A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead

E.Hosomi E.Hosomi; C.Takubo C.Takubo; H.Tazawa H.Tazawa; K.Shibazaki K.Shibazaki; Y.Hiruta Y.Hiruta; T.Sudo T.Sudo; Toshio Sudo

A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead

E.Hosomi E.Hosomi, C.Takubo C.Takubo, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Functional Control Systems

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	851-856
Journal	ECTC
Publication status	Published - 1995 May 25

Cite this

E.Hosomi, E. H., C.Takubo, C. T., H.Tazawa, H. T., K.Shibazaki, K. S., Y.Hiruta, Y. H., T.Sudo, T. S., & Sudo, T. (1995). A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. ECTC, 851-856.

@article{8dd51a02eb3143b7a206c6b5f3f56531,

title = "A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead",

author = "E.Hosomi E.Hosomi and C.Takubo C.Takubo and H.Tazawa H.Tazawa and K.Shibazaki K.Shibazaki and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",

year = "1995",

month = "5",

day = "25",

language = "English",

pages = "851--856",

journal = "ECTC",

}