Anti-resonance peak shift due to variation of effective package inductance

Genki Kubo, Hiroki Otsuka, Ryota Kobayashi, Wataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

Original languageEnglish
Title of host publicationEDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages229-232
Number of pages4
DOIs
Publication statusPublished - 2013 Dec 1
Event2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan
Duration: 2013 Dec 122013 Dec 15

Publication series

NameEDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

Conference

Conference2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
CountryJapan
CityNara
Period13/12/1213/12/15

Keywords

  • anti resonance peak
  • power integrity

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Kubo, G., Otsuka, H., Kobayashi, R., Ichimura, W., Kiyoshige, S., Terasaki, M., & Sudo, T. (2013). Anti-resonance peak shift due to variation of effective package inductance. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 229-232). [6724431] (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium). https://doi.org/10.1109/EDAPS.2013.6724431