A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization

Y.Hayashi Y.Hayashi; T.Onodera T.Onodera; T.Nakajima T.Nakajima; K.Kikuta K.Kikuta; Y.Tsuchiya Y.Tsuchiya; J.Kawahara J.Kawahara; S.Takahashi S.Takahashi; K.Ueno K.Ueno; S.Chikaki S.Chikaki; Kazuyoshi Ueno

A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization

Y.Hayashi Y.Hayashi, T.Onodera T.Onodera, T.Nakajima T.Nakajima, K.Kikuta K.Kikuta, Y.Tsuchiya Y.Tsuchiya, J.Kawahara J.Kawahara, S.Takahashi S.Takahashi, K.Ueno K.Ueno, S.Chikaki S.Chikaki, Kazuyoshi Ueno

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	88-89
Journal	1996 Symposium on VLSI Technology Digest of Technical Papers
Publication status	Published - 1997 Jun 1

Cite this

Y.Hayashi, Y. H., T.Onodera, T. O., T.Nakajima, T. N., K.Kikuta, K. K., Y.Tsuchiya, Y. T., J.Kawahara, J. K., S.Takahashi, S. T., K.Ueno, K. U., S.Chikaki, S. C., & Ueno, K. (1997). A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization. 1996 Symposium on VLSI Technology Digest of Technical Papers, 88-89.

A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization. / Y.Hayashi, Y.Hayashi; T.Onodera, T.Onodera; T.Nakajima, T.Nakajima et al.

In: 1996 Symposium on VLSI Technology Digest of Technical Papers, 01.06.1997, p. 88-89.

Research output: Contribution to journal › Article › peer-review

@article{5ec5136d80024fcda33ebc88db7296a8,

title = "A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization",

author = "Y.Hayashi Y.Hayashi and T.Onodera T.Onodera and T.Nakajima T.Nakajima and K.Kikuta K.Kikuta and Y.Tsuchiya Y.Tsuchiya and J.Kawahara J.Kawahara and S.Takahashi S.Takahashi and K.Ueno K.Ueno and S.Chikaki S.Chikaki and Kazuyoshi Ueno",

year = "1997",

month = jun,

day = "1",

language = "English",

pages = "88--89",

journal = "1996 Symposium on VLSI Technology Digest of Technical Papers",

}

TY - JOUR

T1 - A new two step metal CMP technique for a high performance multilevel interconnects featured by Al-and Cu in low - , organic film metallization

AU - Y.Hayashi, Y.Hayashi

AU - T.Onodera, T.Onodera

AU - T.Nakajima, T.Nakajima

AU - K.Kikuta, K.Kikuta

AU - Y.Tsuchiya, Y.Tsuchiya

AU - J.Kawahara, J.Kawahara

AU - S.Takahashi, S.Takahashi

AU - K.Ueno, K.Ueno

AU - S.Chikaki, S.Chikaki

AU - Ueno, Kazuyoshi

PY - 1997/6/1

Y1 - 1997/6/1

M3 - Article

SP - 88

EP - 89

JO - 1996 Symposium on VLSI Technology Digest of Technical Papers

JF - 1996 Symposium on VLSI Technology Digest of Technical Papers

ER -