A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection

T.Homma T.Homma, K.Eguchi K.Eguchi, Y.Numasawa Y.Numasawa, T.Kikkawa T.Kikkawa, Y.Hokari Y.Hokari, K.Hamano K.Hamano, Tetsuya Homma

Research output: Contribution to journalArticle

6 Citations (Scopus)
Original languageEnglish
Pages (from-to)279-285
JournalProceedings of 5th IEEE VLSI Multilevel Interconnection Conference
Publication statusPublished - 1988 Jun 13

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T.Homma, T. H., K.Eguchi, K. E., Y.Numasawa, Y. N., T.Kikkawa, T. K., Y.Hokari, Y. H., K.Hamano, K. H., & Homma, T. (1988). A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection. Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference, 279-285.