A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

N. Kawahara, M. Tagami, B. Withers, Y. Kakuhara, H. Imura, K. Ohto, T. Taiji, K. Arita, T. Kurokawa, M. Nagase, T. Maruyama, N. Oda, Y. Hayashi, J. Jacobs, M.Sakurai M.Sakurai, M. Sekine, K. Ueno

Research output: Contribution to journalArticle

5 Citations (Scopus)
Original languageEnglish
Pages (from-to)152-154
JournalProc. 2006 Int. Interconnect Tech. Conf.
Publication statusPublished - 2006 Jun 6

Cite this

A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. / Kawahara, N.; Tagami, M.; Withers, B.; Kakuhara, Y.; Imura, H.; Ohto, K.; Taiji, T.; Arita, K.; Kurokawa, T.; Nagase, M.; Maruyama, T.; Oda, N.; Hayashi, Y.; Jacobs, J.; M.Sakurai, M.Sakurai; Sekine, M.; Ueno, K.

In: Proc. 2006 Int. Interconnect Tech. Conf., 06.06.2006, p. 152-154.

Research output: Contribution to journalArticle

Kawahara, N, Tagami, M, Withers, B, Kakuhara, Y, Imura, H, Ohto, K, Taiji, T, Arita, K, Kurokawa, T, Nagase, M, Maruyama, T, Oda, N, Hayashi, Y, Jacobs, J, M.Sakurai, MS, Sekine, M & Ueno, K 2006, 'A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure', Proc. 2006 Int. Interconnect Tech. Conf., pp. 152-154.
Kawahara, N. ; Tagami, M. ; Withers, B. ; Kakuhara, Y. ; Imura, H. ; Ohto, K. ; Taiji, T. ; Arita, K. ; Kurokawa, T. ; Nagase, M. ; Maruyama, T. ; Oda, N. ; Hayashi, Y. ; Jacobs, J. ; M.Sakurai, M.Sakurai ; Sekine, M. ; Ueno, K. / A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. In: Proc. 2006 Int. Interconnect Tech. Conf. 2006 ; pp. 152-154.
@article{791bc225454742c79e4bfd0441485aea,
title = "A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure",
author = "N. Kawahara and M. Tagami and B. Withers and Y. Kakuhara and H. Imura and K. Ohto and T. Taiji and K. Arita and T. Kurokawa and M. Nagase and T. Maruyama and N. Oda and Y. Hayashi and J. Jacobs and M.Sakurai M.Sakurai and M. Sekine and K. Ueno",
year = "2006",
month = "6",
day = "6",
language = "English",
pages = "152--154",
journal = "Proc. 2006 Int. Interconnect Tech. Conf.",

}

TY - JOUR

T1 - A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

AU - Kawahara, N.

AU - Tagami, M.

AU - Withers, B.

AU - Kakuhara, Y.

AU - Imura, H.

AU - Ohto, K.

AU - Taiji, T.

AU - Arita, K.

AU - Kurokawa, T.

AU - Nagase, M.

AU - Maruyama, T.

AU - Oda, N.

AU - Hayashi, Y.

AU - Jacobs, J.

AU - M.Sakurai, M.Sakurai

AU - Sekine, M.

AU - Ueno, K.

PY - 2006/6/6

Y1 - 2006/6/6

M3 - Article

SP - 152

EP - 154

JO - Proc. 2006 Int. Interconnect Tech. Conf.

JF - Proc. 2006 Int. Interconnect Tech. Conf.

ER -