Adhesive bonding for integrating laser diode and optical isolator

Hideki Yokoi, Isamu Myouenzono, Norihiko Ichishima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.

Original languageEnglish
Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Pages91
Number of pages1
DOIs
Publication statusPublished - 2012
Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo
Duration: 2012 May 222012 May 23

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CityTokyo
Period12/5/2212/5/23

Fingerprint

Semiconductor lasers
Adhesives

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

Cite this

Yokoi, H., Myouenzono, I., & Ichishima, N. (2012). Adhesive bonding for integrating laser diode and optical isolator. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 (pp. 91). [6238057] https://doi.org/10.1109/LTB-3D.2012.6238057

Adhesive bonding for integrating laser diode and optical isolator. / Yokoi, Hideki; Myouenzono, Isamu; Ichishima, Norihiko.

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 91 6238057.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yokoi, H, Myouenzono, I & Ichishima, N 2012, Adhesive bonding for integrating laser diode and optical isolator. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238057, pp. 91, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, 12/5/22. https://doi.org/10.1109/LTB-3D.2012.6238057
Yokoi H, Myouenzono I, Ichishima N. Adhesive bonding for integrating laser diode and optical isolator. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. p. 91. 6238057 https://doi.org/10.1109/LTB-3D.2012.6238057
Yokoi, Hideki ; Myouenzono, Isamu ; Ichishima, Norihiko. / Adhesive bonding for integrating laser diode and optical isolator. Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. pp. 91
@inproceedings{df9339130eb141a8b8777aa78500463d,
title = "Adhesive bonding for integrating laser diode and optical isolator",
abstract = "Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.",
author = "Hideki Yokoi and Isamu Myouenzono and Norihiko Ichishima",
year = "2012",
doi = "10.1109/LTB-3D.2012.6238057",
language = "English",
isbn = "9781467307420",
pages = "91",
booktitle = "Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012",

}

TY - GEN

T1 - Adhesive bonding for integrating laser diode and optical isolator

AU - Yokoi, Hideki

AU - Myouenzono, Isamu

AU - Ichishima, Norihiko

PY - 2012

Y1 - 2012

N2 - Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.

AB - Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.

UR - http://www.scopus.com/inward/record.url?scp=84864838677&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84864838677&partnerID=8YFLogxK

U2 - 10.1109/LTB-3D.2012.6238057

DO - 10.1109/LTB-3D.2012.6238057

M3 - Conference contribution

SN - 9781467307420

SP - 91

BT - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

ER -