A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Satoshi Kaneko, Yo Takahahsi, Toshio Sudo, Akihiro Kanno, Akiko Sugimmoto, Fujio Kuwako

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages73-76
Number of pages4
DOIs
Publication statusPublished - 2008
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul
Duration: 2008 Dec 102008 Dec 12

Other

Other2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
CitySeoul
Period08/12/1008/12/12

Fingerprint

Logic devices
Noise abatement
Laminates
Buffer circuits
Capacitance
Thin films
Networks (circuits)
Film capacitor

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kaneko, S., Takahahsi, Y., Sudo, T., Kanno, A., Sugimmoto, A., & Kuwako, F. (2008). A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 73-76). [4736002] https://doi.org/10.1109/EDAPS.2008.4736002

A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. / Kaneko, Satoshi; Takahahsi, Yo; Sudo, Toshio; Kanno, Akihiro; Sugimmoto, Akiko; Kuwako, Fujio.

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 73-76 4736002.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kaneko, S, Takahahsi, Y, Sudo, T, Kanno, A, Sugimmoto, A & Kuwako, F 2008, A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. in 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings., 4736002, pp. 73-76, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, Seoul, 08/12/10. https://doi.org/10.1109/EDAPS.2008.4736002
Kaneko S, Takahahsi Y, Sudo T, Kanno A, Sugimmoto A, Kuwako F. A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 73-76. 4736002 https://doi.org/10.1109/EDAPS.2008.4736002
Kaneko, Satoshi ; Takahahsi, Yo ; Sudo, Toshio ; Kanno, Akihiro ; Sugimmoto, Akiko ; Kuwako, Fujio. / A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. pp. 73-76
@inproceedings{621a6316142449d4a51391025fe64bb5,
title = "A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package",
abstract = "Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.",
author = "Satoshi Kaneko and Yo Takahahsi and Toshio Sudo and Akihiro Kanno and Akiko Sugimmoto and Fujio Kuwako",
year = "2008",
doi = "10.1109/EDAPS.2008.4736002",
language = "English",
isbn = "9781424426331",
pages = "73--76",
booktitle = "2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings",

}

TY - GEN

T1 - A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

AU - Kaneko, Satoshi

AU - Takahahsi, Yo

AU - Sudo, Toshio

AU - Kanno, Akihiro

AU - Sugimmoto, Akiko

AU - Kuwako, Fujio

PY - 2008

Y1 - 2008

N2 - Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.

AB - Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.

UR - http://www.scopus.com/inward/record.url?scp=60649086593&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=60649086593&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2008.4736002

DO - 10.1109/EDAPS.2008.4736002

M3 - Conference contribution

SN - 9781424426331

SP - 73

EP - 76

BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

ER -