A Room Temperature CVD Technology for Interlayer in Deep submicron Multilevel Interconnection

T.Homma T.Homma, Y.Murao Y.Murao, Tetsuya Homma

Research output: Contribution to journalArticle

5 Citations (Scopus)
Original languageEnglish
Pages (from-to)289-292
JournalProceedings of IEEE International Electron Devices Meeting
Publication statusPublished - 1991 Dec 8

Cite this

A Room Temperature CVD Technology for Interlayer in Deep submicron Multilevel Interconnection. / T.Homma, T.Homma; Y.Murao, Y.Murao; Homma, Tetsuya.

In: Proceedings of IEEE International Electron Devices Meeting, 08.12.1991, p. 289-292.

Research output: Contribution to journalArticle

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