A Photoresist Removal Process with Plasma Treatment Using Gas Containing Hydrogen after Aluminum Etching

M.Saito M.Saito, I.Touno I.Touno, K.Omiya K.Omiya, T.Homma T.Homma, T.Nagatomo T.Nagatomo, Tetsuya Homma

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)G451-G454
JournalJournal of the Electrochemical Society
Volume149
Publication statusPublished - 2002 Aug 1

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M.Saito, M. S., I.Touno, I. T., K.Omiya, K. O., T.Homma, T. H., T.Nagatomo, T. N., & Homma, T. (2002). A Photoresist Removal Process with Plasma Treatment Using Gas Containing Hydrogen after Aluminum Etching. Journal of the Electrochemical Society, 149, G451-G454.