Abstract
Recent battery driven IT devices including smart phone and tablets require versatile functions and high performance with low energy consumption. On the other hand, the initial cost of LSI for design and mask development has increased rapidly, and development of an SoC (System-on-a Chip) for each product has become difficult. Although flexible reconfigurable architectures can be a solution, the performance scalability is also necessary to cope with the wide performance range of products. As a solution, heterogeneous multi-core system using a 3-D wireless inductive coupling interconnect is proposed. This system consists of a MIPS-R3000 compatible embedded CPU and reconfigurable accelerators. Since chips are connected with wireless inductive coupling channels, the number and types of accelerators can be tailored easily depending on the requirement of the product.
| Original language | English |
|---|---|
| Title of host publication | 2013 IEEE Hot Chips 25 Symposium, HCS 2013 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781467388818 |
| DOIs | |
| Publication status | Published - 2016 May 24 |
| Event | 25th IEEE Hot Chips Symposium, HCS 2013 - Stanford, United States Duration: 2013 Aug 25 → 2013 Aug 27 |
Other
| Other | 25th IEEE Hot Chips Symposium, HCS 2013 |
|---|---|
| Country | United States |
| City | Stanford |
| Period | 13/8/25 → 13/8/27 |
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ASJC Scopus subject areas
- Hardware and Architecture
Cite this
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. / Miura, Noriyuki; Koizumi, Yusuke; Sasaki, Eiichi; Take, Yasuhiro; Matsutani, Hiroki; Kuroda, Tadahiro; Amano, Hideharu; Sakamoto, Ryuichi; Namiki, Mitaro; Usami, Kimiyoshi; Kondo, Masaaki; Nakamura, Hiroshi.
2013 IEEE Hot Chips 25 Symposium, HCS 2013. Institute of Electrical and Electronics Engineers Inc., 2016. 7478328.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface
AU - Miura, Noriyuki
AU - Koizumi, Yusuke
AU - Sasaki, Eiichi
AU - Take, Yasuhiro
AU - Matsutani, Hiroki
AU - Kuroda, Tadahiro
AU - Amano, Hideharu
AU - Sakamoto, Ryuichi
AU - Namiki, Mitaro
AU - Usami, Kimiyoshi
AU - Kondo, Masaaki
AU - Nakamura, Hiroshi
PY - 2016/5/24
Y1 - 2016/5/24
N2 - Recent battery driven IT devices including smart phone and tablets require versatile functions and high performance with low energy consumption. On the other hand, the initial cost of LSI for design and mask development has increased rapidly, and development of an SoC (System-on-a Chip) for each product has become difficult. Although flexible reconfigurable architectures can be a solution, the performance scalability is also necessary to cope with the wide performance range of products. As a solution, heterogeneous multi-core system using a 3-D wireless inductive coupling interconnect is proposed. This system consists of a MIPS-R3000 compatible embedded CPU and reconfigurable accelerators. Since chips are connected with wireless inductive coupling channels, the number and types of accelerators can be tailored easily depending on the requirement of the product.
AB - Recent battery driven IT devices including smart phone and tablets require versatile functions and high performance with low energy consumption. On the other hand, the initial cost of LSI for design and mask development has increased rapidly, and development of an SoC (System-on-a Chip) for each product has become difficult. Although flexible reconfigurable architectures can be a solution, the performance scalability is also necessary to cope with the wide performance range of products. As a solution, heterogeneous multi-core system using a 3-D wireless inductive coupling interconnect is proposed. This system consists of a MIPS-R3000 compatible embedded CPU and reconfigurable accelerators. Since chips are connected with wireless inductive coupling channels, the number and types of accelerators can be tailored easily depending on the requirement of the product.
UR - http://www.scopus.com/inward/record.url?scp=84979231189&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84979231189&partnerID=8YFLogxK
U2 - 10.1109/HOTCHIPS.2013.7478328
DO - 10.1109/HOTCHIPS.2013.7478328
M3 - Conference contribution
BT - 2013 IEEE Hot Chips 25 Symposium, HCS 2013
PB - Institute of Electrical and Electronics Engineers Inc.
ER -