Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2017, ISOCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages152-154
Number of pages3
ISBN (Electronic)9781538622858
DOIs
Publication statusPublished - 2018 May 29
Externally publishedYes
Event14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
Duration: 2017 Nov 52017 Nov 8

Other

Other14th International SoC Design Conference, ISOCC 2017
CountryKorea, Republic of
CitySeoul
Period17/11/517/11/8

Fingerprint

Computer operating systems
Network architecture
Interfaces (computer)
Networks (circuits)
Hot Temperature

Keywords

  • Building block computing systems
  • System-in-a Package
  • Wireless inductive coupling

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H., & Namiki, M. (2018). Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 152-154). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368842

Building block multi-chip systems using inductive coupling through chip interface. / Amano, Hideharu; Kuroda, Tadahiro; Nakamura, Hiroshi; Usami, Kimiyoshi; Kondo, Masaaki; Matsutani, Hiroki; Namiki, Mitaro.

Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 152-154.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amano, H, Kuroda, T, Nakamura, H, Usami, K, Kondo, M, Matsutani, H & Namiki, M 2018, Building block multi-chip systems using inductive coupling through chip interface. in Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 152-154, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368842
Amano H, Kuroda T, Nakamura H, Usami K, Kondo M, Matsutani H et al. Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 152-154 https://doi.org/10.1109/ISOCC.2017.8368842
Amano, Hideharu ; Kuroda, Tadahiro ; Nakamura, Hiroshi ; Usami, Kimiyoshi ; Kondo, Masaaki ; Matsutani, Hiroki ; Namiki, Mitaro. / Building block multi-chip systems using inductive coupling through chip interface. Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 152-154
@inproceedings{d0357c6c1dc647d4b07d4ebf3911a477,
title = "Building block multi-chip systems using inductive coupling through chip interface",
abstract = "A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.",
keywords = "Building block computing systems, System-in-a Package, Wireless inductive coupling",
author = "Hideharu Amano and Tadahiro Kuroda and Hiroshi Nakamura and Kimiyoshi Usami and Masaaki Kondo and Hiroki Matsutani and Mitaro Namiki",
year = "2018",
month = "5",
day = "29",
doi = "10.1109/ISOCC.2017.8368842",
language = "English",
pages = "152--154",
booktitle = "Proceedings - International SoC Design Conference 2017, ISOCC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Building block multi-chip systems using inductive coupling through chip interface

AU - Amano, Hideharu

AU - Kuroda, Tadahiro

AU - Nakamura, Hiroshi

AU - Usami, Kimiyoshi

AU - Kondo, Masaaki

AU - Matsutani, Hiroki

AU - Namiki, Mitaro

PY - 2018/5/29

Y1 - 2018/5/29

N2 - A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

AB - A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

KW - Building block computing systems

KW - System-in-a Package

KW - Wireless inductive coupling

UR - http://www.scopus.com/inward/record.url?scp=85048873655&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85048873655&partnerID=8YFLogxK

U2 - 10.1109/ISOCC.2017.8368842

DO - 10.1109/ISOCC.2017.8368842

M3 - Conference contribution

AN - SCOPUS:85048873655

SP - 152

EP - 154

BT - Proceedings - International SoC Design Conference 2017, ISOCC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -