A test chip for evaluating switching noise and radiated emission by I/O and core circuits

Toshio Sudo, Ken Nakano, Atsushi Nakamura, Satoru Haga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

In order to evaluate the radiated emission generating from LSI chip, package, wiring pattern on a printed circuit board (PCB), a programmably controllable test chip is required as a generic noise source. A CMOS gate array was fabricated in a 0.35 um silicon process technology. Both I/O buffer circuits and internal core logic circuits were incorporated as noise generating circuits. The test chip was housed in a quad flat package (QFP) with 304 I/O pins. An evaluation board was designed to verify the functionality of the developed LSI and to measure the switching noise and the magnetic near field. The switching noise and radiated emission noise were observed by stimulating the I/O buffer circuits or internal core logic circuits. The developed test chip was confirmed to be effective to investigate the noise contribution factors at the chip/package-level, and it will be applied to study the radiation noise mechanism at a printed circuit board, or at a system-level packaging environment.

Original languageEnglish
Title of host publicationIEEE International Symposium on Electromagnetic Compatibility
Pages676-680
Number of pages5
Volume1
Publication statusPublished - 2001
Event2001 International Symposium on Electromagnetic Compatibility - Montrealm, Que., Canada
Duration: 2001 Aug 132001 Aug 17

Other

Other2001 International Symposium on Electromagnetic Compatibility
CountryCanada
CityMontrealm, Que.
Period01/8/1301/8/17

Fingerprint

Buffer circuits
Logic circuits
Printed circuit boards
chips
Networks (circuits)
Electric wiring
Packaging
logic circuits
large scale integration
printed circuits
circuit boards
Radiation
Silicon
buffers
electromagnetic noise
wiring
packaging
CMOS
near fields
evaluation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Sudo, T., Nakano, K., Nakamura, A., & Haga, S. (2001). A test chip for evaluating switching noise and radiated emission by I/O and core circuits. In IEEE International Symposium on Electromagnetic Compatibility (Vol. 1, pp. 676-680)

A test chip for evaluating switching noise and radiated emission by I/O and core circuits. / Sudo, Toshio; Nakano, Ken; Nakamura, Atsushi; Haga, Satoru.

IEEE International Symposium on Electromagnetic Compatibility. Vol. 1 2001. p. 676-680.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sudo, T, Nakano, K, Nakamura, A & Haga, S 2001, A test chip for evaluating switching noise and radiated emission by I/O and core circuits. in IEEE International Symposium on Electromagnetic Compatibility. vol. 1, pp. 676-680, 2001 International Symposium on Electromagnetic Compatibility, Montrealm, Que., Canada, 01/8/13.
Sudo T, Nakano K, Nakamura A, Haga S. A test chip for evaluating switching noise and radiated emission by I/O and core circuits. In IEEE International Symposium on Electromagnetic Compatibility. Vol. 1. 2001. p. 676-680
Sudo, Toshio ; Nakano, Ken ; Nakamura, Atsushi ; Haga, Satoru. / A test chip for evaluating switching noise and radiated emission by I/O and core circuits. IEEE International Symposium on Electromagnetic Compatibility. Vol. 1 2001. pp. 676-680
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