A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

N. Kawahara; M. Tagami; B. Withers; Y. Kakuhara; H. Imura; K. Ohto; T. Taiji; K. Arita; T. Kurokawa; M. Nagase; T. Maruyama; N. Oda; Y. Hayashi; J. Jacobs; M.Sakurai M.Sakurai; M. Sekine; K. Ueno

A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

N. Kawahara, M. Tagami, B. Withers, Y. Kakuhara, H. Imura, K. Ohto, T. Taiji, K. Arita, T. Kurokawa, M. Nagase, T. Maruyama, N. Oda, Y. Hayashi, J. Jacobs, M.Sakurai M.Sakurai, M. Sekine, K. Ueno

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Original language	English
Pages (from-to)	152-154
Journal	Proc. 2006 Int. Interconnect Tech. Conf.
Publication status	Published - 2006 Jun 6

Cite this

Kawahara, N., Tagami, M., Withers, B., Kakuhara, Y., Imura, H., Ohto, K., Taiji, T., Arita, K., Kurokawa, T., Nagase, M., Maruyama, T., Oda, N., Hayashi, Y., Jacobs, J., M.Sakurai, M. S., Sekine, M., & Ueno, K. (2006). A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure. Proc. 2006 Int. Interconnect Tech. Conf., 152-154.

Kawahara, N, Tagami, M, Withers, B, Kakuhara, Y, Imura, H, Ohto, K, Taiji, T, Arita, K, Kurokawa, T, Nagase, M, Maruyama, T, Oda, N, Hayashi, Y, Jacobs, J, M.Sakurai, MS, Sekine, M & Ueno, K 2006, 'A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure', Proc. 2006 Int. Interconnect Tech. Conf., pp. 152-154.

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title = "A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure",

author = "N. Kawahara and M. Tagami and B. Withers and Y. Kakuhara and H. Imura and K. Ohto and T. Taiji and K. Arita and T. Kurokawa and M. Nagase and T. Maruyama and N. Oda and Y. Hayashi and J. Jacobs and M.Sakurai M.Sakurai and M. Sekine and K. Ueno",

year = "2006",

month = jun,

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language = "English",

pages = "152--154",

journal = "Proc. 2006 Int. Interconnect Tech. Conf.",

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TY - JOUR

T1 - A Novel CoWP Cap Integration for Porous Low-k/Cu Interconnects with NH3 Plasma Treatment and Low-k Top (LKT) Dielectric Structure

AU - Kawahara, N.

AU - Tagami, M.

AU - Withers, B.

AU - Kakuhara, Y.

AU - Imura, H.

AU - Ohto, K.

AU - Taiji, T.

AU - Arita, K.

AU - Kurokawa, T.

AU - Nagase, M.

AU - Maruyama, T.

AU - Oda, N.

AU - Hayashi, Y.

AU - Jacobs, J.

AU - M.Sakurai, M.Sakurai

AU - Sekine, M.

AU - Ueno, K.

PY - 2006/6/6

Y1 - 2006/6/6

M3 - Article

SP - 152

EP - 154

JO - Proc. 2006 Int. Interconnect Tech. Conf.

JF - Proc. 2006 Int. Interconnect Tech. Conf.

ER -