Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2017, ISOCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages152-154
Number of pages3
ISBN (Electronic)9781538622858
DOIs
Publication statusPublished - 2018 May 29
Event14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
Duration: 2017 Nov 52017 Nov 8

Publication series

NameProceedings - International SoC Design Conference 2017, ISOCC 2017

Other

Other14th International SoC Design Conference, ISOCC 2017
CountryKorea, Republic of
CitySeoul
Period17/11/517/11/8

Keywords

  • Building block computing systems
  • System-in-a Package
  • Wireless inductive coupling

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H., & Namiki, M. (2018). Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 152-154). (Proceedings - International SoC Design Conference 2017, ISOCC 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368842