An Interlayer Dielectric Films Formation Technology Using TEOS/O3 APCVD SiO2 Films on Dual Frequency TEOS/O2 PECVD SiO2 Films

A.Kubo A.Kubo, K.Hirose K.Hirose, T.Homma T.Homma, Y.Murao Y.Murao, Tetsuya Homma

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)94-100
JournalProceedings of 11th VLSI Multilevel Interconnection Conference
Publication statusPublished - 1994 Jun 7

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