A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package

T. Sudo, S. Kimijima, O. Shimada, N. Iwase

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)2323-2330
JournalTrans. on Electronics
VolumeE74
Publication statusPublished - 1991 Aug 1

Cite this

Sudo, T., Kimijima, S., Shimada, O., & Iwase, N. (1991). A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package. Trans. on Electronics, E74, 2323-2330.

A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package. / Sudo, T.; Kimijima, S.; Shimada, O.; Iwase, N.

In: Trans. on Electronics, Vol. E74, 01.08.1991, p. 2323-2330.

Research output: Contribution to journalArticle

Sudo, T, Kimijima, S, Shimada, O & Iwase, N 1991, 'A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package', Trans. on Electronics, vol. E74, pp. 2323-2330.
Sudo T, Kimijima S, Shimada O, Iwase N. A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package. Trans. on Electronics. 1991 Aug 1;E74:2323-2330.
Sudo, T. ; Kimijima, S. ; Shimada, O. ; Iwase, N. / A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package. In: Trans. on Electronics. 1991 ; Vol. E74. pp. 2323-2330.
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