Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

T.Nakazawa T.Nakazawa, K.Sawada K.Sawada, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)231-236
JournalIMC
Publication statusPublished - 1994 May 15

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