A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization

Y.Hayashi Y.Hayashi, T.Onodera T.Onodera, T.Nakajima T.Nakajima, K.Kikuta K.Kikuta, Y.Tsuchiya Y.Tsuchiya, J.Kawahara J.Kawahara, S.Takahashi S.Takahashi, K.Ueno K.Ueno, S.Chikaki S.Chikaki, Kazuyoshi Ueno

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)88-89
Journal1996 Symposium on VLSI Technology Digest of Technical Papers
Publication statusPublished - 1997 Jun 1

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