A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Satoshi Kaneko, Yo Takahahsi, Toshio Sudo, Akihiro Kanno, Akiko Sugimmoto, Fujio Kuwako

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
PublisherIEEE Computer Society
Pages73-76
Number of pages4
ISBN (Print)9781424426331
DOIs
Publication statusPublished - 2008 Jan 1
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
Duration: 2008 Dec 102008 Dec 12

Publication series

Name2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Conference

Conference2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
CountryKorea, Republic of
CitySeoul
Period08/12/1008/12/12

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Management, Monitoring, Policy and Law
  • Energy(all)
  • Energy Engineering and Power Technology
  • Fuel Technology
  • Modelling and Simulation
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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