Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

T.Nakazawa T.Nakazawa, K.Sawada K.Sawada, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)231-236
JournalIMC
Publication statusPublished - 1994 May 15

Cite this

Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -. / T.Nakazawa, T.Nakazawa; K.Sawada, K.Sawada; T.Sudo, T.Sudo; Sudo, Toshio.

In: IMC, 15.05.1994, p. 231-236.

Research output: Contribution to journalArticle

T.Nakazawa, T.Nakazawa ; K.Sawada, K.Sawada ; T.Sudo, T.Sudo ; Sudo, Toshio. / Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -. In: IMC. 1994 ; pp. 231-236.
@article{fd400da7042544d4bd5a9f29488a5a1d,
title = "Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -",
author = "T.Nakazawa T.Nakazawa and K.Sawada K.Sawada and T.Sudo T.Sudo and Toshio Sudo",
year = "1994",
month = "5",
day = "15",
language = "English",
pages = "231--236",
journal = "IMC",

}

TY - JOUR

T1 - Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

AU - T.Nakazawa, T.Nakazawa

AU - K.Sawada, K.Sawada

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1994/5/15

Y1 - 1994/5/15

M3 - Article

SP - 231

EP - 236

JO - IMC

JF - IMC

ER -