A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection

T.Homma T.Homma, K.Eguchi K.Eguchi, Y.Numasawa Y.Numasawa, T.Kikkawa T.Kikkawa, Y.Hokari Y.Hokari, K.Hamano K.Hamano, Tetsuya Homma

Research output: Contribution to journal › Article

6 Citations (Scopus)
Original languageEnglish
Pages (from-to)279-285
JournalProceedings of 5th IEEE VLSI Multilevel Interconnection Conference
Publication statusPublished - 1988 Jun 13

Cite this

T.Homma, T. H., K.Eguchi, K. E., Y.Numasawa, Y. N., T.Kikkawa, T. K., Y.Hokari, Y. H., K.Hamano, K. H., & Homma, T. (1988). A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection. Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference, 279-285.

A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection. / T.Homma, T.Homma; K.Eguchi, K.Eguchi; Y.Numasawa, Y.Numasawa; T.Kikkawa, T.Kikkawa; Y.Hokari, Y.Hokari; K.Hamano, K.Hamano; Homma, Tetsuya.

In: Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference, 13.06.1988, p. 279-285.

Research output: Contribution to journal › Article

T.Homma, TH, K.Eguchi, KE, Y.Numasawa, YN, T.Kikkawa, TK, Y.Hokari, YH, K.Hamano, KH & Homma, T 1988, 'A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection', Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference, pp. 279-285.
T.Homma TH, K.Eguchi KE, Y.Numasawa YN, T.Kikkawa TK, Y.Hokari YH, K.Hamano KH et al. A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection. Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference. 1988 Jun 13;279-285.
T.Homma, T.Homma ; K.Eguchi, K.Eguchi ; Y.Numasawa, Y.Numasawa ; T.Kikkawa, T.Kikkawa ; Y.Hokari, Y.Hokari ; K.Hamano, K.Hamano ; Homma, Tetsuya. / A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection. In: Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference. 1988 ; pp. 279-285.
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