Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma, Misaki Owada, Takumi Abe, Tsutomu Nakada, Makoto Kubota, Kazuyoshi Ueno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

Original languageEnglish
Title of host publication2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages270-272
Number of pages3
Volume2017-June
ISBN (Electronic)9781509046591
DOIs
Publication statusPublished - 2017 Jun 13
Event2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan
Duration: 2017 Feb 282017 Mar 2

Other

Other2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
CountryJapan
CityToyama
Period17/2/2817/3/2

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Keywords

  • Bump
  • Cu pillar
  • EM
  • Reliability
  • Solder

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M., & Ueno, K. (2017). Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (Vol. 2017-June, pp. 270-272). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.8000256