A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package

T. Sudo, S. Kimijima, O. Shimada, N. Iwase

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)2323-2330
JournalTrans. on Electronics
VolumeE74
Publication statusPublished - 1991 Aug 1

Cite this

Sudo, T., Kimijima, S., Shimada, O., & Iwase, N. (1991). A Silicon-Based Multichip Module with Co-fired Aluminum Nitride Package. Trans. on Electronics, E74, 2323-2330.