Characterization and reduction of simultaneous switching noise for a multilayer package

Naohiko Hirano, Masayuki Miura, Yoichi Hiruta, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

This paper reports a test chip and an experimental method for characterizing the simultaneous switching noise (SSN) and the noise dependency on the ground pin assignment of a multilayer package. The SSN measurement was executed for various ground pin assignments. The measured results demonstrated that an extra electric current path of the displaced ground pin assignment enhanced the ground bounce due to increasing the effective inductance of package. A balanced pin assignment of the ground pins which suppressed the extra current path in the ground plane had a 20% reduction effect for SSN compared with conventional pin assignments. The extra current path of the ground plane was also verified by an electromagnetic field simulation. The modeling procedure was established for the noise estimation using the inductance value estimated by the field simulation. The circuit simulation resulted in a good agreement with the measured results, and the noise simulation method was applicable for the noise estimation at earlier stage of the package design.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages949-956
Number of pages8
ISBN (Print)0780309154
Publication statusPublished - 1994
EventProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference - Washington, DC, USA
Duration: 1994 May 11994 May 4

Other

OtherProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference
CityWashington, DC, USA
Period94/5/194/5/4

Fingerprint

Multilayers
Inductance
Circuit simulation
Electric currents
Electromagnetic fields

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Hirano, N., Miura, M., Hiruta, Y., & Sudo, T. (1994). Characterization and reduction of simultaneous switching noise for a multilayer package. In Proceedings - Electronic Components and Technology Conference (pp. 949-956). Piscataway, NJ, United States: Publ by IEEE.

Characterization and reduction of simultaneous switching noise for a multilayer package. / Hirano, Naohiko; Miura, Masayuki; Hiruta, Yoichi; Sudo, Toshio.

Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States : Publ by IEEE, 1994. p. 949-956.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hirano, N, Miura, M, Hiruta, Y & Sudo, T 1994, Characterization and reduction of simultaneous switching noise for a multilayer package. in Proceedings - Electronic Components and Technology Conference. Publ by IEEE, Piscataway, NJ, United States, pp. 949-956, Proceedings of the 1994 IEEE 44th Electronic Components & Technology Conference, Washington, DC, USA, 94/5/1.
Hirano N, Miura M, Hiruta Y, Sudo T. Characterization and reduction of simultaneous switching noise for a multilayer package. In Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States: Publ by IEEE. 1994. p. 949-956
Hirano, Naohiko ; Miura, Masayuki ; Hiruta, Yoichi ; Sudo, Toshio. / Characterization and reduction of simultaneous switching noise for a multilayer package. Proceedings - Electronic Components and Technology Conference. Piscataway, NJ, United States : Publ by IEEE, 1994. pp. 949-956
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