A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

N. Kawahara, M. Tagami, B. Withers, Y. Kakuhara, H. Imura, K. Ohto, T. Taiji, K. Arita, T. Kurokawa, M. Nagase, T. Maruyama, N. Oda, Y. Hayashi, J. Jacobs, M.Sakurai M.Sakurai, M. Sekine, K. Ueno

Research output: Contribution to journalArticle

5 Citations (Scopus)
Original languageEnglish
Pages (from-to)152-154
JournalProc. 2006 Int. Interconnect Tech. Conf.
Publication statusPublished - 2006 Jun 6

Cite this

Kawahara, N., Tagami, M., Withers, B., Kakuhara, Y., Imura, H., Ohto, K., Taiji, T., Arita, K., Kurokawa, T., Nagase, M., Maruyama, T., Oda, N., Hayashi, Y., Jacobs, J., M.Sakurai, M. S., Sekine, M., & Ueno, K. (2006). A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. Proc. 2006 Int. Interconnect Tech. Conf., 152-154.