.Takubo; H.Tazawa, H.Tazawa; K.Shibazaki, K.Shibazaki; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; Sudo, Toshio.
In: ECTC, 25.05.1995, p. 851-856.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead
AU - E.Hosomi, E.Hosomi
AU - C.Takubo, C.Takubo
AU - H.Tazawa, H.Tazawa
AU - K.Shibazaki, K.Shibazaki
AU - Y.Hiruta, Y.Hiruta
AU - T.Sudo, T.Sudo
AU - Sudo, Toshio
PY - 1995/5/25
Y1 - 1995/5/25
M3 - Article
SP - 851
EP - 856
JO - ECTC
JF - ECTC
ER -