| Original language | English |
|---|---|
| Pages (from-to) | 2323-2330 |
| Journal | Trans. on Electronics |
| Volume | E74 |
| Publication status | Published - 1991 Aug 1 |
A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package
T. Sudo, S. Kimijima, O. Shimada, N. Iwase
Research output: Contribution to journal › Article › peer-review