| Original language | English |
|---|---|
| Pages (from-to) | 279-285 |
| Journal | Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference |
| Publication status | Published - 1988 Jun 13 |
Cite this
T.Homma, T. H., K.Eguchi, K. E., Y.Numasawa, Y. N., T.Kikkawa, T. K., Y.Hokari, Y. H., K.Hamano, K. H., & Homma, T. (1988). A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection. Proceedings of 5th IEEE VLSI Multilevel Interconnection Conference, 279-285.