Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process

Kazunari Suzuki, Yasuhiro Imazeki, Ki Han, Shoichi Okano, Junichiro Soejima, Yoshikazu Koike

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The influence of pattern defect on semiconductor devices by ultrasonic cavitation has been reported. The authors demonstrated single-wafer cleaning using the weveguide-type ultrasonic equipment. The cavitation bubble collapse can be suppressed and the sufficient particle removal efficiency (PRE) can be obtained in the comparison with the conventional batch-wafer ultrasonic equipment. Generation of the cavitation bubble collapse was observed using photo-resist film coated on wafer.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference (AMC)
Pages298-299
Number of pages2
Publication statusPublished - 2010
EventAdvanced Metallization Conference 2010 - Albany, NY
Duration: 2010 Oct 52010 Oct 7

Other

OtherAdvanced Metallization Conference 2010
CityAlbany, NY
Period10/10/510/10/7

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ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

Cite this

Suzuki, K., Imazeki, Y., Han, K., Okano, S., Soejima, J., & Koike, Y. (2010). Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process. In Advanced Metallization Conference (AMC) (pp. 298-299)