| Original language | English |
|---|---|
| Pages (from-to) | 851-856 |
| Journal | ECTC |
| Publication status | Published - 1995 May 25 |
Cite this
E.Hosomi, E. H., C.Takubo, C. T., H.Tazawa, H. T., K.Shibazaki, K. S., Y.Hiruta, Y. H., T.Sudo, T. S., & Sudo, T. (1995). A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. ECTC, 851-856.
A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. / E.Hosomi, E.Hosomi; C.Takubo, C.Takubo; H.Tazawa, H.Tazawa; K.Shibazaki, K.Shibazaki; Y.Hiruta, Y.Hiruta; T.Sudo, T.Sudo; Sudo, Toshio.
In: ECTC, 25.05.1995, p. 851-856.Research output: Contribution to journal › Article
E.Hosomi, EH, C.Takubo, CT, H.Tazawa, HT, K.Shibazaki, KS, Y.Hiruta, YH, T.Sudo, TS & Sudo, T 1995, 'A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead', ECTC, pp. 851-856.
E.Hosomi EH, C.Takubo CT, H.Tazawa HT, K.Shibazaki KS, Y.Hiruta YH, T.Sudo TS et al. A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead. ECTC. 1995 May 25;851-856.
@article{8dd51a02eb3143b7a206c6b5f3f56531,
title = "A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead",
author = "E.Hosomi E.Hosomi and C.Takubo C.Takubo and H.Tazawa H.Tazawa and K.Shibazaki K.Shibazaki and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",
year = "1995",
month = "5",
day = "25",
language = "English",
pages = "851--856",
journal = "ECTC",
}
TY - JOUR
T1 - A New Bonding Mechanism of 50um Pitch TAB-ILB with 0.25um Sn Plated Cu Lead
AU - E.Hosomi, E.Hosomi
AU - C.Takubo, C.Takubo
AU - H.Tazawa, H.Tazawa
AU - K.Shibazaki, K.Shibazaki
AU - Y.Hiruta, Y.Hiruta
AU - T.Sudo, T.Sudo
AU - Sudo, Toshio
PY - 1995/5/25
Y1 - 1995/5/25
M3 - Article
SP - 851
EP - 856
JO - ECTC
JF - ECTC
ER -