Abstract
An asymmetric LDD sidewall spacer technology is presented which gives a high drivability of LDD MOSFET without sacrificing hot carrier immunity. The asymmetric spacer is fabricated by using a selective oxide deposition technique. The process implemented in a CMOS fabrication sequence requires no additional masking step. The fact that no reliability problems are introduced in the transistor characteristics by the selective oxide deposition process is also examined.
Original language | English |
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Pages (from-to) | 186-190 |
Number of pages | 5 |
Journal | IEEE Transactions on Electron Devices |
Volume | 41 |
Issue number | 2 |
DOIs | |
Publication status | Published - 1994 Feb 1 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering