A process for photoresist removal after aluminum etching using plasma treatment in a gas containing hydrogen

Makoto Saito, Ichiro Touno, Kayoko Omiya, Tetsuya Homma, Takao Nagatomo

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A photoresist removal process with plasma treatment after aluminum film etching was developed. During a previous reactive ion etching step, reaction products are deposited on the sidewalls of the patterns etched in the Al film and the photoresist on top of it. The deposited material is analyzed by X-ray photoelectron spectroscopy and found to consist of chlorides of Al. It is demonstrated than the deposited film can be removed by treatment in inductively coupled plasma using hydrogen-containing gas (methyl alcohol in the present study) with a radio frequency bias applied to the substrate. The optical spectra indicate that the reactive species are hydrogen and other reactive species (e.g., CH and OH) generated by dissociation of methyl alcohol.

Original languageEnglish
Pages (from-to)G451-G454
JournalJournal of the Electrochemical Society
Issue number8
Publication statusPublished - 2002 Aug 1


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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