Anti-resonance peak shift due to variation of effective package inductance

Genki Kubo, Hiroki Otsuka, Ryota Kobayashi, Wataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

Original languageEnglish
Title of host publicationEDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages229-232
Number of pages4
DOIs
Publication statusPublished - 2013
Event2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara
Duration: 2013 Dec 122013 Dec 15

Other

Other2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
CityNara
Period13/12/1213/12/15

Fingerprint

Electric power distribution
Inductance
Logic circuits
Signal interference
Electric power systems
Electromagnetic waves
Degradation

Keywords

  • anti resonance peak
  • power integrity

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kubo, G., Otsuka, H., Kobayashi, R., Ichimura, W., Kiyoshige, S., Terasaki, M., & Sudo, T. (2013). Anti-resonance peak shift due to variation of effective package inductance. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 229-232). [6724431] https://doi.org/10.1109/EDAPS.2013.6724431

Anti-resonance peak shift due to variation of effective package inductance. / Kubo, Genki; Otsuka, Hiroki; Kobayashi, Ryota; Ichimura, Wataru; Kiyoshige, Sho; Terasaki, Masahiro; Sudo, Toshio.

EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 229-232 6724431.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kubo, G, Otsuka, H, Kobayashi, R, Ichimura, W, Kiyoshige, S, Terasaki, M & Sudo, T 2013, Anti-resonance peak shift due to variation of effective package inductance. in EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium., 6724431, pp. 229-232, 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013, Nara, 13/12/12. https://doi.org/10.1109/EDAPS.2013.6724431
Kubo G, Otsuka H, Kobayashi R, Ichimura W, Kiyoshige S, Terasaki M et al. Anti-resonance peak shift due to variation of effective package inductance. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 229-232. 6724431 https://doi.org/10.1109/EDAPS.2013.6724431
Kubo, Genki ; Otsuka, Hiroki ; Kobayashi, Ryota ; Ichimura, Wataru ; Kiyoshige, Sho ; Terasaki, Masahiro ; Sudo, Toshio. / Anti-resonance peak shift due to variation of effective package inductance. EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. pp. 229-232
@inproceedings{7d0fa8f4317145429e8a32adf7e33d39,
title = "Anti-resonance peak shift due to variation of effective package inductance",
abstract = "Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.",
keywords = "anti resonance peak, power integrity",
author = "Genki Kubo and Hiroki Otsuka and Ryota Kobayashi and Wataru Ichimura and Sho Kiyoshige and Masahiro Terasaki and Toshio Sudo",
year = "2013",
doi = "10.1109/EDAPS.2013.6724431",
language = "English",
isbn = "9781479923113",
pages = "229--232",
booktitle = "EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium",

}

TY - GEN

T1 - Anti-resonance peak shift due to variation of effective package inductance

AU - Kubo, Genki

AU - Otsuka, Hiroki

AU - Kobayashi, Ryota

AU - Ichimura, Wataru

AU - Kiyoshige, Sho

AU - Terasaki, Masahiro

AU - Sudo, Toshio

PY - 2013

Y1 - 2013

N2 - Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

AB - Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

KW - anti resonance peak

KW - power integrity

UR - http://www.scopus.com/inward/record.url?scp=84894128395&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84894128395&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2013.6724431

DO - 10.1109/EDAPS.2013.6724431

M3 - Conference contribution

SN - 9781479923113

SP - 229

EP - 232

BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

ER -