Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach

Yoshiharu Kariya, Tomoo Morihata, Eisaku Hazawa, Masahisa Otsuka

Research output: Contribution to journalArticle

40 Citations (Scopus)

Abstract

The fatigue lives and damage mechanisms of Sn-Ag-X (X = Bi and Cu) solder alloys under creep-fatigue interaction mode have been investigated, and the adaptability of the strain partitioning approach to the creep-fatigue of these alloys was examined. Symmetrical and asymmetrical saw-tooth strain profiles components (i.e., fast-fast, fast-slow, slow-fast and slow-slow) were employed. Application of the slow-slow strain mode did not have an effect on fatigue lives of the alloys under investigation. Transgranular fracture observed on the fracture surfaces suggests that creep damage might be cancelled under slow-slow mode. The fatigue lives of all alloys were dramatically reduced under slow-fast mode, which is attributed to intergranular cavitation and fracture during tensile creep flow. On the other hand, the compression creep component generated by fast-slow mode also significantly reduced the life of Sn-3.5Ag and Sn-3.5Ag-1Cu, while the component did not affect the life of Sn-3.5Ag-xBi (x =2 and 5). The four partitioned strain ranges (i.e., Δεpp, Δεpc, Δεcp, and Δεcc) versus life relationships were established in all alloys tested. Thus, it is confirmed that the creep-fatigue life of these alloys can be quantitatively predicted by the strain partitioning approach for any type of inelastic strain cycling.

Original languageEnglish
Pages (from-to)1184-1189
Number of pages6
JournalJournal of Electronic Materials
Volume30
Issue number9
Publication statusPublished - 2001 Sep
Externally publishedYes

Fingerprint

fatigue life
Creep
Fatigue of materials
cycles
tensile creep
damage
Fatigue damage
teeth
solders
cavitation flow
Cavitation
Soldering alloys
profiles
interactions

Keywords

  • Coffin-Manson plots
  • Creep-fatigue interactions
  • Strain range partitioning

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)

Cite this

Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach. / Kariya, Yoshiharu; Morihata, Tomoo; Hazawa, Eisaku; Otsuka, Masahisa.

In: Journal of Electronic Materials, Vol. 30, No. 9, 09.2001, p. 1184-1189.

Research output: Contribution to journalArticle

@article{7b03f7920d3846849ceeb05beb425776,
title = "Assessment of low-cycle fatigue life of Sn-3.5mass{\%}Ag-X (X = Bi or Cu) alloy by strain range partitioning approach",
abstract = "The fatigue lives and damage mechanisms of Sn-Ag-X (X = Bi and Cu) solder alloys under creep-fatigue interaction mode have been investigated, and the adaptability of the strain partitioning approach to the creep-fatigue of these alloys was examined. Symmetrical and asymmetrical saw-tooth strain profiles components (i.e., fast-fast, fast-slow, slow-fast and slow-slow) were employed. Application of the slow-slow strain mode did not have an effect on fatigue lives of the alloys under investigation. Transgranular fracture observed on the fracture surfaces suggests that creep damage might be cancelled under slow-slow mode. The fatigue lives of all alloys were dramatically reduced under slow-fast mode, which is attributed to intergranular cavitation and fracture during tensile creep flow. On the other hand, the compression creep component generated by fast-slow mode also significantly reduced the life of Sn-3.5Ag and Sn-3.5Ag-1Cu, while the component did not affect the life of Sn-3.5Ag-xBi (x =2 and 5). The four partitioned strain ranges (i.e., Δεpp, Δεpc, Δεcp, and Δεcc) versus life relationships were established in all alloys tested. Thus, it is confirmed that the creep-fatigue life of these alloys can be quantitatively predicted by the strain partitioning approach for any type of inelastic strain cycling.",
keywords = "Coffin-Manson plots, Creep-fatigue interactions, Strain range partitioning",
author = "Yoshiharu Kariya and Tomoo Morihata and Eisaku Hazawa and Masahisa Otsuka",
year = "2001",
month = "9",
language = "English",
volume = "30",
pages = "1184--1189",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "9",

}

TY - JOUR

T1 - Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X = Bi or Cu) alloy by strain range partitioning approach

AU - Kariya, Yoshiharu

AU - Morihata, Tomoo

AU - Hazawa, Eisaku

AU - Otsuka, Masahisa

PY - 2001/9

Y1 - 2001/9

N2 - The fatigue lives and damage mechanisms of Sn-Ag-X (X = Bi and Cu) solder alloys under creep-fatigue interaction mode have been investigated, and the adaptability of the strain partitioning approach to the creep-fatigue of these alloys was examined. Symmetrical and asymmetrical saw-tooth strain profiles components (i.e., fast-fast, fast-slow, slow-fast and slow-slow) were employed. Application of the slow-slow strain mode did not have an effect on fatigue lives of the alloys under investigation. Transgranular fracture observed on the fracture surfaces suggests that creep damage might be cancelled under slow-slow mode. The fatigue lives of all alloys were dramatically reduced under slow-fast mode, which is attributed to intergranular cavitation and fracture during tensile creep flow. On the other hand, the compression creep component generated by fast-slow mode also significantly reduced the life of Sn-3.5Ag and Sn-3.5Ag-1Cu, while the component did not affect the life of Sn-3.5Ag-xBi (x =2 and 5). The four partitioned strain ranges (i.e., Δεpp, Δεpc, Δεcp, and Δεcc) versus life relationships were established in all alloys tested. Thus, it is confirmed that the creep-fatigue life of these alloys can be quantitatively predicted by the strain partitioning approach for any type of inelastic strain cycling.

AB - The fatigue lives and damage mechanisms of Sn-Ag-X (X = Bi and Cu) solder alloys under creep-fatigue interaction mode have been investigated, and the adaptability of the strain partitioning approach to the creep-fatigue of these alloys was examined. Symmetrical and asymmetrical saw-tooth strain profiles components (i.e., fast-fast, fast-slow, slow-fast and slow-slow) were employed. Application of the slow-slow strain mode did not have an effect on fatigue lives of the alloys under investigation. Transgranular fracture observed on the fracture surfaces suggests that creep damage might be cancelled under slow-slow mode. The fatigue lives of all alloys were dramatically reduced under slow-fast mode, which is attributed to intergranular cavitation and fracture during tensile creep flow. On the other hand, the compression creep component generated by fast-slow mode also significantly reduced the life of Sn-3.5Ag and Sn-3.5Ag-1Cu, while the component did not affect the life of Sn-3.5Ag-xBi (x =2 and 5). The four partitioned strain ranges (i.e., Δεpp, Δεpc, Δεcp, and Δεcc) versus life relationships were established in all alloys tested. Thus, it is confirmed that the creep-fatigue life of these alloys can be quantitatively predicted by the strain partitioning approach for any type of inelastic strain cycling.

KW - Coffin-Manson plots

KW - Creep-fatigue interactions

KW - Strain range partitioning

UR - http://www.scopus.com/inward/record.url?scp=0035455438&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035455438&partnerID=8YFLogxK

M3 - Article

VL - 30

SP - 1184

EP - 1189

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 9

ER -