Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process

Kazunari Suzuki, Yasuhiro Imazeki, Ki Han, Shoichi Okano, Junichiro Soejima, Yoshikazu Koike

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The influence of pattern defect on semiconductor devices by ultrasonic cavitation has been reported. The authors demonstrated single-wafer cleaning using the weveguide-type ultrasonic equipment. The cavitation bubble collapse can be suppressed and the sufficient particle removal efficiency (PRE) can be obtained in the comparison with the conventional batch-wafer ultrasonic equipment. Generation of the cavitation bubble collapse was observed using photo-resist film coated on wafer.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference (AMC)
Pages298-299
Number of pages2
Publication statusPublished - 2010
EventAdvanced Metallization Conference 2010 - Albany, NY
Duration: 2010 Oct 52010 Oct 7

Other

OtherAdvanced Metallization Conference 2010
CityAlbany, NY
Period10/10/510/10/7

Fingerprint

Ultrasonic cleaning
Ultrasonic equipment
Cavitation
Cleaning
Waveguides
Bubbles (in fluids)
Semiconductor devices
Ultrasonics
Defects

ASJC Scopus subject areas

  • Materials Science(all)
  • Industrial and Manufacturing Engineering

Cite this

Suzuki, K., Imazeki, Y., Han, K., Okano, S., Soejima, J., & Koike, Y. (2010). Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process. In Advanced Metallization Conference (AMC) (pp. 298-299)

Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process. / Suzuki, Kazunari; Imazeki, Yasuhiro; Han, Ki; Okano, Shoichi; Soejima, Junichiro; Koike, Yoshikazu.

Advanced Metallization Conference (AMC). 2010. p. 298-299.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Suzuki, K, Imazeki, Y, Han, K, Okano, S, Soejima, J & Koike, Y 2010, Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process. in Advanced Metallization Conference (AMC). pp. 298-299, Advanced Metallization Conference 2010, Albany, NY, 10/10/5.
Suzuki K, Imazeki Y, Han K, Okano S, Soejima J, Koike Y. Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process. In Advanced Metallization Conference (AMC). 2010. p. 298-299
Suzuki, Kazunari ; Imazeki, Yasuhiro ; Han, Ki ; Okano, Shoichi ; Soejima, Junichiro ; Koike, Yoshikazu. / Application of novel ultrasonic cleaning equipment using waveguide mode for single-wafer cleaning process. Advanced Metallization Conference (AMC). 2010. pp. 298-299
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