Abstract
This paper reports a test chip and an experimental method for characterizing the simultaneous switching noise (SSN) and the noise dependency on the ground pin assignment of a multilayer package. The SSN measurement was executed for various ground pin assignments. The measured results demonstrated that an extra electric current path of the displaced ground pin assignment enhanced the ground bounce due to increasing the effective inductance of package. A balanced pin assignment of the ground pins which suppressed the extra current path in the ground plane had a 20% reduction effect for SSN compared with conventional pin assignments. The extra current path of the ground plane was also verified by an electromagnetic field simulation. The modeling procedure was established for the noise estimation using the inductance value estimated by the field simulation. The circuit simulation resulted in a good agreement with the measured results, and the noise simulation method was applicable for the noise estimation at earlier stage of the package design.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - Electronic Components and Technology Conference |
| Place of Publication | Piscataway, NJ, United States |
| Publisher | Publ by IEEE |
| Pages | 949-956 |
| Number of pages | 8 |
| ISBN (Print) | 0780309154 |
| Publication status | Published - 1994 |
| Event | Proceedings of the 1994 IEEE 44th Electronic Components & Technology Conference - Washington, DC, USA Duration: 1994 May 1 → 1994 May 4 |
Other
| Other | Proceedings of the 1994 IEEE 44th Electronic Components & Technology Conference |
|---|---|
| City | Washington, DC, USA |
| Period | 94/5/1 → 94/5/4 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Characterization and reduction of simultaneous switching noise for a multilayer package. / Hirano, Naohiko; Miura, Masayuki; Hiruta, Yoichi; Sudo, Toshio.
Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States : Publ by IEEE, 1994. p. 949-956.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Characterization and reduction of simultaneous switching noise for a multilayer package
AU - Hirano, Naohiko
AU - Miura, Masayuki
AU - Hiruta, Yoichi
AU - Sudo, Toshio
PY - 1994
Y1 - 1994
N2 - This paper reports a test chip and an experimental method for characterizing the simultaneous switching noise (SSN) and the noise dependency on the ground pin assignment of a multilayer package. The SSN measurement was executed for various ground pin assignments. The measured results demonstrated that an extra electric current path of the displaced ground pin assignment enhanced the ground bounce due to increasing the effective inductance of package. A balanced pin assignment of the ground pins which suppressed the extra current path in the ground plane had a 20% reduction effect for SSN compared with conventional pin assignments. The extra current path of the ground plane was also verified by an electromagnetic field simulation. The modeling procedure was established for the noise estimation using the inductance value estimated by the field simulation. The circuit simulation resulted in a good agreement with the measured results, and the noise simulation method was applicable for the noise estimation at earlier stage of the package design.
AB - This paper reports a test chip and an experimental method for characterizing the simultaneous switching noise (SSN) and the noise dependency on the ground pin assignment of a multilayer package. The SSN measurement was executed for various ground pin assignments. The measured results demonstrated that an extra electric current path of the displaced ground pin assignment enhanced the ground bounce due to increasing the effective inductance of package. A balanced pin assignment of the ground pins which suppressed the extra current path in the ground plane had a 20% reduction effect for SSN compared with conventional pin assignments. The extra current path of the ground plane was also verified by an electromagnetic field simulation. The modeling procedure was established for the noise estimation using the inductance value estimated by the field simulation. The circuit simulation resulted in a good agreement with the measured results, and the noise simulation method was applicable for the noise estimation at earlier stage of the package design.
UR - http://www.scopus.com/inward/record.url?scp=0028074156&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0028074156&partnerID=8YFLogxK
M3 - Conference contribution
SN - 0780309154
SP - 949
EP - 956
BT - Proceedings - Electronic Components and Technology Conference
PB - Publ by IEEE
CY - Piscataway, NJ, United States
ER -